Past Meetings and Webinars

See our Meetings and Classes Prior to 2016

Towards Energy Sustainability in Data Centers: Some Thoughts on Energy, Entropy, and Water -- powering the internet and cloud, cooling, energy use, data center design, non-traditional approaches ...
TI Conference Center, Santa Clara
IoT Energy Harvesting -- integration, power requirements, ambient energy sources, scavenging, key design issues/challenges ...
on the Internet
2D to 3D Package Architectures: Back to the Future -- scaling, heterogeneous integration, impact on power, performance, latency, nomenclature for package architectures, current metrics, projections ...
TI Conference Center, Santa Clara
Reliability for the 21st Century: Meeting Challenges of New Packaging Technologies and New Markets -- complexity, feature sizes, physics of failure, damage metrics, packaging design, qualification, proposed methodologies ...
TI Conference Center, Santa Clara
A Moore's Law for Packaging -- webinar: silicon scaling, imbalance with packaging, interconnect densities, new substrates, AI, medical applications ...
On the Internet
Heterogeneous Integration Roadmap Symposium -- end of CMOS scaling, difficult challenges, potential solutions, future vision, research, academia, labs, collaboration ...
TI Conference Center, Santa Clara
Trends and Transitions in Semiconductor Packaging -- business models, supply chain, technology requirements, forecast for 2018 and 2019 ...
TI Conference Center, Santa Clara
Multi-Die Heterogeneous Integration: Design Considerations and Technology Demonstrations -- Webinar - multi-die integration, 2.5D and 3D, Heterogeneous Interconnect Stitching Technology, monolithic-like performance ...
on the Internet
Heterogeneous Packaging Integration for Electronics Systems -- mobile products, system-on-chip, dissimilar chips, performance, cost, SiP, TSV, interposers, forecast ...
TI Conference Center, Santa Clara
How to Peel Ultra-Thin Dies from Wafer Tape -- bending stress, die strength, peel force, die structures, wafer processing steps, TSVs, pickup methods, experimental verification ...
TI Conference Center, Santa Clara