Summaries of presentations for this afternoon Workshop on March 24, 2017:
|The New Era of Automotive Electronics: The Ultimate Electronics System||prof. Rao R Tummala, GaTech/NSF Packaging Research Center (PRC)
Georgia Institute of Technology, Atlanta, GA, USA
|The new era of automotive electronics such as autonomous driving, in-car smartphone-like infotainment, privacy and security, high-speed and high-bandwidth computing and all-electric cars, require an entirely different vision than is pursued today. Georgia Tech sees unprecedented challenges and opportunities to address these needs and proposes a systematic approach to system scaling, innovative device and package architectures and heterogeneous integration for the new era in automotive electronics hardware with particular focus in electrical, mechanical and thermal designs and new digital, RF, millimeter wave, radar, LiDAR camera, high power and high-temperature electronics technologies.
The challenges in this new era of automotive electronics are many, and include not only new technologies but also an educated workforce, supply-chain manufacturing, roadmaps and standards. This presentation will describe this new era of automotive electronics needs, challenges as well as review the state of the art in R&D and in manufacturing.
|2.5D Glass Interposers and High Bandwidth Computing||Dr. Venky Sundaram and Prof. Rao Tummala, Georgia Tech|
|2.5D and 3D integration, Large panel processing, low cost interposers, 1-2um multilayer RDL, fine pitch through glass vias, 20-40um I/O pitch, low temperature and pressure Cu-Cu TCB, high throughput TCB and SLID bonding, board-level reliability, SMT mountable large body size interposers, compliant interconnections, data centers, graphics, deep learning, servers, split die.
|Low- and Medium-Power Electronics||Dr. Raj Pulugurtha, Prof Rao Tummala, Georgia Tech|
|IVR; DC-DC converters; Substrate-embedded inductors, transformers and capacitors, high-temp and high-voltage capacitors.
|GaN and SiC devices, high-power die attach, nano-copper foams, sintered copper interconnections, thermal management, high-power substrates, substrate-embedded power devices.
|5G Communications with Glass Embedding and Fanout||Prof. Emmanouil Tentzeris, Dr. Venky Sunraram and Dr. Raj Pulugurtha, Georgia Tech|
|Advanced 5G substrates, package-integrated antennas, low-loss and precise 5G transmission lines and passive components, glass fanout packaging, precision copper RDL processes, ultra-thin packages, ultra-low-loss dielectrics, connectivity, infotainment.
|Devices and 3D Glass Fanout Package for Next Generation RADAR, LiDAR and Camera||Dr. Venky Sundaram, Dr. Chris Valenta, Prof. Peter Hesketh and Prof. John Cressler, Georgia Tech|
|Camera, RADAR, LiDAR, sensor fusion, high-bandwidth computing, SiGe devices, glass fanout packaging, integrated camera/RADAR modules, low-cost and miniaturized LiDAR packaging, hermetic and near-hermetic glass packages for sensors, design for ASIL D safety standards, design for AEC-Q100 reliability.
|High-Power and High-Temperature Electronics for Electric Cars||Prof. Shyh-Chaing Shen, Dr. Vanessa Smet and Dr. Raj Pulugurtha, Georgia Tech|
|GaN and SiC devices, high-power die attach, nano-copper foams, sintered copper interconnections, thermal management, high-power substrates, substrate-embedded power devices. Packaging for 150-250 C junction and ambient temperatures, high-temperature dielectrics and mold compounds, high-temperature substrates and fan-out packages.