Getting Copies of these Papers:
Subscribers to this Transactions (and subscribers to XPLORE/IEL/MDL) may freely download the PDFs of any of these papers, at the XPLORE On-Line Library. Guests may access abstract/citation records free of charge.


IEEE Transactions on
Electronics Packaging Manufacturing

A PUBLICATION OF THE IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY

July 1999, Volume 22, Number 03


Abstracts
[p. 182]


REGULAR PAPERS

Environmental Effects in Component Packaging Selection
S. Siddhaye, P. Sheng, and C. Ooi

[p. 185]

Fuzzy Assignment of Manufacturing Process Tolerances
C.-C. Wei, C.-B. Chen, and C.-H. Tsai

[p. 191]

Novel Bi-Layer Conformal Coating for Reliability Without Hermeticity MEMS Encapsulation
J. Wu, R. T. Pike, and C. P. Wong

[p. 195]

Plating of Small Blind Vias
S.-C. Kou and A. Hung

[p. 202]

Run-by-Run Estimation-Based Control of Meniscus Coating
A. F. Krauss and E. W. Kamen

[p. 209]

Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA's)
D. Lu, Q. K. Tong, and C. P. Wong

[p. 223]

Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives
D. Lu, Q. K. Tong, and C. P. Wong

[p. 228]

Adaptive Fuzzy Process Control of Integrated Circuit Wire Bonding
C. D. Kinnaird and A. Khotanzad

[p. 233]


Return to CPMT Transactions' Tables of Contents