Embedding and Miniaturization in Electronics Packaging 🗓 🗺

— market needs, form-factors. wearables, cameras, consumer electronics, power converters …

— market needs, form-factors. wearables, cameras, consumer electronics, power converters …
Speaker: Wolfram Zotter, Sales Engineering, AT&S Americas LLC
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Presentation Slides: “Embedding and Miniaturization in Electronics Packaging” (1.6 MB PDF)
Meeting Date: Tuesday, August 9, 2016
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members. students, unemployed, $10 non-members

Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Reservations: 1608l1cpmt.eventbrite.com
Summary: Miniaturization is quite a topic these days but it’s far more than simply shrinking form-factors. Accommodating market needs featuring products like Wearables, Cameras, Consumer electronics, Power converters and many more applications require additional features such as solutions for form-factor, reliability, thermal needs and efficiency improvements. Within this talk we will see how embedding technology (ECP) can cater to those needs as well as why it can solve and help with individual and very specific needs.

Bio: Wolfram Zotter is currently heading the US Engineering group within AT&S Americas LLC. This group takes Field-application-engineering responsibilities and also involves in technology and solution promotion. Wolfram started at AT&S in 2002 responsible for production front-end, where he was able to gather basic know-how and experience. Later he was involved and lead teams within AT&S across multiple locations globally and made sure that market needs would be addressed with proper technologies. Since moving to the US in 2008 he has been heavily engaged with local OEMs as well as CEMs and ODMs.

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