Past Meetings and Webinars

See our Meetings and Classes Prior to 2016

Packaging of Electronics for Medical, Health and Wearables Applications -- heterogeneous integration, advance packaging, new materials, assembly technologies, forecasts ...
(on the Internet)
Design for Reliability and Accelerated Testing in Electronics and Photonics Packaging Engineering -- improved reliability, critical applications, product lifetime, DfR, HALT ...
on the Internet
Integrated Photonics for Heterogeneous Integration -- design, analysis, current capabilities, challenges ...
On the Internet
Co-Design for Heterogeneous Integration -- electrical, thermal, mechanical, chip-package-board, design flow, new tools ...
(On the Internet)
Modeling and Simulation for Heterogeneous Integration -- enabling technologies, tools, chip-package-board-system domains, challenges ...
On the Internet
Test Technology for Heterogeneous Integration -- test cost, complexity, density, integration, performance, challenges ...
on the Internet
Heterogeneous Integration for High-Performance Computing and Data Centers -- die-size limitations, chiplets, new and emerging applications, potential solutions, longer term challenges ...
(on the Internet)
Thermal Management Challenges and Opportunities for Heterogeneous Packages -- cooling requirements, advanced concepts, thermal challenges, active research areas, HI Roadmap ...
(on the Internet)
Heterogeneous Integration Roadmap: Interconnects for 2D and 3D Architectures -- definitions, evolution, key metrics, bandwidth, power delivery, signaling ...
SEMI World Hdqtrs, Milpitas
Heterogeneous Integration Roadmap: Driving Force and Enabling Technology for Systems of the Future -- intro to HIR, structure, highlights, examples from chapters, how to download and use ...
(On the Internet)
Recent Advances and Outlook for Heterogeneous Integration -- integrating dissimilar chips, 2.5 and 3D, various substrates, new processes, time-to-market, cost ...
SEMI World Hdqtrs, Milpitas
Heterogeneous Integration Roadmap: 3rd Annual Meeting -- future of mobile, HPC, automotive, 5G, health, Chiplets, work on 2020 Roadmap ...
from to
Samsung Auditorium, San Jose
Trends and Opportunities in Silicon Photonics Packaging for Networking Applications -- SiPh packaging, large-scale data centers, interconnects, long-haul networking, Roadmap, integration ...
(SEMI World Hdqtrs, Milpitas)
IoT and PoE: An Overview, Applications and Future Directions -- sensors, hardware, data centers, App connections, new services, increased power, heat density ...
SEMI World Hdqtrs, Milpitas
System in Package (SiP) for Miniaturized Electronics Modules: An Update -- miniaturized modules, technology landscape, requirements, solutions, flexible electronics ...
SEMI World Hdqtrs, Milpitas
Advanced Packaging Trends & Electronic Materials in Era of Digital Transformation -- integration technologies, new applications, trends in 5G, Artificial Intelligence, IoT, autonomous driving ...
SEMI World Hdqtrs, Milpitas
3D X-ray Characterization; High Density Hybrid Bonding for 2.5D/3D Applications -- chip-stacking, microbumps, issues, new process, low cost, sensors, MEMS, computing ...
SEMI World Hdqtrs, Milpitas
Designing Plastic Parts for Multi-Jet Fusion vs Injection Molding + Tour -- tour, comparison, considerations, cost, schedule, quality, case study, HP Z3D camera ...
HP Inc, Palo Alto
Visualizing the Packaging Roadmap -- ITRS, Moore's Law, innovation, roadmaps, packaging issues, hi-performance computing, solutions ...
SEMI World Hdqtrs, Milpitas
Sponsors Needed for STEM Internships for this Summer -- highschool tech students, funding, companies needed, summer workers, career development ...
Cupertino
Heterogeneous Integration Roadmap 2-Day Symposium -- 2nd Annual, intro to HIR v1.0, overviews, integration, working groups, participation ...
from to
SEMI Hdqtrs, Milpitas
Advanced Packaging: A Perspective on 2D and 3D Architectures -- heterogeneous integration, drivers, evolution, density, options, developments needed, scaling ...
SEMI World Hdqtrs, Milpitas
System Assembly using a Microchip Printer -- chiplets, electrostatic assembly, sort, transport, roll-based, planarization, interconnect, HI ...
TI Conference Center, Santa Clara
Holistic Design in Optical Interconnects -- high-performance, bandwidths, power budget, low-cost approaches, photonics co-design ...
TI Conference Center, Santa Clara
Improving the IEEE: Issues, Ideas, Best Practices -- listening session, better methods/tools, local needs, actionable, with Division Director ...
Santa Clara Univ, Santa Clara