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IEEE Transaction on Components, Packaging, and Manufacturing Technology Part C: Manufacturing

APRIL 1996, Volume 19, Issue 2


EDITORIAL
W. J. Trybula


REGULAR PAPERS

A Generic IDEF0 Model of Quality Assurance Information Systems for the Design-to-Order Manufacturing Environment
A. S. Nookabadi and J. E. Middle
Thermal Preprocessing to Shorten Flows, Simplify Lithography, and Radically Reduce Processing Cycle Time
T. D. Stanley
Developing Reusable Modeling Capabilities for Simulating High Volume Electronics Manufacturing Systems
P. A. Farrington, J. J. Swain, J. L. Evans, and J. S. Rogers

Processing and Modeling

Designing Response Surface Model-Based Run-by-Run Controllers: A Worst Case Approach
J. S. Baras and N. S. Patel
Yield Enhancement of a 16.6 cm2 Monolithic Large-Area Integrated Multiprocessor System Using Laser Reconfiguration
H.-U. Schröder, J. Otterstedt, and T. Hillmann-Ruge
Diffusion Model to Derate Moisture Sensitive Surface Mount IC's for Factory Use Conditions
R. L. Shook, T. R. Conrad, V. S. Sastry, and D. B. Steele

Devices and Assemblies

Reactions of High Lead Solders with BIOACT® EC-7Rtm Semi-Aqueous Cleaning Reagents
C. P. Wong, W. O. Gillum, R. A. Walters, P. J. Sakach, D. Powell, and B. Bivins
Underfill Flow as Viscous Flow Between Parallel Plates Driven by Capillary Action
M. K. Schwiebert and W. H. Leong
Electrical Failure of Multilayer Ceramic Capacitors Subjected to Environmental Screening Testing
Y. C. Chan and F. Yeung
BOOK REVIEWS
Frontiers of Electronic Commerce--R. Kalakota and A. B. Whinston
Reviewed by W. J. Trybula

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