Heterogeneous Integration Roadmap Symposium 🗓 🗺

— reinvention, disruptive changes, new materials, emerging processes, vision, pace of change …

Moderators: Dr. William Chen, ASE (Chair, HIR; past EPS President); Dr. Bill Bottoms, 3MTS (Co-chair, HIR)
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Symposium Date: Thursday, February 22, 2018
Time: 9:00 AM to 4:30 PM
Cost: $40 IEEE members. students, unemployed, $50 non-members ($10 more, after Feb. 9th)

Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Reservations: 1802symp-eps.eventbrite.com
Program Outline:
— Presentations from HIR Technical Working Group chairs
— Overview from HIR International Roadmap Committee
— Panel Session including Open Discussion

Summary: The Heterogeneous Integration Roadmap (HIR), jointly sponsored by the IEEE EPS, EDS and Photonics Societies, SEMI, and ASME EPPD, will introduce its first edition. HIR is founded on our belief that heterogeneous integration represents the low-hanging fruit to maintain the future progress no longer supported by CMOS scaling.
Everything in our lives is changing. In responding to these disruptive changes, we have selected representative applications for specific markets. They are:
— Mobile
— High Performance Computing
— IoT and Wearable
— Medical and Health
— Automotive


This Heterogeneous Integration Roadmap will expand the vision to address systems and applications, disruptive changes in the marketplace, fast-paced changes in technology and the industry, and their associated impact on research directions. We invite you to attend this symposium for our profession, our industry and our research and academic community.


Bio: William (Bill) Chen currently holds the position of ASE Fellow and Senior Technical Advisor at ASE Group. Prior to joining ASE, he was the Director at the Institute of Materials Research & Engineering in Singapore. Bill retired from IBM Corporation after a career spanning over thirty years in various R&D and managerial positions. He has held adjunct and visiting faculty positions at Cornell University, Hong Kong University of Science and Technology, and Binghamton University. Bill is the chair of the newly formed Heterogeneous Integration Technology Roadmap for Semiconductors, an initiative addressing technologies for the oT/IoE/cloud computing era, jointly sponsored by IEEE EPS, EDS, Photonics Societies, ASME’s EPPD, and SEMI. He also chairs SEMI’s Advanced Packaging Committee. In 2009, Bill received the InterPACK Excellence Award for his contributions, and in 2010, he was presented with the IEEE EPS Society David Feldman Outstanding Contribution Award. He is a past President of the IEEE EPS Society and he has been elected a Fellow of IEEE and a Fellow of ASME. Bill received his B. Sc. from London University, M.Sc. from Brown University and Ph.D. from Cornell University.


Bio: Dr. W. R. “Bill” Bottoms, the holder of a Ph.D. from Tulane University, has an extensive background in academia, venture funding, and in the commercial semiconductor equipment sector. Since founding 3MTS in 1999, Bill Bottoms has provided strategic leadership and vision in keeping with the promise of the 3MTS business model. Dr. Bottoms has also served on a number of important government and industry committees and advisory positions. Key posts include chairmanship of the subcommittee of the Technical Advisory Committee of the United States Commerce Department’s Export Control Commission for Semiconductor Equipment and Materials.
Shortly after receiving his doctorate in physics, Dr. Bottoms joined the electrical engineering faculty of Princeton University, where he remained until 1976. He then joined Varian Associates in Palo Alto, as manager of research and development, and he was later named president of Varian’s newly formed semiconductor equipment group. After leaving Varian, he was senior vice president and general partner at Patricof & Co. Ventures, Inc., an international venture capital firm. He founded Third Millennium Test Solutions in March 1999.

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