Upcoming Meetings and Webinars:

Instructions for Speakers

Explore our Past Meeting Topics

Educational Grant Program: Read about winners from SJSU, SF State and UC-Berkeley, and our funding at Ohlone Collge; download our Grant Application Form

Micromouse Packaging Award: prepare for this year’s MicroMouse contest!

Engineering for Female and Underrepresented Students (EFUS) Project: Chapter funding provided to Ohlone College

Upcoming Conferences and Workshops:

Slides from Recent Talks:

2D to 3D Package Architectures: Back to the Future -- scaling, heterogeneous integration, impact on power, performance, latency, nomenclature for package architectures, current metrics, projections ...
TI Conference Center, Santa Clara
Trends and Transitions in Semiconductor Packaging -- business models, supply chain, technology requirements, forecast for 2018 and 2019 ...
TI Conference Center, Santa Clara
Heterogeneous Packaging Integration for Electronics Systems -- mobile products, system-on-chip, dissimilar chips, performance, cost, SiP, TSV, interposers, forecast ...
TI Conference Center, Santa Clara
How to Peel Ultra-Thin Dies from Wafer Tape -- bending stress, die strength, peel force, die structures, wafer processing steps, TSVs, pickup methods, experimental verification ...
TI Conference Center, Santa Clara
Comparison of Die Singulation Techniques -- die thinning, stealth laser, laser abrasion, plasma etch, rotary blade, results ...
TI Conference Center, Santa Clara

Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

About our Chapter:

Officers and Volunteers
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