Upcoming Meetings and Webinars:

Instructions for Speakers

Explore our Past Meeting Topics

Student Grant Program: Read about last year’s four winners from SJSU, SF State and UC-Berkeley
Micromouse Packaging Award: prepare for this year’s MicroMouse contest!
Engineering for Female and Underrepresented Students (EFUS) Project: Chapter funding through Ohlone College

Upcoming Conferences and Workshops:

Slides from Recent Talks:

Wafer-Level Process Formation of a Polymer-Isolated Chip-Scale Package — yield loss, leakage, sidewall insulation, protection, reliability results ...
TI Conference Center, Santa Clara
Advances in Plasma Nano-coating — properties, density, pinhole-free, thicknesses, corrosion resistant, environmentally benign ...
TI Conference Center, Santa Clara
Wafer Level Encapsulation - Challenges And Solutions on an Alternative Format for Discrete Packaging — wafer level, molding, encapsulant, warpage control, lower cost ...
TI Conference Center, Santa Clara
Embedding and Miniaturization in Electronics Packaging — market needs, form-factors. wearables, cameras, consumer electronics, power converters ...
TI Conference Center, Santa Clara
Package Requirements for High-Speed Systems — SiP solution, enabling technologies, applications, packaging, market segments ...
TI Conference Center, Santa Clara

Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

About our Chapter:

Officers and Volunteers
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