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Editorial

W. J. Trybula

[p. 77]

Abstracts

[p. 78]

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CORRESPONDENCE

Correction to "High-Temperature, Low-Modulus Adhesive Attach for Large-Area Thin-Film Processing on Silicon and Alumina Tiles"

M. Variyam, V. Sundararaman, S. K. Sitaraman, J. Wu, R. T. Pike, and C. P. Wong

[p. 148]