Upcoming Meetings and Webinars:

Sponsors Needed for STEM Internships for this Summer -- highschool tech students, funding, companies needed, summer workers, career development ...
ical Google outlook
Cupertino
Visualizing the Packaging Roadmap -- ITRS, Moore's Law, innovation, roadmaps, packaging issues, hi-performance computing, solutions ...
ical Google outlook
SEMI World Hdqtrs, Milpitas
Designing Plastic Parts for Multi-Jet Fusion vs Injection Molding + Tour -- tour, comparison, considerations, cost, schedule, quality, case study, HP Z3D camera ...
ical Google outlook
HP Inc, Palo Alto
High Density D2W DBI Hybrid Bonding for 2.5D/3D Applications -- chip-stacking, microbumps, issues, new process, low cost, sensors, MEMS, computing ...
ical Google outlook
SEMI World Hdqtrs, Milpitas

Instructions for Speakers


Explore our Past Meeting Topics

Educational Grant Program: Read about winners from SJSU, SF State and UC-Berkeley, and our funding at Ohlone Collge; download our Grant Application Form

Micromouse Packaging Award: prepare for this year’s MicroMouse contest!

Engineering for Female and Underrepresented Students (EFUS) Project: Chapter funding provided to Ohlone College

Support for STEM internships for high school tech students: in cooperation with local Rotary Clubs

Upcoming Conferences and Workshops:

Slides from Recent Talks:

FPGA Heterogeneous Packaging Applications: Trends and Challenges -- HPC, networking, cloud services, automotive, logic/memory integration, thermal, evolution ...
TI Conference Center, Santa Clara
The Road Ahead: Outlook for the Electronics Packaging Industry -- projections for AI, autonomous vehicles, crypto, OSATs, foundries, outlook ...
TI Conference Center, Santa Clara
2D to 3D Package Architectures: Back to the Future -- scaling, heterogeneous integration, impact on power, performance, latency, nomenclature for package architectures, current metrics, projections ...
TI Conference Center, Santa Clara
Trends and Transitions in Semiconductor Packaging -- business models, supply chain, technology requirements, forecast for 2018 and 2019 ...
TI Conference Center, Santa Clara
Heterogeneous Packaging Integration for Electronics Systems -- mobile products, system-on-chip, dissimilar chips, performance, cost, SiP, TSV, interposers, forecast ...
TI Conference Center, Santa Clara

Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

About our Chapter:

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