Editorial
Trybula, W.J.
Page(s): 149 -150

Abstracts
Page(s): 151 -153

Solder wetting in a wafer-level flip chip assembly
Jicun Lu; Busch, S.C.; Baldwin, D.F.
Page(s): 154 -159

Optimizing the performance of a surface mount placement machine
Ellis, K.P.; Vittes, F.J.; Kobza, J.E.
Page(s): 160 -170

A systems approach to semiconductor optimization
Newnes, L.B.; Mileham, T.R.; Doniavi, A.
Page(s): 171 -177

Optimization of placement by candidate sieving
Takagi, M.
Page(s): 178 -187

Cycle time estimation for printed circuit board assemblies
Haberle, K.R.; Graves, R.J.
Page(s): 188 -194

On the use of yielded cost in modeling electronic assembly processes
Becker, D.V.; Sandborn, P.A.
Page(s): 195 -202

Application-specific economic analysis of integral passives in printed circuit boards
Sandborn, P.A.; Etienne, B.; Subramanian, G.
Page(s): 203 -213

Feature transformation methods in data mining
Kusiak, A.
Page(s): 214 -221

An intelligent data mining system for drop test analysis of electronic products
Chi Zhou; Nelson, P.C.; Weimin Xiao; Tirpak, T.M.; Lane, S.A.
Page(s): 222 -231