Reliability for the 21st Century: Meeting Challenges of New Packaging Technologies and New Markets 🗓 🗺

— complexity, feature sizes, physics of failure, damage metrics, packaging design, qualification, proposed methodologies …

Speaker: Dr. Milena Vujosevic, TDK-InvenSense
Meeting Date: Wednesday, April 25, 2018
Sponsors: EPS Chapter; Reliability Chapter; MEMS & Sensors Chapter
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members, students, unemployed; $10 non-members

Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara

Summary: Electronics components are constantly evolving, with new types of devices rapidly entering new markets. New technologies are significantly more complex than the technologies of the past, characterized by smaller features and heterogeneous integration. New markets, on the other hand, bring about new types of environments, new customer expectations and new usage models. Existing industry standards often do not provide sufficient guidance for qualification of new technologies. This requires packaging design and reliability practitioners to look beyond the existing reliability standards so that they make sure their components are designed correctly for the new field.
This talk discusses challenges with many standards-based approaches for definition of qualification requirements and proposes a methodology for overcoming those challenges. The proposed methodology leverages advanced tools of contemporary engineering to comprehend use conditions and failure physics. The special focus is on the essential role of the physics-based damage metrics in translating from use condition to test conditions and in design for reliability. Examples from the area of electronic packaging design and qualification published in the literature will be used to discuss the proposed methodology relative to the standards-based qualifications.

Bio: Dr. Milena Vujosevic is a senior technologist and manager with more then 20 years of experience in the semiconductor industry working in the areas of technology development, design, and reliability. She is a Senior Director for Advanced Packaging at TDK-InvenSense, which she joined early in 2018. She is responsible for MEMS sensors packaging technology and manufacturing covering multiple technologies: motion, pressure, ultrasonic sensors for mobile, automotive and drone applications. Before that she spent 13 years at Intel as a Principal Engineer and Sr. Manager working in Intel’s packaging and reliability organizations focusing on  pathfinding and development of advanced IC packaging. Prior to joining Intel she worked for Motorola in the area of MEMS sensors for automotive, medical and consumer electronics markets. Milena has published more then 60 papers, 3 book chapters and delivered multiple invited talks. She is a recipient of the 2011 ASME Woman Engineer of the Year award for significant achievements in the field of electronic and photonic packaging. Milena has a PhD in Mechanical Engineering.

TI Conference Center, Santa Clara Map