Pre-2016 Archives

Links to Meetings Prior to 2016 (use CNTL-F to search for a particular topic)

Monthly Technical Meetings (2015-2016) Conferences, Seminars and Workshops (2015-2016):

* “Anisotropic Conductive Film (ACF) Interconnection Technology for Wearable Electronics Applications” — Prof. Kyung W. Paik, Korea Advanced Institute of Science and Technology (KAIST) — lunch Wednesday, September 9
* “Void Formation During Soldering” — Watson Tseng, Shenmao America Inc. — lunch Thursday, September 24
* “Chips ‘Face-Up’ Panelization Approach for Fan-Out Packaging” — Boyd Rogers, Deca Technologies, Inc. — lunch Wednesday, October 14
* “Considerations for Advancing Technology in Computer System Packaging” — Dale Becker, Ph.D., IBM Corp. (Poughkeepsie, NY) — lunch Thursday, October 22
* “Embedded Microdevices: A New Way To Build Low-cost, 3D, Integrated MEMS Devices” — Prof. Mark Bachman, UC-Irvine, and CTO, Integra Devices, LLC — lunch Wednesday, November 11
*
“Packaging Materials Market Trends, Issues and Opportunities” — Dr. Dan Tracy, SEMI — lunch Tuesday, December 8
* “Advanced Packaging Techniques as Enablers for the Health IoT Ecosystem” — Dr. Andreas Middendorf, Fraunhofer IZM — lunch Monday, January 25
* “FO-WLP – A Disruptive Technology: Drivers and Developments” — E. Jan Vardaman, TechSearch International — lunch Tuesday, February 9
* “A Flexible Manufacturing Platform for High-Volume TCB and High Density FOWLP” — Tom Strothmann, Director, Kulicke & Soffa Industries — lunch Thursday, February 25
* “Photonic Systems Changes: Driving Innovation in Photonic Packaging” — Dr. W. R. Bottoms, Third Millennium Test Solutions — lunch Tuesday, March 8
* “Emerging IC Packaging Platforms for ICT Systems” — Dr. Li Li, Distinguished Engineer, Cisco Systems, Inc. — lunch Thursday, March 24
* “Recent Advances and Trends in Semiconductor Packaging” — Dr. John H. Lau, Sr. Technical Advisor, ASM — lunch Tuesday, April 12
* “Challenges and Opportunities of Circuits and Systems for the Internet of Things” — Dr. Yen-Kuang Chen, Principal Engineer, Intel Corporation —   Wednesday, April 20 (with CAS Chapter)
* “Advanced Packaging Technologies for System Integration” — Dr. Dongkai Shangguan, CMO, STATS ChipPAC — lunch Thursday, April 28

* “Sixth Annual IEEE Soft Error Rate (SER) Workshop” — 8 talks by experts, expo, panel — Thursday, October 15, 8:30 AM – 3:00 PM (also on Web)

Monthly Technical Meetings (2014-2015) Technical, Professional Skills Development,
and Management Classes (2014-2015):

2014/15 Meetings:

*

The “Invisible” Package
— Sam Karikalan, Senior Manager of Package Engineering, Broadcom Corporation
lunch, Thursday, September 25, 11:30 AM – 1:15 PM

*

“PCB Design and Fabrication Process Variations for Embedding Passive and Active Components”
— Vern Solberg, Technical Consultant
dinner Wednesday, October 8

*

“Thermal Management & Reliability of Power Electronics in Renewable Energy & Transportation Applications”
— Dr. Eckhard Wolfgang, European Center of Power Electronics, and University of Dortmund
lunch Thursday, November 13

*

“Designing for the Internet of Things: A Paradigm Shift in Reliability”
— Mudasir Ahmad, Cisco Systems, Inc.
dinner Tuesday, November 18

*

“Tools for Thermal Analysis: Thermal Test Chips”
— Tom Tarter, Package Science Services LLC
dinner Wednesday, December 10

