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We welcome you to Silicon Valley, the home of the Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology Society! We're quite active, with a regular series of Monthly Evening Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.

Upcoming IEEE/CPMT Society Events In the Santa Clara Valley   (Print out and post/circulate)
Monthly Technical Meetings:
(everyone is welcome!)
Technical/Skills/Management Short Courses:
Meetings for 2014:

* "A Survey and Review of 2.5/3D IC Packaging Technologies"   -- Herb Reiter, eda2asic Consulting, Inc. -- dinner Wednesday, April 9

* "The Evolution of Laser Singulation"   -- Devin Martin, Manager of Technology Development, Disco Hi-Tec America -- lunch Thursday, April 24

* "Improved PoP Package Competes with 2.5/3D Packages using TSVs"   -- Dev Gupta, PhD, CTO, APSTL -- dinner Wednesday, May 14

Downloadable Slides and Webcasts from Recent Talks (most recent last)

"A Survey and Review of 2.5/3D IC Packaging Technologies" Herb Reiter, eda2asic Consulting, Inc. (1800 kB PDF)
"Power Semiconductor Packaging and System-on-a-Substrate Power Technology" Nathan Zommer, IXYS Corporation (1.5 MB PDF)
"Directions in Device Packaging for Mobile Applications" Jan Vardaman, President, TechSearch Int'l. (450 kB PDF)
"Probing Interfacial Contact via MEMS-based Microinstrumentation" Roya Maboudian, UC-Berkeley (1.6 MB PDF)
"High-Performance Datacenter Platform: Using InP for Silicon Photonics" Dr. Michael Lebby, CEO, OneChip Photonics (4 MB PDF)
"Design, Manufacturing and Performance of a 3D Random Access Memory Subsystem" David Chapman, VP Marketing, Tezzaron Semiconductor, Inc. (900 kB PDF)
"MEMS and BioMEMS in Laminates" Professor Mark Bachman, University of California-Irvine (1.3 MB PDF)
"Advanced Package Migration to System-Level Integration" Curtis Zwenger, Amkor Technology, Inc. (1.7 MB PDF)
"A Comparison of Low-Cost Interposer Technologies" Terry Kang, Sr. Packaging Development Manager, Nvidia (1.3 MB PDF)
"One-Day Workshop: LED Lighting Explained" Rudi Hechfellner, Dr. Michiel Krueger, Seng-Hup Teoh, Philips Lumileds Lighting Company (3 MB PDFs)
Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

Chapter Newsletters:
Please download and print our Newsletter; pass it along to a non-member with an interest in materials and packaging technology.
* Summer 2011 -- 400 kB
* Summer/Fall 2010 -- 800 kB
* Winter/Spring 2010 -- 200 kB

Professional Skills Development and Management Classes:

Contact Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list for other spring classes.

  - Getting Things Done Across Organizational Borders [more]   March 20 at Tibco, Palo Alto     - Managing Time and Multiple Priorities - Self-Paced [more]   This On-line Course is accessible at any time.

Other IEEE Events around Silicon Valley and the SF Bay Area:

Please visit the Council's e-GRID website to see what interesting technical talks are being scheduled by other Chapters.

ExCom Members Login:
ExCom members may log into our Google Sites/Apps website.

See our listing of Past Meetings and Courses.
[Place yourself on our email distribution list or send a request to Paul Wesling.]


Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF). Please contact one of our officers or any of the members of our Program Committee with your proposal:
Officers:
Chapter Chair: Ed Aoki, Agilent Technologies, Retired
Vice Chair: Mudasir Ahmad, Cisco Systems
Treasurer: Azmat Malik
Secretary: Randall Brynsvold
Program Co-Chairs:
Dinner Meetings: Harvey Miller, InfraFocus, and Azmat Malik
Lunch Meetings: Sandra Winkler,
Program Support:
Hassan Ali
Ed Stoneham
Randall Brynsvold
Suzette Pangrle
Ed Stoneham
WebEx Webcasting: Mudasir Ahmad
A/V Support: Tom Tarter

Design Issues:
Oscar MahinFallah: EMC

Components Issues:
(vacant): embedded pasives design & fabrication

Packaging Issues:
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
(vacant): nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)

  Reliability and Qualification Testing:
Jim Krepelka, Agilent Technologies: Reliability, life, qualification testing

Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free

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