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IEEE Transaction on Components, Packaging, and Manufacturing Technology Part C:
Manufacturing
July 1996, Volume 19, Issue 03
CONTRIBUTIONS FROM THE 17th EOS/ESD SYMPOSIUM
- FOREWORD
- C.
Duvvury
[p. 149]
- Novel Clamp Circuits for IC
Power Supply Protection
- T. J. Maloney
and S. Dabral
[p. 150]
- ESD Evaluation Methods for Charged Device
Models
- T.
Wada
[p. 162]
- Advanced CMOS Protection Device Trigger Mechanisms During
CDM
- C. Duvvury and A.
Amerasekera
[p. 169]
- Numerical Calculation and Measurement of Transient Fields
from
Electrostatic
Discharges
- R.
Zaridze, D. Karkashadze, R. G. Djobava, D. Pommerenke, and M.
Aidam
[p. 178]
REGULAR PAPERS
- Area Bonding Conductive Epoxy Adhesives for Low-Cost Grid
Array Chip
Carriers
- J.
C. Bolger and J. M. Czarnowski
[p. 184]
- A Design for Assembly Evaluation Methodology for Photonic
Systems
- S. Leclerc and G.
Subbarayan
[p. 189]
- Excimer Laser Projection Micromachining of Polyimide Thin
Films Annealed
at Different
Temperatures
- X.
Zhang, C. P. Grigoropoulos, D. J. Krajnovich, and A.
C. Tam
[p. 201]
- A Fast and Accurate Method for Measuring the Dielectric
Constant of Printed Wiring Board
Materials
- N.
G. Paulter
[p. 214]
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