Past Meetings and Webinars

See our Meetings and Classes Prior to 2016

Edge Computing and Artificial Intelligence: What Electronics Packaging Engineers Need to Know -- edge computing, AI, connections, high-density packaging, challenges, opportunities ...
673 South Milpitas Blvd, Milpitas
Tour of Nvidia's Space-Age Showroom and Technology -- tour, review of Nvidia product line ...
at Nvidia, Santa Clara
Flexible Hybrid Electronics: System as Package (& Tour) -- forecasts, IoT implementation, additive processing, flex substrate, low cost, applications, plus tour ...
2244 Blach Place # 150, San Jose
Towards Energy Sustainability in Data Centers: Some Thoughts on Energy, Entropy, and Water -- powering the internet and cloud, cooling, energy use, data center design, non-traditional approaches ...
TI Conference Center, Santa Clara
IoT Energy Harvesting -- integration, power requirements, ambient energy sources, scavenging, key design issues/challenges ...
on the Internet
2D to 3D Package Architectures: Back to the Future -- scaling, heterogeneous integration, impact on power, performance, latency, nomenclature for package architectures, current metrics, projections ...
TI Conference Center, Santa Clara
Reliability for the 21st Century: Meeting Challenges of New Packaging Technologies and New Markets -- complexity, feature sizes, physics of failure, damage metrics, packaging design, qualification, proposed methodologies ...
TI Conference Center, Santa Clara
A Moore's Law for Packaging -- webinar: silicon scaling, imbalance with packaging, interconnect densities, new substrates, AI, medical applications ...
On the Internet
Heterogeneous Integration Roadmap Symposium -- end of CMOS scaling, difficult challenges, potential solutions, future vision, research, academia, labs, collaboration ...
TI Conference Center, Santa Clara
Trends and Transitions in Semiconductor Packaging -- business models, supply chain, technology requirements, forecast for 2018 and 2019 ...
TI Conference Center, Santa Clara