Who we are
Local evening IEEE meetings
for the month
(from the GRID Calendar)
Search IEEE XPLORE for on-line journal and conference papers
(<=== click on the map, for a better view)
We welcome you to Silicon Valley, the home of the
Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology
Society! We're quite active, with a regular series of Monthly Evening
Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.
Upcoming IEEE/CPMT Society Events
In the Santa Clara Valley
(Print out and post/circulate)
See our listing of Past Meetings and Courses.
|Monthly Technical Meetings:
(everyone is welcome!)
|Technical/Skills/Management Short Courses:
Meetings for 2015:
"Robust 3DIC Package Assembly Process Engineering for High Volume Production" -- Inderjit Singh, Xilinx Inc.
-- lunch Wednesday, August 12
"Packaging Solutions and Innovations with Compression Molding" -- C. H. Ang, Towa, USA
-- lunch Thursday, August 27
"Anisotropic Conductive Film (ACF) Interconnection Technology for Wearable Electronics Applications" -- Prof. Kyung W. Paik, Korea Advanced Institute of Science and Technology (KAIST)
-- lunch Wednesday, September 9
Downloadable Slides and Webcasts from Recent Talks (most recent last)
"Embedding Passive and Active Devices in Substrates"
Michael Tschandl, AT&S Americas LLC (700 kB PDF)
"How Well do you Know your Local SMT and IC Package Services?"
Phil Marcoux, PPM Associates, and Tom Clifford (800 kB PDF)
"A New Concept for Lead Frames"
Phil Rogren, EoPlex (1 MB PDF)
"Tools for Thermal Analysis: Thermal Test Chips"
Tom Tarter, Package Science Services LLC (2 MB PDF)
"Reliability Models for the Inernet of Things: A Paradigm Shift"
Mudasir Ahmad, Cisco Systems, Inc. (steaming video)
"Sixth Annual IEEE Soft Error Rate (SER) Workshop" -- 9 talks by experts.
Links to all WebEx talks and slides posted on event page.
"Wearable Technology -- Seminar and Tabletop Exposition" -- 7 talks by experts.
Links to all slides posted on event page.
"Inkjet Printing for Advanced Semiconductor Packaging: Pillars and Through-silicon Vias (TSVs)"
Jacob Sadie, EECS Department, UC Berkeley (900 kB PDF)
Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.
Professional Skills Development and Management Classes:
Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list
for other spring classes.
Virtual Teams: Working Together Apart
May 7 at Synopsys, Sunnyvale
Managing Time and Multiple Priorities - Self-Paced
This On-line Course is accessible at any time.
Other IEEE Events around Silicon Valley and the SF Bay Area:
Please visit the Council's e-GRID website to see what interesting technical talks are being scheduled by other Chapters.
[Place yourself on our email distribution list or send a request to
Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF).
Please contact one of our officers or any of the members of our Program Committee with your proposal:
Oscar MahinFallah: EMC
(vacant): embedded pasives design & fabrication
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
(vacant): nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)
Reliability and Qualification Testing:
Jim Krepelka, Agilent Technologies: Reliability, life, qualification testing
Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free