Comparison of Die Singulation Techniques 🗓 🗺

— die thinning, stealth laser, laser abrasion, plasma etch, rotary blade, results …

Speaker: Dr. Annette Teng, Chief Technology Officer, Promex Industries
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Presentation Slides: “Comparison of Singulation Techniques” (5 MB PDF)
Meeting Date: Thursday, September 28, 2017
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members. students, unemployed, $10 non-members

Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Reservations: 1709bcpmt.eventbrite.com
Summary: Wafer thinning and singulation is a critical process for successful miniaturization and high density packaging. A comparison of the latest die singulation techniques will be presented based on dicing yields and cost. These include stealth laser, laser abrasion, plasma etch and conventional rotary blade. Some results of stealth laser on singulated II-VI and III-V type dies will be presented in collaboration with Disco.


Bio: Annette Teng is currently the Chief Technology Officer at Promex Industries, which is a fast-turn subcontractor located in Silicon Valley. She has previously worked in components packaging and assembly at Philips Semiconductor, Linear Technology and Corwil Technology. Prior to joining Promex, she was Package Assembly Manager at Silanna in Australia for 3 years. She also worked at the Hong Kong University of Science and Technology to initiate their electronics packaging programs in 1997 to 2000. She has been active in IEEE-EPS (CPMT) activities locally and overseas. She is currently the Chair of the IEEE-EPS (CPMT) Santa Clara Valley/Bay Area Chapter.
She graduated with a Ph.D. in Materials Engineering from University of Virginia after receiving a BS from Sweet Briar College.

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