|
Resources:
Who we are
Joining CPMT
Chapter Chair
Chapter Officers
The Olympic Torch
Local evening IEEE meetings
for the month
(from the GRID Calendar)
Search IEEE XPLORE for on-line journal and conference papers
|
(<=== click on the map, for a better view)
We welcome you to Silicon Valley, the home of the
Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology
Society! We're quite active, with a regular series of Monthly Evening
Meetings, a new series of Luncheon Meetings, and a rich choice of technical and professional skills courses.
|
Upcoming IEEE/CPMT Society Events
In the Santa Clara Valley
(Print out and post/circulate)
Monthly Technical Meetings:
(everyone is welcome!)
|
Technical/Skills/Management Short Courses:
|
Meetings for 2008:
"Electro-Optical Microscopy: Evolution in Component and Package-Level Inspection"
Andrew Kominek, Keyence Corporation
-- Lunch Thursday, November 20 (bring your own samples!)
"Halogen Free Electronics"
Dr. Dan Donahoe, Exponent; and Dr. Michelle Poliskie
-- Dinner Wednesday, December 10
"Trends in IC Packaging and Multicomponent Packaging"
Sandra Winkler, Electronic Trend Publications
-- lunch Thursday, January 22
Downloadable Slides from Recent Talks (most recent last)
"Multichip Module Packaging and its Impact on Architecture" Dr. Hubert Harrer, Senior Technical Staff Member, IBM Server and Technology Group (Boeblingen, Germany) (1.1 MB PDF)
"Sustainable Information Technology Ecosystem" Chandrakant Patel, Hewlett Packard Laboratories (1.6 MB PDF)
"Bridging the Gap Between 'Nano' and 'Just-Plain-Miniature' High Volume Print Forming" Arthur L. Chait, EoPlex Technologies (2.5 MB PDF)
"The Rocky Marriage of Technology and Quality" Dan Donahoe, Exponent (300 kB PDF)
"Package, Assembly and Thermal Challenges of Future Microprocessors" Raj Masters, Advanced Micro Devices (500 kB PDF)
"iNEMI Roadmap Overview" Jim McElroy, iNEMI (600 kB PDF) and "iNEMI Board Assembly Roadmap" Dongkai Shangguan (200 kB PDF)
Other Slides from Past Talks: See the CPMT Members-Only website.
|
Professional Skills Development and Management Classes:
Influential Communication
[more]
- August 5 at Synopsys, Mountain View
Interviewing and Hiring the Best Talent
[more]
- August 12 at TIBCO Software, Palo Alto
Contact
Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list
for other Spring/Summer classes.
|
See our listing of Past Meetings and Courses.
[Place yourself on our email distribution list or send a request to
Paul Wesling.]
Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF).
Please contact one of the members of our Program Committee with your proposal:
Harvey Miller, Program Chair, Dinner Meetings
Sandra Winkler, Program co-Chair, Luncheon Meetings
Ed Aoki, Program co-Chair, Luncheon Meetings
|
Design Issues:
(vacant): Chip/package co-design, signal integrity
Mark Montrose: EMC and safety
Components Issues:
(vacant): embedded pasives design & fabrication
Packaging Issues:
John Jackson: Flip Chip and CSP
Allen Earman: Novalux
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
Ephraim Suhir: nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)
|
|
Reliability and Qualification Testing:
Ephraim Suhir: product development, life, qualification testing
Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Annette Teng:
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free
|
|
|
