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IEEE Transactions on
Electronics Packaging Manufacturing

A PUBLICATION OF THE IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY

January 2001, Volume 24, Number 01

 See IEEE Xplore to download PDF copies (available service for subscribers).

Editorial
Trybula, W.J.
Page(s): 1 -1

Abstracts
Page(s): 2 -3

Examining the environmental impact of lead-free soldering alternatives
Turbini, L.J.; Munie, G.C.; Bernier, D.; Gamalski, J.; Bergman, D.W.
Page(s): 4 -9

Manufacturing a green service: engaging the TRIZ model of innovation
Ming Kaan Low; Lamvik, T.; Walsh, K.; Myklebust, O.
Page(s): 10 -17

Low stress packaging of a micromachined accelerometer
Li, G.; Tseng, A.A.
Page(s): 18 -25

Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability
Jicun Lu; Smith, B.; Baldwin, D.E.
Page(s): 26 -30

Field reworkable underfill materials for flip chip on board assemblies
Yala, N.; Gamota, D.
Page(s): 31 -38

Studies on CO/sub 2/ laser drilling: formation mechanism of residual thin materials at the bottom of laser via
Inaba, R.; Kawamura, T.; Akahoshi, H.; Arai, K.
Page(s): 39 -43

Rough set theory: a data mining tool for semiconductor manufacturing
Kusiak, A.
Page(s): 44 -50

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