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Editorial

W. J. Trybula

[p. 1]

Abstracts

[p. 3]

CONTRIBUTIONS FROM THE 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING

Foreword

R. W. Johnson

[p. 6]

Thermosonic Gold Wire Bonding to Laminate Substrates with Palladium Surface Finishes

R. W. Johnson

,

M. J. Palmer, M. J. Bozack, and T. Isaacs-Smith
[p. 7]

Evaluation of Diffusion Patterning as an Alternative Substrate Technology for Automotive Applications

J. Xue, T. L. Baker, T. Klosowiak, M. Molnar, M. Pomeroy, J. Weimer, G. Bianco, and R. Mason

[p. 16]

The Flip-Chip Bump Interconnection for Millimeter-Wave GaAs MMIC

H. Kusamitsu, Y. Morishita, K. Maruhashi, M. Ito, and K. Ohata

[p. 23]

Yield Prediction for Flip-Chip Solder Assemblies Based on Solder Shape Modeling

S. C. Tower, B. Su, and Y. C. Lee

[p. 29]

In-Situ

Stress State Measurements During Chip-on-Board Assembly

Y. Zou, J. C. Suhling, R. W. Johnson, R. C. Jaeger, and A. K. M. Mian

[p. 38]

REGULAR PAPERS

Correlation of Flip Chip Underfill Process Parameters and Material Properties with In-Process Stress Generation

P. Palaniappan, D. F. Baldwin, P. J. Selman, J. Wu, and C. P. Wong

[p. 53]

Development of Real Time/Variable Sensitivity Warpage Measurement Technique and its Application to Plastic Ball Grid Array Package

K. Verma, D. Columbus, and B. Han

[p. 63]

The Deformation Behavior of Sn62Pb36Ag2 and Its Implications on the Design of Thermal Cycling Tests for Electronic Assemblies

G. Grossmann

[p. 71]

Conductive Filament Formation: A Potential Reliability Issue in Laminated Printed Circuit Cards with Hollow Fibers

M. Pecht, C. Hillman, K. Rogers, and D. Jennings

[p. 80]

A Component-Based Software Architecture for Robotic Workcell Applications

J. M. Reagin, J. E. Beck, T. E. Sweeny, R. L. Anderson, and T. D. Garner

[p. 85]