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IEEE Transaction on Components, Packaging, and Manufacturing Technology Part C:
Manufacturing
January 1997, Volume 20, Number 1
- Editorial
- W. J.
Trybula
[p. 1]
SPECIAL SECTION ON MECHATRONICS
- Foreword--Mechatronics
- T.-R.
Hsu
[p. 2]
- Mechatronics--An
Overview
- T.-R.
Hsu
[p. 4]
- Case Studies on Design of Mechatronic
Products
- B. Furman, D. Pinkernell, and
S. Elgee
[p. 8]
- Mechatronics Challenge for the Higher Education
World
- M.
Acar
[p. 14]
- Mechatronics in Storage
Technology
- R.
Kant
[p. 21]
- Micromechatronics and the Miniaturization of Structures,
Devices, and
Systems
- C.
R. Friedrich, J. Fang, and R. O.
Warrington
[p. 31]
REGULAR PAPERS
- Real-Time Diagnosis of Semiconductor Manufacturing
Equipment Using a Hybrid Neural Network Expert
System
- B.
Kim and G. S. May
[p. 39]
- Design of Modular Digital Circuits for
Testability
- A. Kusiak and C.-C.
Huang
[p. 48]
- Design for Semiconductor
Manufacturing--Perspective
- K. P.
White, Jr., W. J. Trybula, and R. N.
Athay
[p. 58]
- Design for Semiconductor
Manufacturing--Bibliography
- K. P.
White, Jr., W. J. Trybula, and R. N.
Athay
[p. 73]
- Call for Abstracts
[p. 87]
- IEEE Copyright Form
[p. 91]
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