*

“Packaging-Driven Reliability in High-Voltage Packages”
— Dr. Luu Nguyen, Texas Instruments Inc.
lunch Thursday, January 22

*

“Advanced Stacked Die Packaging Technology: More than 2D”
— Dr. John Y. Xie, Director, Packaging Technology Research and Development, Altera Corp
lunch Thursday, February 26

*

“From Development to Manufacturing: Insights into the Latest Activities of the Advanced Packaging Market”
— Rozalia G. Beica, Chief Technology Officer, Yole Developpement
dinner Tuesday, March 10

*

“A New Concept for Lead Frames”
— Phil Rogren, EoPlex
dinner Tuesday, April 7

*

“How Well do you Know your Local SMT and IC Package Services?”
— Phil Marcoux, PPM Associates, and Tom Clifford
lunch Thursday, April 23

*

“Current Capabilities and Future Challenges of Acoustic Microscopy (AM) for 3D Interconnect & Underfill Inspection”
— Steve Martell, Manager, Advanced Applications Support, Sonoscan
lunch Thursday, May 21

*

“A New Drop Test for BGA Assemblies: Duplicable and Effective”
— Dongji Xie, Nvidia
dinner Tuesday, July 7

*

“Embedding Passive and Active Devices in Substrates”
— Michael Tschandl, Advanced Packaging Business Unit, AT&S Americas LLC
lunch Thursday, July 23

*

“Robust 3DIC Package Assembly Process Engineering for High Volume Production”
— Inderjit Singh, Xilinx Inc.
lunch Wednesday, August 12

*

“Packaging Solutions and Innovations with Compression Molding (includes FOWLP & FOPLP)”
— C. H. Ang, Towa, USA
lunch Thursday, August 27


2014/15 Conferences/Symposia:

*

“Sixth Annual IEEE Soft Error Rate (SER) Workshop”
— 9 talks by experts, expo, panel
— Thursday, October 16, 8:30 AM – 5:00 PM (also on Web)



2014/15 Classes:

*
Getting Things Done Through Influence and Collaboration
[more]  
Oct 9 at Synopsys, Sunnyvale

*
Management Essentials
[more]  
Nov 6-7 at Zukin, Milpitas

*
Preparing Powerful Presentations
[more]  
Nov 18 at Synopsys, Sunnyvale

*
Project Management
[more]  
Dec 2-3 at Netgear, San Jose

*
Project Management: A Team Approach
[more]  
Mar 24-25 at Synopsys, Sunnyvale

Monthly Technical Meetings:
(2013-2014)
Technical, Professional Skills Development,
and Management Classes (2013-2014):

2013/14 Meetings:

*

“Semiconducting Nanowire Arrays Grown Directly on Graphene: Towards Precision Placement of Wafer Scale Nanowire Arrays with Improved Electrical Contact for Energy Storage and Harvesting”

  — John Alper, PhD Candidate, UC-Berkeley
dinner Wednesday, September 11

*

“Low-CTE Organic Interposer Technology for 2.5D Packaging”

  — Tomoyuki Yamada, Kyocera America Inc.
lunch Thursday, September 26

*

“Advanced Package Migration to System-Level Integration”

  — Curtis Zwenger, Sr. Director, Package Development, Amkor Technology, Inc.
dinner Wednesday, October 9

*

“MEMS and BioMEMS in Laminates”

  — Professor Mark Bachman, University of California-Irvine
lunch Thursday, October 24

*

“Design, Manufacturing and Performance of a 3D Random Access Memory Subsystem”

  — David Chapman, VP Technical Sales and Marketing, Tezzaron Semiconductor, Inc.
dinner Wednesday, November 13

*

“High-Performance Datacenter Platform: Using InP for Silicon Photonics”

  — Dr. Michael Lebby, CEO, OneChip Photonics; Professor of Optoelectronics, Glyndwr University; IEEE Fellow.
dinner Wednesday, January 8

