Who we are
Local evening IEEE meetings
for the month
(from the GRID Calendar)
Search IEEE XPLORE for on-line journal and conference papers
(<=== click on the map, for a better view)
We welcome you to Silicon Valley, the home of the
Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology
Society! We're quite active, with a regular series of Monthly Evening
Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.
Upcoming IEEE/CPMT Society Events
In the Santa Clara Valley
(Print out and post/circulate)
See our listing of Past Meetings and Courses.
|Monthly Technical Meetings:
(everyone is welcome!)
|Technical/Skills/Management Short Courses:
Meetings for 2016:
"FO-WLP - A Disruptive Technology: Drivers and Developments" -- E. Jan Vardaman, TechSearch International
-- lunch Tuesday, February 9
"Enabling Requirements for High Volume Thermocompression Bonding" -- Tom Strothmann, Director, Kulicke & Soffa Industries
-- lunch Thursday, February 25
"Photonic Systems Changes: Driving Innovation in Photonic Packaging" -- Dr. W. R. Bottoms, Third Millennium Test Solutions
-- lunch Tuesday, March 8
"Emerging IC Packaging Platforms for ICT Systems" -- Dr. Li Li, Distinguished Engineer, Cisco Systems, Inc.
-- lunch Thursday, March 24
"Recent Advances and Trends in Semiconductor Packaging" -- Dr. John H. Lau, Sr. Technical Advisor, ASM
-- lunch Tuesday, April 12
Other IEEE Events around Silicon Valley and the SF Bay Area:
Please visit the Council's e-GRID website to see what interesting technical talks are being scheduled by other Chapters.
Downloadable Slides and Webcasts from Recent Talks (most recent last)
"Advanced Packaging Techniques as Enablers for the Health IoT Ecosystem"
Andreas Middendorf, Erik Jung, Fraunhofer IZM (1.8 MB PDF)
"Packaging Materials Market Trends, Issues and Opportunities"
Dr. Dan Tracy, SEMI (1 MB PDF)
"Embedded Microdevices: A New Way To Build Low-cost, 3D, Integrated MEMS Devices"
Prof. Mark Bachman, UC-Irvine (1.3 MB PDF)
"Considerations for Advancing Technology in Computer System Packaging"
Dale Becker, Ph.D., IBM (1.8 MB PDF)
"Chips 'Face-Up' Panelization Approach for Fan-Out Packaging"
Boyd Rogers, Deca Technologies, Inc. (1 MB PDF)
"Void formation during Soldering"
Watson Tseng, Shenmao America Inc. (2 MB PDF)
"Anisotropic Conductive Film (ACF) Interconnection Technology for Wearable Electronics Applications"
Prof. Kyung W. Paik, KAIST (3.5 MB PDF)
Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.
[Place yourself on our email distribution list or send a request to
Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF).
Please contact one of our officers or any of the members of our Program Committee with your proposal: