Upcoming Meetings and Webinars:

Company Tour of Test-O-Pac Industries - mechanical, package design, medical devices, accelerated aging ...
ical Google outlook
Increased Power Density and Simplified Designs with 3-D SiP Module — trade-offs, form-factor, functionality, flexible designs, real estate ...
ical Google outlook
TI Conference Center, Santa Clara

Explore our Past Meeting Topics

Student Grant Program: Read about last year’s four winners from SJSU, SF State and UC-Berkeley
Micromouse Packaging Award: prepare for this year’s MicroMouse contest!
Engineering for Female and Underrepresented Students (EFUS) Project: Chapter funding through Ohlone College

Upcoming Conferences and Workshops:

IEEE InterSociety Thermal Conference — CPMT Society's Key Thermal Conference ...
from to ical Google outlook
Cosmopolitan Hotel, Las Vegas
IEEE Electronic Components and Technology Conference — CPMT Society's Flagship Conference ...
from to ical Google outlook
Cosmopolitan Hotel, Las Vegas
Architecture and Design for the Internet of Things — IoT Week in Silicon Valley: management, industrial IoT, Standards ...
from to ical Google outlook
Santa Clara Convention Center

Slides from Recent Talks:

Package Requirements for High-Speed Systems — SiP solution, enabling technologies, applications, packaging, market segments ...
TI Conference Center, Santa Clara
Recent Advances and Trends in Semiconductor Packaging - fan-out wafer/panel-level, 2.5D/3D, embedded, MEMS/IC integration ...
TI Conference Center, Santa Clara
A Flexible Manufacturing Platform for High-Volume TCB and High Density FOWLP — TC bonding, drivers, accuracy, platform, advanced processes ...
TI Conference Center, Santa Clara

Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

About our Chapter:

Officers and Volunteers
Join our ListServ Distribution List to hear about upcoming meetings.