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July 1998, Volume 21, Number 03

Editorial

W. J. Trybula

[p. 161]

Abstracts

[p. 162]

REGULAR PAPERS

Electronic Manufacturing Process

Effective Modeling of the Reflow Soldering Process: Use of a Modeling Tool for Product and Process Design

F. Sarvar and P. P. Conway

[p. 165]

Designed Experiments to Investigate the Solder Joint Quality Output of a Prototype Automated Surface Mount Replacement System

I. Fidan, R. P. Kraft, L. E. Ruff, and S. J. Derby

[p. 172]

Solder Transfer Technique for Flip-Chip and Electronic Assembly Applications

K. J. Puttlitz, K. A. Stalter, and P. A. Totta

[p. 182]

The Effects of Flux Materials on the Moisture Sensitivity and Reliability of Flip-Chip-on-Board Assemblies

C. Beddingfield and L. M. Higgins, III

[p. 189]

Advanced Encapsulant Systems for Flip-Chip-on-Board Assemblies: Underfills with Improved Manufacturing Properties

D. R. Gamota and C. M. Melton

[p. 196]

Manufacturing Process for Combination Lead Frame/TAB BGA

M. Mita, G. Murakami, T. Kumakura, and F. Kashiwabara

[p. 204]

A Study of the Reliability of Brazed Al₂O₃ Joint Systems

S. Hahn, M. Kim, and S. Kang

[p. 211]

Active Controller: Utilizing Active Databases for Implementing Multi-Step Control of Semiconductor Manufacturing

N. Chaudhry, J. Moyne, and E. A. Rundensteiner

[p. 217]

Challenges in Determining Electronics Equipment Take-Back Levels

J. A. Stuart, M. K. Low, D. J. Williams, L. J. Turbini, J. C. Ammons

[p. 225]

Addressing Environment, Health, and Safety in Semiconductor Process Development

L. Mendicino and L. Beu

[p. 233]

BOOK REVIEWS

High Temperature Electronics

C. Johnston

[p. 238]

Air Cooling Technologies for Electronic Equipment

P. Lall and M. G. Pecht

[p. 238]