Upcoming Meetings and Webinars:

Ten Years of Robustness Validation Applied to Power Electronics Components -- European car makers, physics of failure, "test to fail", end-of-life testing, thick wire bonds, planar interconnects ...
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TI Conference Center, Santa Clara

Instructions for Speakers

Explore our Past Meeting Topics

Student Grant Program: Read about last year’s four winners from SJSU, SF State and UC-Berkeley
Micromouse Packaging Award: prepare for this year’s MicroMouse contest!
Engineering for Female and Underrepresented Students (EFUS) Project: Chapter funding through Ohlone College

Upcoming Conferences and Workshops:

Slides from Recent Talks:

Intel Silicon Photonics: From Research to Product -- optical, SiPh, standard silicon processing, performance, low-cost, optical100G transceiver ...
TI Conference Center, Santa Clara
Advances in Low Cost/High Reliability Lead-Free Solder Materials -- solder's role, compositions, properties, Ag content, optimum cost/reliability, failure modes ...
TI Conference Center, Santa Clara
Roll-to-roll Manufacturing in Electronics: Making it Work — charge-array, deposition, registration, evolution, flip-chip and TFTs ...
TI Conference Center, Santa Clara
Wafer-Level Process Formation of a Polymer-Isolated Chip-Scale Package — yield loss, leakage, sidewall insulation, protection, reliability results ...
TI Conference Center, Santa Clara
Advances in Plasma Nano-coating — properties, density, pinhole-free, thicknesses, corrosion resistant, environmentally benign ...
TI Conference Center, Santa Clara

Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

About our Chapter:

Officers and Volunteers
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