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Abstracts

[p. 249]

THE 1999 INTERNATIONAL SYMPOSIUM AND EXHIBITION ON ADVANCED PACKAGING MATERIALS

Foreword

J. E. Morris and C. P. Wong

[p. 253]

Do Chip Size Limits Exist for DCA?

A. Schubert, R. Dudek, R. Leutenbauer, R. Döring, J. Kloeser,H. Oppermann, B. Michel, H. Reichl, D. F. Baldwin, J. Qu, S. Sitaraman, M. Swaminathan, C. P. Wong, and R. Tummala

[p. 255]

Characterization of Underfill/Substrate Interfacial Toughness Enhancement by Silane Additives

Q. Yao, J. Qu, J. Wu, and C. P. Wong

[p. 264]

Study on the Relationship Between the Surface Composition of Copper Pads and No-Flow Underfill Fluxing Capability

S. H. Shi, D. Lu, and C. P. Wong

[p. 268]

Development of the Wafer Level Compressive-Flow Underfill Process and Its Involved Materials

S. H. Shi, T. Yamashita, and C. P. Wong

[p. 274]

Studies of Latent Catalyst Systems for Pot-Life Enhancement of Flip Chip Underfills

L. Wang and C. P. Wong

[p. 282]

High-Temperature, Low-Modulus Adhesive Attach for Large-Area Thin-Film Processing on Silicon and Alumina Tiles

M. Variyam, V. Sundararaman, S. K. Sitaraman, C. P. Wong, J. Wu, and R. T. Pike

[p. 290]

Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction

N. Urasaki and C. P. Wong

[p. 295]

Effect of Ag Particle Size on Electrical Conductivity of Isotropically Conductive Adhesives

L. Ye, Z. Lai, J. Liu, and A. Thölen

[p. 299]

Initial Investigations into Low-Cost Ultra-Fine Pitch Solder Printing Process Based on Innovative Laser Printing Technology

A. Walker and D. F. Baldwin

[p. 303]

Smart Tooling for Assembly of Thin Flexible Systems

R. Chen and D. F. Baldwin

[p. 308]

Modeling Ceramic Filled Polymer Integrated Capacitor Formation Using Neural Networks

T. Thongvigitmanee and G. S. May

[p. 314]

Sources and Control of Volatile Gases Hazardous to Hermetic Electronic Enclosures

R. K. Lowry

[p. 319]

REGULAR PAPERS

High Performance Conductive Adhesives

D. Lu and C. P. Wong

[p. 324]

Recent Advances in the Development of No-Flow Underfill Encapsulants--A Practical Approach Towards the Actual Manufacturing Application

S. H. Shi and C. P. Wong

[p. 331]