Speaker: Jie Xue, VP, Cisco
Meeting Date: Friday, October 25, 2019
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members, students, unemployed; $10 non-members
Location: SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas
Summary: This talk will cover the new industry roadmap for high speed optics for large scale datacenters, interconnects, and long-haul networking applications using Silicon Photonics technologies, as well as discuss challenges/opportunities in SiPh packaging to enable this roadmap and pave the path for eventual integration of Switching ASICs that include Optics (aka: In-Package Optics).
Bio: Jie Xue leads Cisco’s Technology and Quality organization, a global team responsible for anticipating, developing, and providing technology innovations in support of Cisco’s supply chain. The team drives a competitive advantage by ensuring innovation and excellence in manufacturing technology, test and component engineering, advanced technology development, closed-loop quality management, and product compliance. These range from 100G heterogeneous silicon photonics to high-speed connectors and 2.5D/3D technologies, advanced PCBs, thermal cooling solutions, and advanced algorithms for automated decision-making.
Jie is an Institute of Electrical and Electronics Engineers (IEEE) Fellow, an International Microelectronics Assembly and Packaging Society (IMAPS) Fellow, an IEEE-Electronics Packaging Society (EPS) Distinguished Lecturer and served as President of EPS from 2014 to 2015. As President of EPS, she spearheaded the rebranding and revitalization of the Society to keep pace with the evolving microelectronics industry. She is a published author of more than 90 technical papers, hold 12 patents, and has served as a keynote speaker for domestic and international conferences.