Upcoming Meetings and Webinars:

Increased Power Density and Simplified Designs with 3-D SiP Module — trade-offs, form-factor, functionality, flexible designs, real estate ...
ical Google outlook
TI Conference Center, Santa Clara
Embedding and Miniaturization in Electronics Packaging — market needs, form-factors. wearables, cameras, consumer electronics, power converters ...
ical Google outlook
TI Conference Center, Santa Clara
Company tour of Jabil Blue Sky Design and Prototyping Center - digital prototyping, 3D printing, embedded sensors, UX design, printed electronics ...
ical Google outlook
6375 San Ignacio Ave., San Jose

Explore our Past Meeting Topics

Student Grant Program: Read about last year’s four winners from SJSU, SF State and UC-Berkeley
Micromouse Packaging Award: prepare for this year’s MicroMouse contest!
Engineering for Female and Underrepresented Students (EFUS) Project: Chapter funding through Ohlone College

Upcoming Conferences and Workshops:

Slides from Recent Talks:

Package Requirements for High-Speed Systems — SiP solution, enabling technologies, applications, packaging, market segments ...
TI Conference Center, Santa Clara
Recent Advances and Trends in Semiconductor Packaging - fan-out wafer/panel-level, 2.5D/3D, embedded, MEMS/IC integration ...
TI Conference Center, Santa Clara
A Flexible Manufacturing Platform for High-Volume TCB and High Density FOWLP — TC bonding, drivers, accuracy, platform, advanced processes ...
TI Conference Center, Santa Clara

Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

About our Chapter:

Officers and Volunteers
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