*

“Probing Interfacial Contact via MEMS-based Microinstrumentation”

  — Roya Maboudian, Department of Chemical & Biomolecular Engineering, UC-Berkeley
lunch Thursday, February 27

*

“Power Semiconductor Packaging and System-on-a-Substrate Power Technology”

  — Nathan Zommer, PhD, CEO and CTO, IXYS Corporation
dinner Wednesday, March 12

*

“Directions in Device Packaging for Mobile Applications”

  — E. Jan Vardaman, President, TechSearch International, Inc.
lunch Thursday, March 27

*

“A Survey and Review of 2.5/3D IC Packaging Technologies”

  — Herb Reiter, eda2asic Consulting, Inc.
dinner Wednesday, April 9

*

“The Evolution of Laser Singulation”

  — Devin Martin, Manager of Technology Development, Disco Hi-Tec America
lunch Thursday, April 24

*

“Improved PoP Package Competes with 2.5/3D Packages using TSVs”
— Jake Sadie, University of California-Berkeley; and “Improved PoP Package Competes with 2.5/3D Packages using TSVs”
  — Dev Gupta, PhD, CTO, APSTL
dinner Wednesday, June 11

*

“Wearable Technology — Seminar and Tabletop Exposition”
— 7 talks by experts
— Wednesday, August 20, 8:30 AM – 2:00 PM

*

The “Invisible” Package
— Sam Karikalan, Senior Manager of Package Engineering, Broadcom Corporation
lunch, Thursday, September 25, 11:30 AM – 1:15 PM

*

“PCB Design and Fabrication Process Variations for Embedding Passive and Active Components”
— Vern Solberg, Technical Consultant
dinner Wednesday, October 8


2013/14 Conferences/Symposia:

*

CPMT Society 3D Systems Integration Conference

Westin Market Street, San Francisco — October 2-4, 2013

*

Soft Error Rate (SER) Workshop

  — October 24, at Cisco, San Jose
— on-site or WebEx half-day Seminar Thursday, October 24

*

Electrical Performance of Electronic Packaging and Systems (EPEPS)

  — October 27-30 at the DoubleTree Hotel, San Jose



2013/14 Classes:

*
Transitioning from Individual Contributor to Manager
[more]  
– Sept 17 at Tibco, Palo Alto

*
Sub-Terahertz Photonics for Ultra-Wideband Wireless
[more]  
– CPMT members-only Webinar, Sept 11

*
Platform-Independent Photonic Design Tools and Concepts
[more]  
– CPMT members-only Webinar, Sept 17

*
Breakthrough Project Management
[more]  
– Oct 8-9 at Synopsys, Sunnyvale

*
Getting Things Done Across Organizational Borders
[more]  
– Oct 10 at Synopsys, Sunnyvale

*
5 Habits of Intentional Leadership
[more]  
– Oct 17 at Tibco, Palo Alto

*
Consulting Skills for Engineers: How to Become a Trusted Advisor
[more]  
– Nov 7 at Tibco, Palo Alto

*
Delegation and Coaching: The Winning Combination
[more]  
– Nov 13 at Tibco, Palo Alto

*
Managing Time and Multiple Priorities
[more]  
– Feb 20 at Tibco, Palo Alto

*
Management Essentials
[more]  
– March 13-14 at Tibco, Palo Alto

*
Getting Things Done Across Organizational Borders
[more]  
March 20 at Tibco, Palo Alto

*
Advanced Presentation Skills for Engineers and Managers
[more]  
April 22 at TIBCO Software, Palo Alto

Monthly Technical Meetings:
(2012-2013)
Technical, Professional Skills Development,
and Management Classes (2012-2013):

2012/13 Meetings:

*

“Additive Manufacturing — It’s Not Always Rapid And It’s Not Just For Prototypes”

Arthur L. Chait, CEO, EoPlex
— Wednesday, September 12

*

“The Origins of Silicon Valley: Why and How It Happened Here”

