Who we are
The Olympic Torch
Local evening IEEE meetings
for the month
(from the GRID Calendar)
Search IEEE XPLORE for on-line journal and conference papers
(<=== click on the map, for a better view)
We welcome you to Silicon Valley, the home of the
Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology
Society! We're quite active, with a regular series of Monthly Evening
Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.
Upcoming IEEE/CPMT Society Events
In the Santa Clara Valley
(Print out and post/circulate)
See our listing of Past Meetings and Courses.
|Monthly Technical Meetings:
(everyone is welcome!)
|Technical/Skills/Management Short Courses:
Meetings for 2012/2013:
"High-Performance Datacenter Platform: Using InP for Silicon Photonics"
-- Dr. Michael Lebby, CEO, OneChip Photonics; Professor of Optoelectronics, Glyndwr University; IEEE Fellow.
-- dinner Wednesday, January 8
"Probing Interfacial Contact via MEMS-based Microinstrumentation"
-- Roya Maboudian, Department of Chemical & Biomolecular Engineering, UC-Berkeley
-- lunch Thursday, February 27
Downloadable Slides and Webcasts from Recent Talks (most recent last)
"Design, Manufacturing and Performance of a 3D Random Access Memory Subsystem"
David Chapman, VP Marketing, Tezzaron Semiconductor, Inc. (900 kB PDF)
"MEMS and BioMEMS in Laminates"
Professor Mark Bachman, University of California-Irvine (1.3 MB PDF)
"Advanced Package Migration to System-Level Integration"
Curtis Zwenger, Amkor Technology, Inc. (1.7 MB PDF)
"A Comparison of Low-Cost Interposer Technologies"
Terry Kang, Sr. Packaging Development Manager, Nvidia (1.3 MB PDF)
"One-Day Workshop: LED Lighting Explained"
Rudi Hechfellner, Dr. Michiel Krueger, Seng-Hup Teoh, Philips Lumileds Lighting Company (3 MB PDFs)
"Nanomaterial Synthesis and Integration for Sensor and Energy Applications"
Heather Chiamori, Berkeley Sensor & Actuator Center (BSAC), UC-Berkeley (1.6 MB PDF)
"Packaging: The Core of Competitive Advantage"
Bill Chen, Fellow of ASE Group (1.7 MB PDF)
"New Embedded Package Technology using Large-Scale Panel Assembly (FO-WLP)"
Akio Katsumata, J-Devices Corporation (900 kB PDF)
Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.
Please download and print our Newsletter; pass it along to a non-member with an interest in materials and packaging technology.
Summer 2011 -- 400 kB
Summer/Fall 2010 -- 800 kB
Winter/Spring 2010 -- 200 kB
Professional Skills Development and Management Classes:
Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list
for other fall classes.
Consulting Skills for Engineers: How to Become a Trusted Advisor
Nov 7 at Tibco, Palo Alto
Delegation and Coaching: The Winning Combination
Nov 12 at Tibco, Palo Alto
Other IEEE Events around Silicon Valley and the SF Bay Area:
Please visit the Council's e-GRID website to see what interesting technical talks are being scheduled by other Chapters.
ExCom Members Login:
ExCom members may log into our Google Sites/Apps website.
[Place yourself on our email distribution list or send a request to
Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF).
Please contact one of our officers or any of the members of our Program Committee with your proposal:
Oscar MahinFallah: EMC
(vacant): embedded pasives design & fabrication
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
(vacant): nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)
Reliability and Qualification Testing:
Jim Krepelka, Agilent Technologies: Reliability, life, qualification testing
Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free