System in Package (SiP) for Miniaturized Electronics Modules: An Update 🗓 🗺

— miniaturized modules, technology landscape, requirements, solutions, flexible electronics …

Speaker: Dr. Dongkai Shangguan, Vice President – Technology, Design & Engineering, Flex
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Meeting Date: Wednesday, October 2, 2019
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members, students, unemployed; $10 non-members

Location: SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas
Reservations: 1910beps.eventbrite.com
Summary: This presentation will review the SiP technology landscape, and discuss various solutions and competency requirements, for miniaturized modules for system integration across market segments. Reliability considerations for miniaturized devices and materials requirements for high-frequency applications will be discussed. Development of flexible electronics modules will be discussed as well.


Bio: Dr. Dongkai Shangguan is currently Vice President for Advanced Manufacturing Engineering at Flex. Previously, he served as the Chief Marketing Officer of STATS ChipPAC. Early in his career, Dr. Shangguan spent 10 years with Ford Motor Co. and Visteon Corporation where he held various technical and management responsibilities, and then 11 years at Flextronics where he was Vice President of Advanced Technology and Engineering Leadership.
Dr. Shangguan is an IEEE Fellow and has served on the iNEMI Board of Directors, the IEEE CPMT Society Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the electronics industry, including the Outstanding Sustained Technical Contribution Award from IEEE CPMT, the William D. Ashman Achievement Award from IMAPS, Presidents Award from IPC, and Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers.
Dr. Shangguan received his Bachelor of Science degree in Mechanical Engineering from Tsinghua University, China; MBA degree from San Jose State University; and Ph.D. in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama. Dr. Shangguan has published two books, authored/co-authored 250 technical papers and articles, and has been issued over 20 patents.

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