Paul Wesling, IEEE SF Bay Area Council Communications Director
— Thursday, September 27

*

“Pad Cratering, Lead Free and Density Challenges Facing the Electronics Packaging Industry”

Chris Hunrath, Vice President of Technology, Integral Technology
— Wednesday, October 10

*

“Cost Versus Reliability Tradeoffs for Stacked Devices”

Steve Steps, Aehr Test Systems
— Wednesday, November 14

*

“New Class of Low-k Dielectrics for Advanced Interconnects”

Yusuke Matsuda, Stanford University
— Wednesday, January 9

*

“Packaging for the Cloud Computing Era”

Ilyas Mohammed, Principal Technologist, Invensas
— Thursday, January 24

*

“Advanced Organic Substrate Technologies to Enable Extreme Electronics Miniaturization”

Susan Bagen, Endicott Interconnect Technologies, Inc.
— Wednesday, February 13

*

“New Wafer-Level Embedded Package Structure and Technology using Large-Scale Panel Assembly”

Akio Katsumata, General Manager, Packaging Research & Development Center, J-Devices Corp.
— Thursday, February 21

*

“Packaging: The Core of Competitive Advantage”

Bill Chen, Fellow of ASE Group, & Past President of the CPMT Society
lunch Thursday, March 28

*

“3D Virtual Worlds and Simulation: The Human-Computer Interface”

Doug Twilleager, Software CTO, zSpace
lunch and demo Thursday, April 4

*

Webinar: “Active Plasmonics Co-integrated with Si-photonics and Electronics for On-chip Interconnects”

Nikos Pleros, Aristotle University of Thessaloniki
webinar Thursday, April 11, 8:00 AM (PDT)

*

“Nanomaterial Synthesis and Integration for Sensor and Energy Applications”

Heather C. Chiamori, Berkeley Sensor & Actuator Center (BSAC), UC-Berkeley
dinner Wednesday, May 8

*

“A Comparison of Low-Cost Interposer Technologies”

Terry Kang, Sr. Packaging Development Manager, Nvidia
lunch Thursday, May 23

*

“NanoCopper Materials Platform for Electronics Packaging and Printed Electronics with 200C Processing Temperature”

Alfred Zinn, Senior Scientist, Lockheed Martin Space Systems Company ATC
dinner Wednesday, June 12

*

“Wafer Level Packaging: A Foundry Perspective”

  — Michael Shillinger, Founder, Innovative Micro Technology
lunch Thursday, June 27


2012/13 Conferences/Symposia:

*

“Soft Error Rate (SER) Workshop”

Half day of talks and discussions
— Thursday, October 25th.

*

“Advanced Packaging Materials (APM’13)”

– Atrium Hotel, Irvine   – February 27 – March 1, 2013

*

“IEEE Int’l Reliability Innovations Conference (IRIC)”

– 12 talks on qualification, mitigation, prediction, yield, etc.
– at Cisco Systems, San Jose, and as Webinar   – March 7, 2013

*

“29th Thermal Modeling, Measurement and Management Symposium (SEMI-THERM)”

– DoubleTree Hotel, San Jose   – March 17-21, 2013

*

“One-Day Workshop: LED Lighting Explained”

– Cogswell College:, Sunnyvale   – May 15, 2013



2012/13 Classes:

*
5 Habits of Intentional Leadership
[more]  
– Sept 12-13 at Synopsys, Sunnyvale
*
Communicating Across Cultures
[more]  
– Oct 11 at TIBCO, Palo Alto
*
Transitioning from Individual Contributor to Manager
[more]  
– Oct 18 at TIBCO, Palo Alto
*
Project Management: A Team Approach for Accountability & Results
[more]  
– Oct 22-23 at TIBCO, Palo Alto
*
Managing Time and Multiple Priorities
[more]  
– Oct 30 at Synopsys, Sunnyvale
*
Emotional Intelligence
[more]  
– Nov 1 at TIBCO, Palo Alto

