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IEEE Transactions on Semiconductor Manufacturing

February 1996, Volume 9, Issue 1

SPECIAL SECTION ON ICMTS

Guest Editorial

Y. Tomaki

SPECIAL SECTION PAPERS

The Floating Gate Measurement Technique for Characterization of Capacitor Matching

H. P. Tuinhout, H. Elzinga, J. T. Brugman, and F. Postma

Measurement of Contact Resistance Distribution Using a 4k-Contacts Array

T. Hamamoto, T. Ozaki, M. Aoki, and Y. Ishibashi

Experimental Study of Electromigration at Bamboo Grain Boundaries with a New Test Structure Using the Single-Crystal Aluminum Interconnection

K. Kusuyama, Y. Nakajima, and Y. Murakami

A New Characterization of Sub-$\mu$m Parallel Multilevel Interconnects and Experimental Verification

K. Aoyama, K. Ise, H. Sato, K. Tsuneno, and H. Masuda

Influence of Short Circuits on Data of Contact and Via Open Circuits Determined by a Novel Weave Test Structure

C. Hess and L. H. Weiland

REGULAR ISSUE PAPERS

Simulation

Heterogeneous Process Simulation Tool Integration

Z. H. Sahul, K. C. Wang, Z.-K. Hsiau, E. W. McKenna, and R. W. Dutton

Monte Carlo Simulation of Arsenic Ion Implantation in (100) Single-Crystal Silicon

S.-H. Yang, S. J. Morris, S. Tian, K. B. Parab, and A. F. Tasch, Jr.

A Continuous and General Model for Boron Diffusion During Post-Implant Annealing Including Damaged and Amorphizing Conditions

B. Baccus and E. Vandenbossche

3-D Simulation of LPCVD Using Segment-Based Topography Discretization

E. B\"{a}r and J. Lorenz

Comparing Models for the Growth of Silicon-Rich Oxides (SRO)

G. D\"{u}ndar and K. Rose

Extracting Solid Conductors from a Single Triangulated Surface Representation for Interconnect Analysis

J. F. Sefler and A. R. Neureuther

Process Control

Improvements in $C_{pk}$ Using Real-Time Feedback Control

K. El-Awady, C. Schaper, and T. Kailath

A Neural Network Model of a Contact Plasma Etch Process for VLSI Production

E. A. Rietman

A Novel In-Line Automated Metrology for Photolithography

S. Leang and C. J. Spanos

Manufacturing Issues Related to RTP Induced Overlay Errors in a Global Alignment Stepper Technology

J. F. Buller, M. M. Farahani, and S. Garg

Temperature Measurement in Rapid Thermal Processing Using the Acoustic Temperature Sensor

Y. J. Lee, B. T. Khuri-Yakub, and K. Saraswat

Titanium Sputter Deposition at Low Pressures and Long Throw Distances

J. N. Broughton, M. J. Brett, S. K. Dew, and G. Este

Simultaneous Control of Multiple Measures of Nonuniformity Using Site Models and Monitor Wafer Control

S. Saxena, P. K. Mozumder, and K. J. Taylor

Yield Enhancement

Yield Enhancement Effects of Boosted Dual Word-Line (BDWL) Scheme for High Density DRAM's

T. Saeki, N. Kasai, T. Itani, S. Nishimoto, and Y. Fukuzo

CORRESPONDENCE

Applications of the Upside-Down Normal Loss Function

D. Drain and A. M. Gough

Minimum Inventory Variability Schedule with Applications in Semiconductor Fabrication

S. Li, T. Tang, and D. W. Collins

Reducing the Cost Variance in Life Testing of Integrated Circuits

Y.-W. Leung

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