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July 1997, Volume 20, Number 03

CONTRIBUTIONS from the First International Conference on Electronic Assembly

Foreword

L. J. Turbini

[p. 173]

Solder Paste Print Qualification Using Laser Triangulation

R. R. Lathrop, Jr.

[p. 174]

The Development of Reflowable Materials Systems to Integrate the Reflow and Underfill Dispensing Processes for DCA/FCOB Assembly

D. R. Gamota and C. M. Melton

[p. 183]

Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads

M. E. Ferguson, C. D. Fieselman, and M. A. Elkins

[p. 188]

Development and Validation of a Lead-Free Alloy for Solder Paste Applications

T. Laine-Ylijoki, H. Steen, and A. Forsten

[p. 194]

REGULAR PAPERS

Reactive Ion Etching of Benzocyclobutene Polymer Films

P. B. Chinoy

[p. 199]

In-Situ Measurements of Surface Mount IC Package Deformations During Reflow Soldering

M. G. Pecht and a. Govind

[p. 207]

Metallurgical Considerations for Accelerated Testing of Soft Solder Joints

G. Grossmann and L. Weber

[p. 213]

Effect of Copper Lamination on the Rheological and Copper Adhesion Properties of a Thermotropic Liquid Crystalline Polymer Used in PCB Applications

C. G. L. Khoo, B. Brox, R. Norrhede, and F. H. J. Maurer

[p. 219]

Automated Removal and Replacement of Surface Mounted Devices in Electronic Assembly

N. Geren

[p. 227]

Automated Removal and Replacement of Through-Hole Components in Robotic Rework

N. Geren and E. K. Lo

[p. 236]