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We welcome you to Silicon Valley, the home of the Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology Society! We're quite active, with a regular series of Monthly Evening Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.

Upcoming IEEE/CPMT Society Events In the Santa Clara Valley   (Print out and post/circulate)
Monthly Technical Meetings:
(everyone is welcome!)
Technical/Skills/Management Short Courses:
Meetings for 2015:

* "Packaging-Driven Reliability in High-Voltage Packages" -- Dr. Luu Nguyen, Texas Instruments Inc. -- lunch Thursday, January 22 (new location)

* "Advanced Stacked Die Packaging Technology: More than 2D" -- Dr. John Y. Xie, Director, Packaging Technology Research and Development, Altera Corp -- lunch Thursday, February 26

* "From Development to Manufacturing: Insights into the Latest Activities of the Advanced Packaging Market" -- Rozalia G. Beica, Chief Technology Officer, Yole Developpement -- dinner Tuesday, March 10

Downloadable Slides and Webcasts from Recent Talks (most recent last)

"Tools for Thermal Analysis: Thermal Test Chips" Tom Tarter, Package Science Services LLC (2 MB PDF)
"Reliability Models for the Inernet of Things: A Paradigm Shift" Mudasir Ahmad, Cisco Systems, Inc. (steaming video)
"Sixth Annual IEEE Soft Error Rate (SER) Workshop" -- 9 talks by experts. Links to all WebEx talks and slides posted on event page.
"Wearable Technology -- Seminar and Tabletop Exposition" -- 7 talks by experts. Links to all slides posted on event page.
"Inkjet Printing for Advanced Semiconductor Packaging: Pillars and Through-silicon Vias (TSVs)" Jacob Sadie, EECS Department, UC Berkeley (900 kB PDF)
"A Survey and Review of 2.5/3D IC Packaging Technologies" Herb Reiter, eda2asic Consulting, Inc. (1800 kB PDF)
"Power Semiconductor Packaging and System-on-a-Substrate Power Technology" Nathan Zommer, IXYS Corporation (1.5 MB PDF)
"Directions in Device Packaging for Mobile Applications" Jan Vardaman, President, TechSearch Int'l. (450 kB PDF)
Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

Professional Skills Development and Management Classes:

Contact Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list for other spring classes.

* Presentation Skills [more]   Feb 3 at Synopsys, Sunnyvale
* Project Management: A Team Approach [more]   Mar 24-25 at Synopsys, Sunnyvale
* Virtual Teams: Working Together Apart [more]   May 7 at Synopsys, Sunnyvale
  - Managing Time and Multiple Priorities - Self-Paced [more]   This On-line Course is accessible at any time.

Other IEEE Events around Silicon Valley and the SF Bay Area:

Please visit the Council's e-GRID website to see what interesting technical talks are being scheduled by other Chapters.

ExCom Members Login:
ExCom members may log into our Google Sites/Apps website.

See our listing of Past Meetings and Courses.
[Place yourself on our email distribution list or send a request to Paul Wesling.]


Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF). Please contact one of our officers or any of the members of our Program Committee with your proposal:
Officers:
Chapter Chair: Luu Nguyen, Texas Instruments
Vice Chair: Mudasir Ahmad, Cisco Systems
Treasurer: Azmat Malik
Secretary: Randall Brynsvold
Program Co-Chairs:
Dinner Meetings: Harvey Miller, InfraFocus, and Azmat Malik
Lunch Meetings: Sandra Winkler,
Program Support:
Hassan Ali
Ed Stoneham
Randall Brynsvold
Suzette Pangrle
Ed Stoneham
WebEx Webcasting: Mudasir Ahmad
A/V Support: Tom Tarter

Design Issues:
Oscar MahinFallah: EMC

Components Issues:
(vacant): embedded pasives design & fabrication

Packaging Issues:
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
(vacant): nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)

  Reliability and Qualification Testing:
Jim Krepelka, Agilent Technologies: Reliability, life, qualification testing

Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free

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