Who we are
Local evening IEEE meetings
for the month
(from the GRID Calendar)
Search IEEE XPLORE for on-line journal and conference papers
(<=== click on the map, for a better view)
We welcome you to Silicon Valley, the home of the
Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology
Society! We're quite active, with a regular series of Monthly Evening
Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.
Upcoming IEEE/CPMT Society Events
In the Santa Clara Valley
(Print out and post/circulate)
See our listing of Past Meetings and Courses.
|Monthly Technical Meetings:
(everyone is welcome!)
|Technical/Skills/Management Short Courses:
Meetings for 2016:
"Package Requirements for High-Speed Systems" -- Dr. Wendem T. Beyene, Rambus Inc.
-- lunch Tuesday, May 10
"Increased Power Density and Simplified Designs with 3-D SiP Module" -- Jim Moss, Texas Instruments
-- lunch Thursday, July 28
Other IEEE Events around Silicon Valley and the SF Bay Area:
Please visit the Council's e-GRID website to see what interesting technical talks are being scheduled by other Chapters.
Downloadable Slides and Webcasts from Recent Talks (most recent last)
"Advanced Packaging Technologies for System Integration"
Dr. Dongkai Shangguan, CMO, STATS ChipPAC (3 MB PDF)
"Recent Advances and New Trends in Semiconductor Packaging"
Dr. John H. Lau, ASM (3 MB PDF)
"Emerging IC Packaging Platforms for ICT Systems"
Dr. Li Li, Cisco Systems (1.4 MB PDF)
"Flexible Manufacturing Platform for High Volume TCB and High Density FOWLP"
Tom Strothmann, Kulicke & Soffa Industries (700 kB PDF)
"FO-WLP - A Disruptive Technology: Drivers and Developments"
E. Jan Vardaman, TechSearch International (2 MB PDF)
"Advanced Packaging Techniques as Enablers for the Health IoT Ecosystem"
Andreas Middendorf, Erik Jung, Fraunhofer IZM (1.8 MB PDF)
"Packaging Materials Market Trends, Issues and Opportunities"
Dr. Dan Tracy, SEMI (1 MB PDF)
"Embedded Microdevices: A New Way To Build Low-cost, 3D, Integrated MEMS Devices"
Prof. Mark Bachman, UC-Irvine (1.3 MB PDF)
"Considerations for Advancing Technology in Computer System Packaging"
Dale Becker, Ph.D., IBM (1.8 MB PDF)
Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.
[Place yourself on our email distribution list or send a request to
Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF).
Please contact one of our officers or any of the members of our Program Committee with your proposal: