Upcoming Meetings and Webinars:

Design And Materials Challenges For Cost-Effective High-Performance LEDs (TY Hin) -- solid state lighting, design, materials, processes, challenges, innovative approaches ...
ical Google outlook
(on the Internet)
Heterogeneous Integration for the Aerospace and Defense Sectors (Jeff Demmin) -- specific challenges, extreme performance, security, low volumes, roadmap ...
ical Google outlook
(on the Internet)
Integrated Power: A Virtual Panel Session -- miniaturized power supplies, Power Systems on Chip (PSoC), integrated magnetics, switched-capacitors, options ...
ical Google outlook
(on the Internet)
Ribbon Alumina Laminate for PCBs and Substrates (Tim Orsley) -- attributes, homogeneous, signal skew, loss tangent, stresses, drilling, process flow ...
ical Google outlook
(on the Internet)
The Decade of Materials: Novel Materials for the Connected Digital World (Waguih Ishak) -- materials for electronic, RF, photonic applications for 5G, displays, life sciences ...
ical Google outlook
(on the Internet)
Virtual Symposium on Reliability for Electronics and Photonics Packaging -- Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh) ...
from to
ical Google outlook
(on the Internet)

Instructions for Speakers


Explore our Past Meeting Topics

Educational Grant Program: Read about winners from SJSU, SF State and UC-Berkeley, and our funding at Ohlone Collge; download our Grant Application Form

Micromouse Packaging Award: prepare for this year’s MicroMouse contest!

Engineering for Female and Underrepresented Students (EFUS) Project: Chapter funding provided to Ohlone College

Support for STEM internships for high school tech students: in cooperation with local Rotary Clubs

Upcoming Conferences and Workshops:

Virtual Symposium on Reliability for Electronics and Photonics Packaging -- Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh) ...
from to
ical Google outlook
(on the Internet)

Slides from Recent Talks:

Packaging of Electronics for Medical, Health and Wearables Applications -- heterogeneous integration, advance packaging, new materials, assembly technologies, forecasts ...
(on the Internet)
Heterogeneous Integration for High-Performance Computing and Data Centers -- die-size limitations, chiplets, new and emerging applications, potential solutions, longer term challenges ...
(on the Internet)
Heterogeneous Integration Roadmap: Driving Force and Enabling Technology for Systems of the Future -- intro to HIR, structure, highlights, examples from chapters, how to download and use ...
(On the Internet)
Visualizing the Packaging Roadmap -- ITRS, Moore's Law, innovation, roadmaps, packaging issues, hi-performance computing, solutions ...
SEMI World Hdqtrs, Milpitas
FPGA Heterogeneous Packaging Applications: Trends and Challenges -- HPC, networking, cloud services, automotive, logic/memory integration, thermal, evolution ...
TI Conference Center, Santa Clara

Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

About our Chapter:

Officers and Volunteers
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