Edge Computing and Artificial Intelligence: What Electronics Packaging Engineers Need to Know 🗓 🗺

— edge computing, AI, connections, high-density packaging, challenges, opportunities …

Speaker: Mudasir Ahmad, Distinguished Engineer/Senior Director, Cisco Systems, Inc.
Meeting Date: Wednesday, October 10, 2018
Time: 11:30 AM Registration (and pizza/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $10 IEEE members, students, unemployed (free, for first 30); $15 non-members (free, for first 30)
Location: SEMI International, 673 S Milpitas Blvd, Milpitas (use side entrance)
Reservations: 1810eps.eventbrite.com
Summary: Advanced Networking Technology has been the key driver of internet traffic over the past two decades. It has spearheaded the prevalence of smartphones, big data, voice and video. The challenges and opportunities for advanced packaging in Networking Applications, IoT, Edge Computing and Artificial Intelligence will be outlined.
Networking is now driving the exponential growth of Internet of Things (IoT) — more devices and machines connected to each other and the internet. Key to delivering the IoT ecosystem is Edge Computing. As more devices are connected to each other, the latency and bandwidth of the connections between the devices becomes a critical bottleneck. Edge computing strives to balance the need for faster connectivity with the cost, resilience and scalability challenges of hyper-connected devices. In addition to enabling IoT, Networking is also driving the incorporation of Artificial Intelligence (AI) into IoT devices and in the network itself. AI is helping networks connect, repair and defend themselves, ensuring speed, scalability and security. In this talk, the key trends and challenges in Networking as they relate to IoT, Edge Computing and Artificial Intelligence will be presented, with a focus on packaging.

Bio: Mudasir Ahmad is a Distinguished Engineer/Senior Director at Cisco Systems, Inc. He has been involved with mechanical design, microelectronics packaging design and reliability analysis for 17 years. He received his M.S. in Management Science & Engineering at Stanford University, his M.S. degree in Mechanical Engineering from Georgia Institute of Technology and his Bachelors from Ohio University.
Mudasir is leading the Center of Excellence for Numerical Analysis, developing new analytical/stochastic algorithms, experimental design, thermal and reliability characterization of next generation 3D packaging, System-in-Package Modules and Silicon Photonics. Mudasir is also involved with implementing IoT, Artificial Intelligence and Big Data Analytics to streamline Supply Chain Operations. Mudasir has delivered several invited talks on leading technology solutions internationally.
Outside of Cisco, he is involved with programs at the Silicon Valley Chapter of the Electronics Packaging Society of the IEEE (EPS), and actively participates in IPC and JEDEC standards organizations. He was actively involved in the local EPS chapter of IEEE for several years, holding the positions of Secretary, Vice Chair and Chair of the Chapter.
Mudasir has over 30 publications on microelectronic packaging, two book chapters, and 13 US Patents. He received the internationally renowned Outstanding Young Engineer Award in 2012 from the IEEE.

673 South Milpitas Blvd, Milpitas Map