Heterogeneous Integration Roadmap Symposium 🗓

— 1-day — old ITRS, strategic directions, packaging solutions, SiP, heterogeneous integration, exhibits, reception …

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Symposium Date: Monday, November 14, 2016
Time: 8:00 AM – 6:30 PM
Cost: $500 IEEE members, $600 non-members
Location: Holiday Inn San Jose
Reservations: www.meptec.org/roadmaps
Summary: The IEEE CPMT Society took the initiative to establish a technology roadmap focused on heterogeneous integration, to be modeled after the ITRS in purpose, structure, and governance. This initiative quickly found resonance with SEMI, and the IEEE Electron Devices Society (EDS) joined the effort, resulting in the launch of the Heterogeneous Integration Roadmap (HIR). Please consider attending this first 1-day Symposium with the following sessions:
MORNING SESSION: Strategic Directions in Heterogeneous Integration
AFTERNOON SESSION: Innovations in SiP and Integration
PANEL DISCUSSION: Packaging Solutions to Meet Needs of the Heterogeneous Integration Roadmap
Reception and Networking: 5:00 PM – 6:30 PM
SPEAKERS/PANELISTS: Bill Bottoms (3rd Millenium), Bill Chen (ASE), Eelco Bergman (ASE), Tom Coughlin (Coughlin Assoc), Daniel Green (DARPA), Anders Grunnet-Jepsen (Intel), Subramanian Iyer (UCLA), Andrew Kahng (UC-SD), Lionel Kimmerling (MIT), Li Li (Cisco), David McCann (GlobalFoundries), Igino Padovani (Robert Bosch), Gamal Refai-Ahmed (SUNY), Brandon Wang (Cadence).

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