2000 Electronic Components
and Technology Conference
This page is a source for corrections/updates for the CD-ROM for the 2000 ECTC.
Listed errata/updates:
Session 5, paper 3 (second paper in session):
"Missing Solder Ball Failure Mechanisms in Plastic Ball Grid Array Packages" by
C. H. Zhong, S.Yi, Y. C. Mui, C. P. Howe, D. Olsen, W.T. Chen:
Initial CD version was truncated. Here is the Full Paper
in PDF format (5 MB)
Session 30, paper 5 (fifth paper in session):
"Effect of Package Design and Layout on BGA Solder Joint Reliability
of an Organic C4 Package" by Biju Chandran, Deepak Goyal & Jeffrey Thomas:
Initial CD version was truncated. Here is the Full Paper
in PDF format (800 kB)
Please report any additional errata to
Paul Wesling.