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IEEE Transaction on Components, Packaging, and Manufacturing Technology Part C:
Manufacturing
APRIL 1996, Volume 19, Issue 2
-
EDITORIAL
-
W. J. Trybula
REGULAR PAPERS
- A Generic IDEF0 Model of Quality Assurance
Information Systems for the
Design-to-Order Manufacturing
Environment
- A.
S. Nookabadi and J. E. Middle
-
Thermal Preprocessing to Shorten Flows, Simplify
Lithography, and
Radically Reduce Processing Cycle
Time
- T. D.
Stanley
- Developing Reusable Modeling Capabilities for Simulating
High Volume
Electronics Manufacturing
Systems
- P.
A. Farrington, J. J. Swain, J. L. Evans, and J. S.
Rogers
Processing and Modeling
- Designing Response Surface Model-Based Run-by-Run
Controllers: A Worst
Case
Approach
- J.
S. Baras and N. S. Patel
- Yield
Enhancement of a 16.6 cm2 Monolithic Large-Area
Integrated Multiprocessor System Using Laser
Reconfiguration
- H.-U. Schröder,
J. Otterstedt, and T. Hillmann-Ruge
- Diffusion Model to Derate Moisture Sensitive Surface Mount
IC's for
Factory Use
Conditions
- R.
L. Shook, T. R. Conrad, V. S. Sastry, and D. B.
Steele
Devices and Assemblies
- Reactions of High Lead Solders with
BIOACT® EC-7Rtm Semi-Aqueous Cleaning
Reagents
- C.
P. Wong, W. O. Gillum, R. A. Walters, P. J. Sakach, D. Powell,
and B. Bivins
- Underfill Flow as Viscous Flow Between Parallel Plates
Driven by
Capillary
Action
- M.
K. Schwiebert and W. H. Leong
- Electrical Failure of Multilayer Ceramic Capacitors
Subjected to
Environmental Screening
Testing
- Y.
C. Chan and F. Yeung
BOOK REVIEWS
- Frontiers of Electronic
Commerce--R. Kalakota and A. B.
Whinston
- Reviewed by W. J.
Trybula
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