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Resources:
Who we are
Joining CPMT
Chapter Chair
Chapter Officers
The Olympic Torch
Local evening IEEE meetings
for the month
(from the GRID Calendar)
Search IEEE XPLORE for on-line journal and conference papers
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(<=== click on the map, for a better view)
We welcome you to Silicon Valley, the home of the
Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology
Society! We're quite active, with a regular series of Monthly Evening
Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.
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Upcoming IEEE/CPMT Society Events
In the Santa Clara Valley
(Print out and post/circulate)
Monthly Technical Meetings:
(everyone is welcome!)
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Technical/Skills/Management Short Courses:
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Meetings for 2011/2012:
"ITRS and INEMI Roadmaps: Changes in Packaging Materials and Architectures for 2012"
Bill Bottoms, Chair, Technical Working Group for Packaging and Package Substrates, iNEMI
-- dinner Wednesday, May 9
"New Drivers and Strategies for Multi-Die Packaging"
Ivor Barber, Director, Package Design and Characterization, LSI Corporation
-- dinner Wednesday, June 13
Downloadable Slides and Webcasts from Recent Talks (most recent last)
Presentation Slides: "" (1 MB PDF)
"Liquid Cooling: An Update", Dr. Mikhail Spokoyny, Drexel University (1 MB PDF)
"3D Chip Stacks: Novel Thermal Interface Materials", Srilakshmi Lingamneni, Stanford University (2 MB PDF)
"Reliability from the LED System Perspective", Mark Hodapp, Philips Lumileds Lighting (550 kB PDF)
"Combining Accurate Measurement with Thermal Simulation", John Wilson, Mentor Graphics Corp (750 kB PDF)
"Fine-Grained 3D Integration", Deepak Sekar, MonolithIC 3D Inc. (750 kB PDF)
"Soft Error Rate (SER) Workshop", 9 presentations -- view Webinar, download handouts
"2.5D and 3D TSV Products", Phil Marcoux, PPM Associates (750 kB PDF)
"Silicon Carbide (SiC) Sensing Technology for Extreme Harsh Environments", Debbie G. Senesky, Ph.D., University of California, Berkeley (1.4 MB PDF)
"Memory Scaling and Its Potential Impact on Computing and Storage", Debbie Ed Doller, Micron Technology (1.4 MB PDF)
"Developments in MEMS Packaging", Alissa M Fitzgerald, AMFitzgerald and Associates (1.4 MB PDF)
Other Slides from Past Talks: See the CPMT Members-Only website.
Upcoming Conferences and Seminars sponsored by our Chapter
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2012)
at the DoubleTree Hotel, San Jose -- March 18-22, 2012.
Medical Devices: New Tools and New Rules
at the Santa Clara Convention Center -- March 22, 2012 ($20 discount by using code "SVEC-1")
Emerging Non-Volatile Memory Technologies: Full Day Symposium
at TI in Santa Clara -- April 6, 2012.
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Chapter Newsletters:
Please download and print our Newsletter; pass it along to a non-member with an interest in materials and packaging technology.
Summer 2011 -- 400 kB
Summer/Fall 2010 -- 800 kB
Winter/Spring 2010 -- 200 kB
Professional Skills Development and Management Classes:
Contact
Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list
for other winter classes.
Communicate to Manage Expectations
[more]
- April 17 at Tibco, Palo Alto
Delegation and Coaching: The Winning Combination
[more]
- April 26 at Tibco, Palo Alto
Flexibility: Understanding Differences and Conflict
[more]
- May 3 at Tibco, Palo Alto
Getting Things Done Across Organizational Borders
[more]
- May 8 at Synopsys, Mtn View
Other IEEE Events around Silicon Valley and the SF Bay Area:
Please visit the Council's e-GRID website to see what interesting technical talks are being scheduled by other Chapters.
ExCom Members Login:
ExCom members may log into our Google Sites/Apps website.
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See our listing of Past Meetings and Courses.
[Place yourself on our email distribution list or send a request to
Paul Wesling.]
Ideas for Future Meetings?
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Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF).
Please contact one of our officers or any of the members of our Program Committee with your proposal:
Design Issues:
Oscar MahinFallah: EMC
Components Issues:
(vacant): embedded pasives design & fabrication
Packaging Issues:
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
(vacant): nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)
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Reliability and Qualification Testing:
Jim Krepelka, Agilent Technologies: Reliability, life, qualification testing
Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free
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