Upcoming Meetings and Webinars:

How to Peel Ultra-Thin Dies from Wafer Tape -- bending stress, die strength, peel force, die structures, wafer processing steps, TSVs, pickup methods, experimental verification ...
ical Google outlook
TI Conference Center, Santa Clara
Heterogeneous Packaging Integration for Electronics Systems -- mobile products, system-on-chip, dissimilar chips, performance, cost, SiP, TSV, interposers, forecast ...
ical Google outlook
TI Conference Center, Santa Clara

Instructions for Speakers


Explore our Past Meeting Topics

Educational Grant Program: Read about winners from SJSU, SF State and UC-Berkeley, and our funding at Ohlone Collge; download our Grant Application Form

Micromouse Packaging Award: prepare for this year’s MicroMouse contest!

Engineering for Female and Underrepresented Students (EFUS) Project: Chapter funding provided to Ohlone College

Upcoming Conferences and Workshops:

Slides from Recent Talks:

Comparison of Die Singulation Techniques -- die thinning, stealth laser, laser abrasion, plasma etch, rotary blade, results ...
TI Conference Center, Santa Clara
Ten Years of Robustness Validation Applied to Power Electronics Components -- European car makers, physics of failure, "test to fail", end-of-life testing, thick wire bonds, planar interconnects ...
TI Conference Center, Santa Clara
Developing Technology for Autonomous Vehicles and Electric Cars: The Next Platform — half-day Workshop: automotive environment, materials, packaging, devices for 5G, LiDAR, RADAR ...
TI Conference Center, Santa Clara
Intel Silicon Photonics: From Research to Product -- optical, SiPh, standard silicon processing, performance, low-cost, optical100G transceiver ...
TI Conference Center, Santa Clara
Advances in Low Cost/High Reliability Lead-Free Solder Materials -- solder's role, compositions, properties, Ag content, optimum cost/reliability, failure modes ...
TI Conference Center, Santa Clara

Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

About our Chapter:

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