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Editorial

W. J. Trybula

[p. 101]

Abstracts

[p. 103]

REGULAR PAPERS

A Model for Optimizing the Assembly and Disassembly of Electronic Systems

P. A. Sandborn and C. F. Murphy

[p. 105]

Integrating Environmental Objectives in the Operational Planning of Printed Circuit Board Assembly

P. Worhach and P. Sheng

[p. 118]

Optimization of Via Formation in Photosensitive Dielectric Layers Using Neural Networks and Genetic Algorithms

T. S. Kim and G. S. May

[p. 128]

Optimization of High-Speed Multistation SMT Placement Machines Using Evolutionary Algorithms

W. Wang, P. C. Nelson, and T. M. Tirpak

[p. 137]

SMD Placement on Three-Dimensional Circuit Boards

E. Zussman

[p. 147]

Three-Dimensional Inspection of Ball Grid Array Using Laser Vision System

P. Kim and S. Rhee

[p. 151]

Preventing Conductive White Residue Formation by Modifying the Manufacturing Process

M. A. Palmer, J. D. Metz, A. M. Sinni, J. Soon, and J. F Maguire

[p. 156]

A Study of the Mixed-Mode Interfacial Fracture Toughness of Adhesive Joints Using a Multiaxial Fatigue Tester

J. Wang, M. Lu, W. Ren, D. Zou, and S. Liu

[p. 166]

ANNOUNCEMENTS

Call for Papers--50th Electronic Components and Technology Conference

[p. 174]