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Editorial

W. J. Trybula
[p. 153]

Abstracts

[p. 154]

CONTRIBUTED PAPERS

Multiple Assignment of Component Types to Feeder Slots on Automated Printed Circuit Card Placement Machines

G. W. DePuy, J. C. Ammons, and L. F. McGinnis
[p. 157]

Stencil Printing Process Development for Flip Chip Interconnect

L. Li and P. Thompson
[p. 165]

Reduced Thermal Strain in Flip Chip Assembly on Organic Substrate using Low CTE Anisotropic Conductive Film

M. J. Yim, Y.-D. Jeon, and K.-W. Paik
[p. 171]

Confidence Assessment of Quality Prediction from Process Measurement in Sequential Manufacturing Processes

N. Ye, Q. Zhong, and G. E. Rahn
[p. 177]

Isotropic Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers

D. Lu and C. P. Wong
[p. 185]

A Comparison of PWB Warpage Due to Simulated Infrared and Wave Soldering Processes

Y. Polsky, W. Sutherlin, and I. C. Ume
[p. 191]

Rework Techniques Process Evaluation for Chip Scale Packages

T. A. Nguty, J. D. Philpott, N. N. Ekere, S. Teckle, B. Salam, and D. Rajkumar
[p. 200]

Parametric Analysis of Steam Driven Delamination in Electronics Packages

D. C. C. Lam, I. T. Chong, and P. Tong
[p. 208]

Research Concerning the Separation and Recovery of Used Printed Wiring Board Solder

Y. Yamagiwa, S. Soyama, and S. Iwata
[p. 214]

Taguchi Design of Experiment for Wafer Bumping by Stencil Printing

J. H. Lau and C. Chang
[p. 219]

ANNOUNCEMENTS

Molecular Electronics 2000

[p. 226]