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IEEE Transactions on
Electronics Packaging Manufacturing
A PUBLICATION OF THE IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY
July 1999, Volume 22, Number 03
- Abstracts
[p. 182]
REGULAR PAPERS
- Environmental Effects in Component
Packaging
Selection
- S.
Siddhaye, P. Sheng, and C. Ooi
[p. 185]
- Fuzzy Assignment of Manufacturing Process
Tolerances
- C.-C. Wei, C.-B. Chen, and C.-H.
Tsai
[p. 191]
- Novel
Bi-Layer Conformal Coating for Reliability Without Hermeticity MEMS
Encapsulation
- J.
Wu, R. T. Pike, and C. P. Wong
[p. 195]
- Plating of Small Blind
Vias
- S.-C.
Kou and A. Hung
[p. 202]
- Run-by-Run Estimation-Based Control of Meniscus
Coating
- A. F. Krauss and E. W.
Kamen
[p. 209]
- Conductivity Mechanisms of Isotropic
Conductive Adhesives
(ICA's)
- D.
Lu, Q. K. Tong, and C. P. Wong
[p. 223]
- Mechanisms Underlying the Unstable Contact Resistance of
Conductive
Adhesives
- D.
Lu, Q. K. Tong, and C. P. Wong
[p. 228]
- Adaptive Fuzzy Process Control of Integrated Circuit Wire
Bonding
- C. D.
Kinnaird and A. Khotanzad
[p. 233]
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