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IEEE Transaction on Components, Packaging, and Manufacturing Technology Part C: Manufacturing

July 1996, Volume 19, Issue 03


CONTRIBUTIONS FROM THE 17th EOS/ESD SYMPOSIUM

FOREWORD
C. Duvvury

[p. 149]

Novel Clamp Circuits for IC Power Supply Protection
T. J. Maloney and S. Dabral

[p. 150]

ESD Evaluation Methods for Charged Device Models
T. Wada

[p. 162]

Advanced CMOS Protection Device Trigger Mechanisms During CDM
C. Duvvury and A. Amerasekera

[p. 169]

Numerical Calculation and Measurement of Transient Fields from Electrostatic Discharges
R. Zaridze, D. Karkashadze, R. G. Djobava, D. Pommerenke, and M. Aidam

[p. 178]


REGULAR PAPERS

Area Bonding Conductive Epoxy Adhesives for Low-Cost Grid Array Chip Carriers
J. C. Bolger and J. M. Czarnowski

[p. 184]

A Design for Assembly Evaluation Methodology for Photonic Systems
S. Leclerc and G. Subbarayan

[p. 189]

Excimer Laser Projection Micromachining of Polyimide Thin Films Annealed at Different Temperatures
X. Zhang, C. P. Grigoropoulos, D. J. Krajnovich, and A. C. Tam

[p. 201]

A Fast and Accurate Method for Measuring the Dielectric Constant of Printed Wiring Board Materials
N. G. Paulter

[p. 214]


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