Flexible Hybrid Electronics: System as Package (Tour) 🗓

— forecasts, IoT implementation, additive processing, flex substrate, low cost, applications, plus tour …

Speaker: Wilfried Bair, VP-Engineering, NextFlex
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Meeting Date: Thursday, August 23, 2018
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 – 2:00 PM Presentation and Tour
Cost: $10 IEEE members, students, unemployed; $15 non-members (includes sandwich lunch)
Location: 2244 Blach Place # 150, San Jose
Reservations: 1808eps.eventbrite.com
Summary: According to an IEEE Spectrum report released in 2016, the connected Internet of Things world was, at the time, forecasted to consist of about 30 billion objects by 2020. This number is reduced by almost half compared to the 50 billion connected devices by 2020 forecast in 2010 by Ericsson and Cisco, and by over a third of the one trillion connected devices by 2020 forecast in 2012 by IBM. An underlying premise of the successfully connected IoT object world is that those devices are low cost and ubiquitous so that they can be easily deployed, and devices lacking these crucial factors have created a barrier against widespread IoT adoption. Flexible hybrid electronics (FHE) address these issues with two unique factors that traditional technology cannot provide: it uses additive processing to reduce manufacturing cost; and enables placement of devices on conformal, flexible or stretchable surfaces at low cost. Examples for industrial, medical, automotive and consumer markets will show how additive manufacturing, combined with flexible substrates, can deliver on the promise of the “electronics on everything.”


Bio: Wilfried holds advanced degrees in Manufacturing and Production Planning Systems, Organizational Development, and International Marketing from the University of Linz in Austria. He is Vice President of Engineering at NextFlex.

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2244 Blach Place # 150, San Jose Map