*

“Advanced Packaging for High Power LEDs”
,
Rafael Jordan, Fraunhofer IZM
– March 14, 2013   – Webinar (CPMT Members only)

*

“Microfluidic Thermal Management and Thermal-Electronic Co-Design for Chip Stacks”

Dr. Avram Bar-Cohen and Dr. Ankur Srivastava, Univ of Maryland
evening Tuesday, March 19,
DoubleTree Hotel, San Jose

Clear Business, Technical, and Email Writing
May 9 at TIBCO, Palo Alto  
[more]   –

Delegation and Coaching: The Winning Combination
May 16 at NetGear, San Jose  
[more]   –

*

Workshop: “Lighting in Today’s Environment: LED Lighting Explained”

Rudi Hechfellner, Dr. Michiel Kruger, Seng-Hup Teoh, Philips Lumileds Lighting Co.
— Wednesday, May 15, 9:30 AM – 4:00 PM

Monthly Technical Meetings:
(2011-2012)
Technical, Professional Skills Development,
and Management Classes (2011-2012):

2011/12 Meetings:

*

“fcCuBE Technology: Expanding the Flip Chip Packaging Landscape”

Dr. Raj Pendse, VP & Chief Marketing Officer, STATSChipPAC Inc.
dinner Wednesday, September 14

*

“Memory Scaling and Its Potential Impact on Computing and Storage”

Ed Doller, VP and Chief Memory Systems Architect, Micron Technology
lunch Thursday, September 22

*

“Silicon Carbide (SiC) Sensing Technology for Extreme Harsh Environments”

Debbie G. Senesky, Ph.D., University of California, Berkeley
dinner Wednesday, October 12

*

“Top Strategies for Cashing in on Asia’s Innovation Boom”

Rebecca A. Fannin, author of Silicon Dragon and Startup Asia
lunch Thursday, October 27

*

“Semiconductor Industry Update and Outlook, Including Equipment, LEDs, PV”

Dr. Dan Tracy, Semiconductor Equipment and Materials International (SEMI)
dinner Wednesday, November 9

*

“Developments in Low-Temperature MEMS Manufacturing”

Jiyoung Chang, Ph.D. candidate, Mechanical Engineering, UC-Berkeley
dinner Wednesday, December 14

*

“Fine-Grained 3D Integration”

Deepak Sekar, MonolithIC 3D Inc.
dinner Wednesday, January 11

*

“Combining Accurate Measurement with Thermal Simulation”

John Wilson, Mentor Graphics Corporation
lunch Thursday, January 26

*

“Reliability from the LED System Perspective — As Strong as the Weakest Link”

Mark Hodapp, Philips Lumileds Lighting
dinner Wednesday, February 8

*

“3D Chip Stacks: New Nano Thermal Interface Materials”

Srilakshmi Lingamneni, Stanford University
dinner Wednesday, March 14

*

“Thermal Challenges and Opportunities in Concentrated PhotoVoltaics”

Seri Lee, Nanyang Technical University, Singapore
reception and talk 6:30 PM, Tuesday, March 20

*

“Liquid Cooling: An Update”

Mikhail Spokoyny, Research Director, Thermal Management Center, Drexel University
dinner Wednesday, April 11

*

“ITRS and INEMI Roadmaps: Changes in Packaging Materials and Architectures for 2012”

Bill Bottoms, Chair, Technical Working Group for Packaging and Package Substrates, iNEMI
dinner Wednesday, May 9

*

“New Drivers and Strategies for Multi-Die Packaging”

Farshad Ghahghahi, Manager of Package Design, LSI Corporation
dinner Wednesday, June 13


2011/12 Conferences/Symposia:

*

IEEE Workshop on Chip-Packaging Co-Design for High Performance Electronic Systems (CPCW)

at Techmart, Santa Clara — September 19-20, 2011

*

2011 Workshop on Accelerated Stress Testing & Reliability (ASTR)

in San Francisco — October 12-14, 2011

*

Organic Microelectronics and Optoelectronics Workshop

in San Francisco — July 18-20, 2011

*

Workshop on Chip-Packaging Co-Design for High-Performance Electronic Systems (CPCW)

in Santa Clara — September 19-20, 2011

*

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2012)

at the DoubleTree Hotel, San Jose — March 18-22, 2012.

