IEEE Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 🗓

— scientific and engineering exploration of thermal, thermomechanical and emerging technology issues …

The IEEE Electronics Packaging Society’s premiere thermal design/modeling conference.
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Dates: May 28-31, 2019
Location: The Cosmopolitan Hotel, Las Vegas, NV
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems. In addition to paper presentations and vendor exhibits, ITherm 2019 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses. Co-located with ECTC. Download the Advance Program.
Full information here: www.ieee-itherm.net

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