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IEEE Transaction on Components, Packaging, and Manufacturing Technology Part C:
Manufacturing
January 1998, Volume 21, Number 01
- Editorial
- W.
J. Trybula
[p. 1]
- Abstracts
[p. 2]
REGULAR PAPERS
- Manufacturing Products with End-of-Life
Considerations: An Economic Assessment to the Routes of Revenue
Generation From Mature
Products
- M.
K. Low, D. J. Williams, and C. Dixon
[p. 4]
- Fabrication of Two-Dimensional Fiber Arrays Using
Microferrules
- K.
Koyabu, F. Ohira, and T. Yamamoto
[p. 11]
- Development of Ba-Ti-B Glass-Ceramic Thick-Film Capacitors
by Sol-Gel Technology
- K. Yao, W. Zhu, and X.
Yao
[p. 20]
- Surface Micromachined Solenoid Inductors for High
Frequency
Applications
- Y.-J.
Kim and M. G. Allen
[p. 26]
- Nonhermetic Plastic Packaging of High Voltage Electronic
Switches Utilizing a Low-Stress Glob Coating for 95/5Pb/Sn Solder Joints
of Flip-Chip Bonded Multichip Module High Voltage
Devices
- C. P. Wong, J. M.
Segelken, K. L. Tai, and C. C. Wong
[p. 34]
- Fine Pitch Stencil Printing of Sn/Pb and Lead Free Solders
for Flip Chip Technology
- J. Kloeser, K.
Heinricht, K. Kutzner, E. Jung, A. Ostmann, and H.
Reichl
[p. 41]
- A New Approach to Chip Size
Package Using Meniscus Soldering and
FPC-Bonding
- C. Kallmayer, E. Jung,
P. Kasulke, R. Azadeh, G. Azdasht, E. Zakel, and H.
Reichl
[p. 51]
- Materials to Integrate the Solder
Reflow and Underfill Encapsulation Processes for Flip Chip on Board
Assembly
- D. Gamota and C.
Melton
[p. 57]
- Modeling Component Placement Errors in Surface Mount
Technology Using Neural
Networks
- G.
S. May, H. C. Forbes, N. Hussain, and A.
Louis-Charles
[p. 66]
- Integration Steps of a
Fully-Automated Remanufacturing Cell System for Fine-Pitch Surface
Mounted Devices
- I. Fidan, R. P. Kraft,
L. E. Ruff, and S. J. Derby
[p. 71]
ANNOUNCEMENTS
- Workshop Notice--Commercial Component Technology
Insertion Workshop Series
[p. 79]
- IEEE Copyright
Form
[p. 83]
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