Speaker: E. Jan Vardaman, President, TechSearch International, Inc.
Presentation Slides: “The Road Ahead: Outlook for the Industry” (2 MB PDF)
Meeting Date: Monday, October 22, 2018
Time: 12:30 PM Registration, lunch, and presentation (ending at 2:30 PM)
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Summary: The semiconductor industry has seen record growth in the last few years, but with slowing growth in smartphone shipments and PC sales, what’s next? What will drive growth in advanced packaging? Is it Game Over for Cryptocurrency? Artificial Intelligence and automotive electronics are bright spots, but what types of packages will be used? How will OSATs benefit and what role will the foundry play? This presentation will examine economic and technology trends and provides an outlook for the industry.
Bio: Jan Vardaman is the editor of Surface Mount Technology: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia, and on the US mission to study manufacturing in China. She is a member of IEEE EPS, IMAPS, SMTA, and SEMI. She was elected to two terms on the IEEE EPS Board of Governors. She received her BA in Economics and Business from Mercer University in Macon, Georgia in 1979 and her MA in Economics from the University of Texas at Austin in 1981. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.