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Editorial

W. J. Trybula
[p. 1]

Abstracts

[p. 2]

REGULAR PAPERS

Cost Analysis: Solder Bumped Flip Chip Versus Wire Bonding

J. H. Lau
[p. 4]

Low-Cost Direct Chip Attach: Comparison of SMD Compatible FC Soldering with Anisotropically Confuctive Adhesive FC Bonding

R. Haug, U. Behner, C.-P. Czaya, F.-D. Hauschild, H. Jiang, S. Kotthaus, S. Kuschel,R. Schuetz, and C. P. O. Treutler
[p. 12]

Failure Analysis of Solder Bumped Flip Chip on Low-Cost Substrates

J. H. Lau, C. Chang, and S.-W. R. Lee
[p. 19]

Chip on Chip (COC) and Chip on Board (COB) Assembly on Flex Rigid Printed Circuit Assemblies

J. R. Ganasan
[p. 28]

Copper Lead Frame: An Ultimate Solution to the Reliability of BLP Package

K.-S. Choi, T.-G. Kang, I.-S. Park, J.-H. Le, and K.-B. Cha
[p. 32]

Quantifying the Benefits of Cycle Time Reduction in Semiconductor Wafer Fabrication

K. Nemoto, E. Akcali, and R. Uzsoy
[p. 39]

Integrated Electroplated Micromachined Magnetic Devices Using Low Temperature Fabrication Processes

J. Y. Park and M. G. Allen
[p. 48]

Extensions and Performance/Robustness Tradeoffs of the EWMA Run-to-Run Controller by Using the Internal Model Control Structure

S. Adivikolanu and E. Zafiriou
[p. 56]

IEEE Copyright Form

[p. 75]