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IEEE Transaction on Components, Packaging, and Manufacturing Technology Part C:
Manufacturing
October 1996, Volume 19, Number 04
- Editorial
- W. J.
Trybula
[p. 229]
CONTRIBUTIONS FROM THE SECOND "ADHESIVES '96" INTERNATIONAL CONFERENCE
- Foreword
- J. E.
Morris
[p. 230]
- Mechanical Failure in COB-Technology Using Glob-Top
Encapsulation
- R. Dudek, D. Vogel, and
B. Michel
[p. 232]
- Electrically Conductive Adhesives for Surface Mount
Solder
Replacement
- M.
Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S.
McCarthy, T. Hanlon, P. Arrowsmith, A. Chaudhuri,
R. Hermansen, S. Lau, and D.
Napp
[p. 241]
- Process Induced Residual Stresses in Isotropically
Conductive Adhesive
Joints
- S. X. Wu, Y. Mei,
C.-p. Yeh, and K. Wyatt
[p. 251]
- Assembly of Planar Array Components
Using Anisotropic Conducting
Adhesives--A Benchmark Study: Part I --
Experiment
- A. O. Ogunjimi, S. H.
Mannan, D. Whalley, and D. J.
Williams
[p. 257]
- Assembly of Planar Array Components Using Anisotropic
Conducting
Adhesives--A Benchmark Study: Part II --
Theory
- S. H. Mannan, D. C. Whalley, A.
O. Ogunjimi, and D.
J. Williams
[p. 264]
REGULAR PAPERS
- FCOB Reliability Evaluation Simulating Multiple
Rework/Reflow Processes
- W.
Chen
[p. 270]
- Lasersonic Bonding of Tab Components to Epoxy-Glass
Circuit
Boards
- K.
A. Vanderlee, R. B. Porter, R. W. Kulterman, and P. A.
Chalco
[p. 277]
- A Robust Metric for Measuring Within-Wafer
Uniformity
- J.
C. Davis, R. S. Gyurcsik, J.-C. Lu, and J. M.
Hughes-Oliver
[p. 283]
- Use of Neural Networks in Modeling Relations Between
Exposure Energy and
Pattern Dimension in Photolithography
Process
- G. Cardarelli, M. Palumbo, and
P. M. Pelagagge
[p. 290]
- Surface Insulation Resistance Methodology for Today's
Manufacturing
Technology
- H. A.
Chan
[p. 300]
- Run by Run Control of Chemical-Mechanical
Polishing
- D.
S. Boning, W. P. Moyne, T. H. Smith,
J. Moyne, R. Telfeyan, A. Hurwitz, S. Shellman, and J.
Taylor
[p. 307]
- Effect of Polyimide Processing on Multichip Glass Ceramic
Module
Fabrications
- D.-Y.
Shih
[p. 315]
- 1996 INDEX
- Follows page
[p. 325]
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