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October 1997, Volume 20, Number 04

SPECIAL ISSUE ON THE LATEST ADVANCES IN IC MANUFACTURING IN ASIA

Foreword

A. J. C. Trappey and H.-M. Tong

[p. 229]

SPECIAL ISSUE PAPERS

Industry's Current Status and Future Direction

An Assessment of the Electronics Industry in Southeast Asia

K. J. Tilley and D. J. Williams

[p. 230]

The Development of Taiwan's Integrated Circuit Industry

M. M. K. Lin and C. V. Trappey

[p. 235]

Integrated Circuit Packaging Industry in Taiwan

C.-L. Lo and L.-R. Tung

[p. 243]

Production Planning and Control Methodology

A Scheduling System for IC Packaging Industry Using STEP Enabling Technology

T.-H. Liu, A. J. C. Trappey, and F.-W. Chan

[p. 256]

A Dispatching Scheme Involving Move Control and Weighted Due Date for Wafer Foundries

C.-E. Lee and C.-W. Chen

[p. 268]

The Design of Due Date Assignment Model and the Determination of Flow Time Control Parameters for the Wafer Fabrication Factories

S.-H. Chung, M.-H. Yang, and C.-M. Cheng

[p. 278]

Using a Neural Network-Based Approach to Predict the Wafer Yield in Integrated Circuit Manufacturing

L.-I. Tong, W.-I. Lee, and C.-T. Su

[p. 288]

REGULAR PAPERS

Equipment Fault Detection Using Spatial Signatures

M. M. Gardner, J.-C. Lu, R. S. Gyurcsik, J. J. Wortman, B. E. Hornung, H. H. Heinisch, E. A. Rying, S. Rao, J. C. Davis, and P. K. Mozumder

[p. 295]

Gas Flow Effects on Precision Solder Self-Alignment

B. Su, M. Gershovich, and Y. C. Lee

[p. 305]

Designing Process Tolerances to Minimize Loss of Nonconforming Parts

C.-C. Wei

[p. 312]

Investigation of Electronic Assembly Design Alternatives through Production Modeling of Life Cycle Impacts, Costs, and Yield

J. A. Stuart, L. J. Turbini, and J. C. Ammons

[p. 317]

Flip Chip Bonding Technique Using Transferred Microsolder Bumps

H. Tsunetsugu, T. Hayashi, M. Hosoya, K. Katsura, M. Hirano, and Y. Imai

[p. 327]

Sequential Processing Mechanics Modeling for a Model IC Package

J. Wang and S. Liu

[p. 335]

The Development of Repairable Au-Al Solid Phase Diffusion Flip-Chip Bonding

A. Iida, Y. Kizaki, Y. Fukuda, and M. Mori

[p. 343]

ANNOUNCEMENTS

Call for Papers--Joint Conference of The Fifth International Conference on Automation Technology and The 1998 International Conference of Production Research (Asia Meeting)

[p. 350]