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April 1997, Volume 20, Number 02

Editorial

W. J. Trybula

[p. 93]

REGULAR PAPERS

Flip Chip Attachment Using Anisotropic Conductive Adhesives and Electroless Nickel Bumps

R. Aschenbrenner, A. Ostmann, G. Motulla, E. Zakel, and H. Reichl

[p. 95]

A Stair-Like CIM System Architecture

Y. Chen and M. M. Tseng

[p. 101]

Intelligent X-Ray Inspection for Quality Control of Solder Joints

C. Neubauer

[p. 111]

A Self-Tuning EWMA Controller Utilizing Artificial Neural Network Function Approximation Techniques

T. H. Smith and D. S. Boning

[p. 121]

Yield Learning in Integrated Circuit Package Assembly

S. Balasubramaniam, A. K. Sarwar, and D. M. H. Walker

[p. 133]

Technology and Change in the Chinese Electronics Industry

K. J. Tilley and D. J. Williams

[p. 142]

Alternative Facility Layouts for Semiconductor Wafer Fabrication Facilities

C. D. Geiger, R. Hase, C. G. Takoudis, and R. Uzsoy

[p. 152]

Automatic Classification of Wafer Defects: Status and Industry Needs

A. Shapiro

[p. 164]