Past Meetings and Webinars

See our Meetings and Classes Prior to 2016

Mold Compound Interactions in Cu-Al Wirebonded ICs Operating in Harsh Environments -- high reliability, intermetallic growth, bond interface, formulations, temperature, bias, predictive model ...
TI Conference Center, Santa Clara
Automotive Sensor Packaging Trends -- self-diagnostics, crash avoidance, driver assistance, image sensors, LiDAR, radar, challenges ...
(on the Internet)
Comparison of Die Singulation Techniques -- die thinning, stealth laser, laser abrasion, plasma etch, rotary blade, results ...
TI Conference Center, Santa Clara
3D Printing in Electronics Packaging: Hype, Hope, or Happening? -- design tools, materials, 3D-printing processes, micro-assembly systems, deposit, cure, embedded components ...
(on the Internet)
Recent Progress in Memory Technology Reliability -- higher performance, densities, novel materials, cell to packaging level, failure modes, underlying physics ...
TI Conference Center, Santa Clara
Probabilistic Design for Reliability in Electronics and Photonics -- accelerated testing, stressors, vulnerable elements, sensitivity analyses, predictive modeling, robustness, assured levels ...
(on the Internet)
System-Level ESD: A New Focus -- qualification, high-pin-count packages, ESD target levels, co-design, protection challenges, system-efficient ESD design ...
TI Conference Center, Santa Clara
SEMICON/West sessions: The Package is the System ... and Enabling Advanced Applications — complimentary admission, Expo, CPMT-organized sessions, keynotes, panels ...
from to
Moscone Center, S.F.
The Future of Additive Manufacturing of Radio-Frequency Components -- 3D printing, raw materials, deposition, effects on design, agile, state of practice ...
(on the Internet)
Ten Years of Robustness Validation Applied to Power Electronics Components -- European car makers, physics of failure, "test to fail", end-of-life testing, thick wire bonds, planar interconnects ...
TI Conference Center, Santa Clara