Past Meetings and Webinars

See our Meetings and Classes Prior to 2016

Holistic Design in Optical Interconnects -- high-performance, bandwidths, power budget, low-cost approaches, photonics co-design ...
TI Conference Center, Santa Clara
Improving the IEEE: Issues, Ideas, Best Practices -- listening session, better methods/tools, local needs, actionable, with Division Director ...
Santa Clara Univ, Santa Clara
TSV and FOWLP Reliability Challenges: Overview -- webinar: plating, wafer thinning, backside interconnect, refinements, failure mechanisms, mitigations ...
(on the Internet)
Achieving High Reliability for Lead-Free Solder Joints: Materials Considerations -- webinar: IMCs, aging, failure modes, thermal cycling, novel alloys, combinations, selection ...
(on the Internet)
FPGA Heterogeneous Packaging Applications: Trends and Challenges -- HPC, networking, cloud services, automotive, logic/memory integration, thermal, evolution ...
TI Conference Center, Santa Clara
10th Annual IEEE EPS SCV Soft Error Rate (SER) Workshop -- alpha upset, materials selection, process control, tutorial, test facilities, case studies ...
Xilinx, San Jose
The Road Ahead: Outlook for the Electronics Packaging Industry -- projections for AI, autonomous vehicles, crypto, OSATs, foundries, outlook ...
TI Conference Center, Santa Clara
Edge Computing and Artificial Intelligence: What Electronics Packaging Engineers Need to Know -- edge computing, AI, connections, high-density packaging, challenges, opportunities ...
673 South Milpitas Blvd, Milpitas
Tour of Nvidia's Space-Age Showroom and Technology -- tour, review of Nvidia product line ...
at Nvidia, Santa Clara
Flexible Hybrid Electronics: System as Package (& Tour) -- forecasts, IoT implementation, additive processing, flex substrate, low cost, applications, plus tour ...
2244 Blach Place # 150, San Jose