IEEE 69th Electronic Components and Technology Conference (ECTC) 🗓

— the best in packaging, components and microelectronic systems science, technology and education …

The IEEE Electronics Packaging Society’s premiere technology conference.
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Dates: May 28-31, 2019
Location: The Cosmopolitan of Las Vegas, Las Vegas, NV
ECTC is the premier international conference covering a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation. Includes short courses, 40 sessions, co-located with ITherm. Download the Advance Program.
Full information here: www.ectc.net

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