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April 1998, Volume 21, Number 02

Editorial

W. J. Trybula

[p. 85]

Abstracts

[p. 87]

REGULAR PAPERS

Thermal Modeling of a Double-Neck Large Diameter Crystal Growth Process

T.-Y. T. Lee and H.-D. Chiou

[p. 90]

Material-Centric Modeling of PWB Fabrication: An Economic and Environmental Comparison of Conventional and Photovia Board Fabrication Processes

P. A. Sandborn and C. F. Murphy

[p. 97]

Optimization for Thermal and Electrical Wiring for a Flip-Chip Package Using Physical-Neural Network Modeling

V. V. Calmidi and R. L. Mahajan

[p. 111]

Electrical Characterization of Laser Machined and Metallized Vias in AlN with Thick Film Interconnect

J. K. Lumpp and S. Raman

[p. 118]

Effective Modeling of the Reflow Soldering Process: Basis, Construction, and Operation of a Process Model

F. Sarvar and P. P. Conway

[p. 126]

Oxidation and Reduction Kinetics of Eutectic SnPb, InSn, and AuSn: A Knowledge Base for Fluxless Solder Bonding Applications

J. F. Kuhmann, A. Preuss, B. Adolphi, K. Maly, T. Wirth, W. Oesterle, W. Pittroff, G. Weyer, and M. Fanciulli

[p. 134]

Molding Challenges of LOC Packages with Large Devices

M.-C. Paquet

[p. 142]

Improvements to X-Ray Laminography for Automated Inspection of Solder Joints

V. Sankaran, A. R. Kalukin, and R. P. Kraft

[p. 148]