Upcoming Events

We invite all interested technologists to attend an upcoming Chapter meeting. Select from those below:

How to Peel Ultra-Thin Dies from Wafer Tape -- bending stress, die strength, peel force, die structures, wafer processing steps, TSVs, pickup methods, experimental verification ...
ical Google outlook
TI Conference Center, Santa Clara
Heterogeneous Packaging Integration for Electronics Systems -- mobile products, system-on-chip, dissimilar chips, performance, cost, SiP, TSV, interposers, forecast ...
ical Google outlook
TI Conference Center, Santa Clara