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IEEE Transactions on Semiconductor Manufacturing
May 1996, Volume 9, Issue 2
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Editorial
-
G.
Cheek
PAPERS
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Benchmarking Semiconductor
Manufacturing
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R.
C. Leachman and D. A. Hodges
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Computer-Aided Phase Shift Mask Design with Reduced
Complexity
-
Y.
Liu, A. Zakhor, and M. Zuniga
-
Methods for Measurement of Development Parameters in
the Manufacturing
Line for Use in Photolithography
Modeling
-
K. P.
Fahey
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A Control System for Photolithographic
Sequences
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S. Leang,
S.-Y. Ma, J. Thomson, B. J. Bombay, and C. J.
Spanos
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Control of Photoresist Properties: A Kalman Filter Based
Approach
-
E. Palmer, W.
Ren, C. J. Spanos, and K.
Poolla
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An Efficient Method for Determining Threshold
Voltage, Series Resistance
and Effective Geometry of MOS
Transistorsk
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P. R. Karlsson and K. O.
Jeppson
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A Genetic Algorithm for Low Variance Control in
Semiconductor Device
Manufacturing: Some Early
Results
-
E.
A. Rietman and R. C. Frye
-
Plasma Enhanced
-
In Situ
Chamber Cleaning Evaluated by Extracted-Plasma-Parameter
Analysis
-
K.
Ino, I. Natori, A. Ichikawa, R. N. Vrtis, and
T. Ohmi
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Etching of AC Thin Film Electroluminescent
Devices
-
R.
Stevens, I. P. McClean, and M. R.
Craven
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Rapid Thermal Annealing of High-Melting-Point Films on
Low-Melting-Point
Substrates
-
S.
E. Rosenberg, P. Y. Wong, and I. N.
Miaoulis
-
A
Production Planning Methodology
for Semiconductor Manufacturing Based on Iterative Simulation and Linear
Programming
Calculations
-
Y.-F.
Hung and R. C. Leachman
CORRESPONDENCE
-
Modeling of Integrated Circuit Yield Loss
Mechanisms
-
Z.
Stamenkovic, N.
Stojadinovic, and S.
Dimitrijev
-
Empirical Results on the Relationship Between Die
Yield and Cycle Time
in Semiconductor Wafer
Fabrication
-
S.
P. Cunningham and J. G. Shanthikumar
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Wafer Level Sort Programming---Impact on EPROM Memory
Retention
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T.-S.
Yeoh and S.-J. Hu
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A Versatile Structure for On-Chip Extraction of Resistance
Matching
Properties
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F. Larsen, M.
Ismail, and C. Abel
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Testing the Robustness of Two-Boundary Control Policies in
Semiconductor
Manufacturing
-
H.
Yan, S. Lou, S. Sethi, A. Gardel, and P.
Deosthali
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Reduction of Loading Effect by Tungsten Etchback in a
Magnetically
Enhanced Reactive Ion
Etcher
-
J.
H. Ha, S. W. Kim, Y. S. Seol, H. K. Park, and S. H.
Choi
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