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IEEE Transactions on Semiconductor Manufacturing

August 1995, Volume 8, Issue 3

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EDITORIAL

G. Cheek

BEST PAPER AWARD

PAPERS

Models

Fuzzy Logic Models for Thermally Based Microelectronic Manufacturing Processes

H. Xie, R. L. Mahajan, and Y.-C. Lee

The Impact of Process Noise on VLSI Process Improvement

R. E. Bohn

Performance Modeling Using Additive Regression Splines

C.-Y. Chao and L. S. Milor

Prediction of Wafer State After Plasma Processing Using Real-Time Tool Data

S. F. Lee, and C. J. Spanos

Manufacturing Systems

The Process Specification System for MMST

P. R. Kristoff and D. P. Nunn

Processing

Thermal Uniformity and Stress Minimization During Rapid Thermal Processes

R. H. Perkins, T. J. Riley, and R. S. Gyurcsik

A Methodology for Analysis of RTCVD Systems

F. Y. Sorrell, M. J. Fordham, and S. Yu

Control of Semiconductor Manufacturing Equipment: Real-Time Feedback Control of a Reactive Ion Etcher

B A. Rashap, M. E. Elta, H. Etemad, J. P. Fournier, J. S. Freudenberg, M. D. Giles, J. W. Grizzle, P. T. Kabamba, P. P. Khargonekar, S. Lafortune, J. R. Moyne, D. Teneketzis, and F. L. Terry, Jr.

Influence of Rapid Thermal and Low Temperature Processing on the Electrical Properties of Polysilicon Thin Film Transistors

E. Campo, E. Scheid, D. Bielle-Daspet, and J. P. Guillemet

A Production Demonstration of Wafer-to-Wafer Plasma Gate Etch Control by Adaptive Real-Time Computation of the Over-Etch Time from in Situ

Process Signals

E. A. Rietman and S. H. Patel

Composite Metal Etching for Submicron Integrated Circuits

P. E. Riley, M. Ben-tzur, and R. Kavari

Simplified Ohmic and Schottky Contact Formation for Field Effect Transistors Using the Single Layer Integrated Metal Field Effect Transistor (SLIMFET) Process

G. C. DeSalvo, T. K. Quach, C. A. Bozada, R. W. Dettmer, K. Nakano, J. K. Gillespie, G. D. Via, J. L. Ebel, and C. K. Havasy

Yield Enhancement

A Review of Mask Errors on a Variety of Pattern Generators

J. Ye, C. N. Berglund, J. Robinson, and R. F. W. Pease

SRAM Bitmap Shape Recognition and Sorting Using Neural Networks

R. S. Collica, J. P. Card, and W. Martin

Measurement Tools and Techniques

Epi-Film Thickness Measurements Using Emission Fourier Transform Infrared Spectroscopy-- Part I: Sensor Characterization

Z.-H. Zhou and R. Reif

Epi-Film Thickness Measurements Using Emission Fourier Transform Infrared Spectroscopy-- Part II: Real-Time {\it in Situ} Process Mornitoring and Control

Z.-H. Zhou and R. Reif

Temperature Measurement of Metal-Coated Silicon Wafers by Double-Pass Infrared Transmission

C. W. Cullen and J. C. Sturm

Packaging and Assembly

Finite Element Simulation of a Nondestructive Shear Test for TAB Bonds

J. Leifer, G. Y. Masada, and I. J. Busch-Vishniac

CORRESPONDENCE

Using Wavelength-Dependent Emissivity of Semiconductor Wafer to Model Heat Transfer in Rapid Thermal Processing Station

S. Belikov, H. Martynov, M. Kaplinsky, and C. Manikopoulos

Investigation of the Thermal Behavior of a RTP Furnace

R. Henda, E. Scheid, and D. Bielle-Daspet

Spectrum Analysis and Vector Representation of SRAM Bit Failures

M. Itsumi, H. Akiya, S. Nakayama, and H. Yoshino

Circuit-Level Simulation of TDDB Failure in Digital CMOS Circuits

E. R. Minami, S. B. Kuusinen, E. Rosenbaum, P. K. Ko, and C. Hu

Relaxation of Acceptance Limits (RAL): A Global Approach for Parametric Yield Control of 0.1-$\mu$m Deep Submicron MOSFET Devices

R. Sitte, S. Dimitrijev, and H. Barry Harrison