Roll-to-roll Manufacturing in Electronics: Making it Work

— charge-array, deposition, registration, evolution, flip-chip and TFTs …

Speaker: Peter C Salmon, Salmon Engineering
Presentation Slides: “Roll-to-roll Manufacturing in Electronics: Making it Work” (1 MB PDF)
Meeting Date: Tuesday, January 10, 2016
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members, students, unemployed; $10 non-members
Location: (Download MAP) Texas Instruments Building C, Big Sur Room, 3689 Kifer Rd, Santa Clara


Summary: A new concept for roll-to-roll fabrication is presented. A key component of each deposition station in the proposed roll-to-roll system is a charge-array wafer. The charge-array wafer enables two disruptive innovations: 1) “active registration” wherein the target substrate is continually seeking precise alignment, even as it moves through a deposition station; and 2) electronic programming of the desired pattern for each deposition layer.
A potential product evolution is described, beginning with flexible printed circuits (FPCs) having 1-mil line and space. Then FPCs with embedded passives, Hybrid Electronic Systems (HES) having attached flip chips, and finally complex electronic systems incorporating FPCs, embedded passives, flip chips, and thin-film transistors. The complex systems may include novel structures that are not currently found on PCBs.

Bio: Peter Salmon received his BE degree in Electrical Engineering from Auckland University, New Zealand. He emigrated to the United States and obtained MSEE and EE degrees at Northeastern University. He has enjoyed an eclectic career, including 10 years at Intel and Fairchild Semiconductor as a chip designer, 10 years at TRW and GTE as a systems engineer for large defense systems, almost 10 years founding startup companies involving thermal and electrostatic printing technologies, and a few more years as an engineering consultant and expert witness. He is a co-founder of i-Blades, Inc. which is pioneering new markets in attachments to smart phones; he developed the base technology for magnetic and electrical coupling. He has been awarded a first patent on his roll-to-roll technology, and a second one is pending.

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