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IEEE Transactions on
Electronics Packaging Manufacturing
A PUBLICATION OF THE IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY
October 2000, Volume 23, Number 04
See IEEE Xplore to download PDF copies (available service for subscribers).
- Editorial
- W.
J. Trybula
[p. 233]
- Abstracts
[p. 235]
SPECIAL SECTION ON EOS/EST SYMPOSIUM
- Innovative ESD Thermoplastic Composites
Structured Through Melt Flow
Processing
- M. Narkis, G.
Lidor, A. Vaxman, and L. Zuri
[p. 239]
- Design
Methodology of a Robust ESD Protection Circuit for STI Process 256
Mb NAND Flash Memory
- T. Ikehashi, K.
Imamiya, and K. Sakui
[p. 246]
- Conductive Floor and
Footwear System as Primary Protection Against Human Body
Model ESD Event
- S.
Lim
[p. 255]
CONTRIBUTED PAPERS
Manufacturing Related Issues
- Processing and
Reliability of Fast-Flow, Snap-Cure Underfills--Part I: Processing
and Moisture Sensitivity
- D. F. Baldwin, P.
N. Houston, M. Deladisma, L. N. Crane, and M. M.
Konarski
[p. 259]
- An
Automated Meniscus Coating System for Polymer Deposition on Large-Area
MCM-D and MCM-L Substrates
- S. K. Bhattacharya,
S. Bhatevara, H. Morales, S. Kauffman, E. Kamen, and G.
May
[p. 267]
- Laser Ablation of
Anisotropic Conductive
Adhesive
- L. A. Harvilchuck, P. I. Presunka,
and J. H. Constable
[p. 277]
- Single-Insertion
Temperature Testing of Semiconductor
ICs
- A. C. Pfahnl, L. A. Muller, and P.
Cochran
[p. 284]
- Burn-In Effect on
Yield
- T. Kim, W. Kuo, and W.-T. K.
Chien
[p. 293]
Modeling Related to Manufacturing Processes
- Modelling of Time-Pressure Fluid
Dispensing Processes
- X. B. Chen, G. Schoenau, and W. J.
Zhang
[p. 300]
- Design Analysis of an
Electroless Plating Bath Using CFD
Technique
- T.-Y. T. Lee and J.-K.
Lin
[p. 306]
- A Model
for Discrete Processing Decisions for Bulk Recycling of Electronics
Equipment
- J. A. Stuart and Q.
Lu
[p. 314]
- A
Refine-or-Sell Decision Model for a Station with Continuous Reprocessing
Options in an Electronics Recycling
Center
- J. A. Stuart and Q.
Lu
[p. 321]
- Operational Analysis
of Synchrotron-Based X-Ray Lithography: Comparison of 200 mm and 300 mm
Wafer Flows
- K. P. White, Jr.
and W. J. Trybula
[p. 328]
- Operational Analysis of Synchrotron-Based
X-ray Lithography: Simulation Model of Wafer
Flows
- K. P. White, Jr.
and W. J. Trybula
[p. 337]
- Decomposition in Data
Mining: An Industrial Case
Study
- A.
Kusiak
[p. 345]
- 2000 INDEX Follows page
[p. 360]
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