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Resources:
Who we are
Joining CPMT
Chapter Chair
Chapter Officers
The Olympic Torch
Local evening IEEE meetings
for the month
(from the GRID Calendar)
Search IEEE XPLORE for on-line journal and conference papers
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(<=== click on the map, for a better view)
We welcome you to Silicon Valley, the home of the
Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology
Society! We're quite active, with a regular series of Monthly Evening
Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.
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Upcoming IEEE/CPMT Society Events
In the Santa Clara Valley
(Print out and post/circulate)
Monthly Technical Meetings:
(everyone is welcome!)
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Technical/Skills/Management Short Courses:
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Meetings for 2009:
"License to Speed: Extreme Bandwidth Packaging"
Sean Cahill, VP-Technology, BridgeWave Communications
-- lunch/tour Thursday, June 25
"Molecular Modification of PCB Substrates for Fine Line Patterning"
Werner Kuhr, Ph.D., ZettaCore, Inc.
-- dinner Wednesday, September 9
"Nanopackaging: Nanotechnologies in Microelectronics Packaging"
James E. Morris, Department of Electrical & Computer Engineering, Portland State University
-- dinner Wednesday, November 11
Downloadable Slides from Recent Talks (most recent last)
"Wafer Level Packaging – Next Turn in the Road", Dr. Thomas Di Stefano, Centipede Systems (550 kB PDF)
"Is Cu Wirebonding for Real?", Amy Low, Heraeus Inc. (550 kB PDF)
"Flexible Displays: Market and Manufacturing Issues (and solutions)", Dr. Paul S. Drzaic, Drzaic Consulting Services (1.5 MB PDF)
"Non-Contact Wafer Testing and High Performance, Low Power I/O Chip-to-chip Communications", Christopher Sellathamby, Scanimetrics (900 kB PDF)
"Sustainable IT Ecosystem: Components and Packaging Implications", Chandrakant Patel, HP Laboratories (800 kB PDF)
"Finding the Missing Memristor", Dr. Stanley Williams, HP Laboratories (800 kB PDF)
"Trends in IC Packaging and Multicomponent Packaging", Sandra Winkler, Electronic Trend Publications (600 kB PDF)
Other Slides from Past Talks: See the CPMT Members-Only website.
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Professional Skills Development and Management Classes:
Contact
Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list
for other Spring classes.
Managing Time and Multiple Priorities
[more]
- May 13 at Brocade, San Jose
Strategic Thinking at the Functional Level
[more]
- May 14 at Informatica, Redwood City
Presentation Skills
[more]
- June 3 at TIBCO Software, Palo Alto
Clear Business, Technical, and E-Mail Writing
[more]
- June 17 at Informatica, Redwood City
Transitioning from Individual Contributor to Manager
[more]
- June 18 at Cypress Semiconductor, San Jose
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See our listing of Past Meetings and Courses.
[Place yourself on our email distribution list or send a request to
Paul Wesling.]
Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF).
Please contact one of the members of our Program Committee with your proposal:
Harvey Miller, Program Chair, Dinner Meetings
Sandra Winkler, Program co-Chair, Luncheon Meetings
Ed Aoki, Program co-Chair, Luncheon Meetings
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Design Issues:
Bobby Altaf: Chip/package co-design, signal integrity
Mark Montrose: EMC and safety
Components Issues:
(vacant): embedded pasives design & fabrication
Packaging Issues:
John Jackson: Flip Chip and CSP
Allen Earman: Lakeland Photonics
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
Ephraim Suhir: nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)
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Reliability and Qualification Testing:
Ephraim Suhir: product development, life, qualification testing
Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Annette Teng:
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free
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