*

Medical Devices: New Tools and New Rules

at the Santa Clara Convention Center — March 22, 2012 ($20 discount by using code “SVEC-1”)

*

Emerging Non-Volatile Memory Technologies: Full Day Symposium

at TI in Santa Clara — April 6, 2012.

*

“Thin is In: Half-day session at SEMICON/West”

Marriott Marquis, S.F. — July 10, 2012.



2011/12 Classes:

*
Influential Communication
[more]  
– August 2 at TIBCO Software, Palo Alto

*
Clear Business, Technical, and E-Mail Writing
[more]  
– August 9 at Integrated Device Technology, SJ

*
Getting Things Done Across Organizational Borders
[more]  
– August 9 at Synopsys, Mountain View

*
Project Management: Team-Based Accountability – PMI Certified
[more]  
– August 18-19 at Integrated Device Technology, SJ

*
Management Essentials
[more]  
– October 13-14 at TIBCO Software, Palo Alto

*
Transitioning from Individual Contributor to Manager
[more]  
– October 18 at Integrated Device Technology, SJ

*

“3rd Annual Soft Error Rate (SER) Workshop”

Six talks covering FPGAs, Alpha analysis, etc.
— Thursday, October 27 — on-site at Cisco, or Webinar

*
Project Management: Team-Based Accountability – PMI Certified
[more]  
– November 8-9 at TIBCO Software, Palo Alto

*
Delegation and Coaching: The Winning Combination
[more]  
– November 17 at TIBCO Software, Palo Alto

*
Clear Business, Technical, and Email Writing
[more]  
– November 30 at TIBCO Software, Palo Alto

*
Meeting Management
[more]  
– December 1 at TIBCO Software, Palo Alto

*
Presentation Skills for Engineers
[more]  
– December 6 at Cypress Semi, San Jose

*
Emotional Intelligence
[more]  
– March 15 at Tibco, Palo Alto

*
Communicate to Manage Expectations
[more]  
– April 17 at Tibco, Palo Alto

*
Delegation and Coaching: The Winning Combination
[more]  
– April 26 at Tibco, Palo Alto

*
Flexibility: Understanding Differences and Conflict
[more]  
– May 3 at Tibco, Palo Alto

*
Getting Things Done Across Organizational Borders
[more]  
– May 8 at Synopsys, Mtn View

Monthly Technical Meetings:
(2010-2011)
Technical, Professional Skills Development,
and Management Classes (2010-2011):

2010/11 Meetings:

*

“3-D ICs: Motivation, Performance Analysis, Technology and Applications”

Dr. Krishna Saraswat, Electrical Engineering, Stanford University
pizza Tuesday, August 10

*

“Design of High Density & 3D Packaging: Tools and Knowledge”

Thomas Tarter, Package Science Services LLC
lunch Thursday, September 23

*

“All-Silicon System with Nano-Packaging: Highest Functionality, Lowest Cost, Smallest Size”

Prof. Rao Tummala, Founding Director, NSF Packaging Research Center, Georgia Tech
dinner Tuesday, October 12

*

“Embedded Passives: Packaging Paradigm of the Future?”

Jason Ferguson, Crane Naval Surface Warfare Center
dinner Wednesday, November 10

*

“Photoprinting Assembly Technology for Ultrathin Electronic Components”

Dr. Jayna Sheats, Terepac Corporation
dinner Wednesday, December 8

*

“Putting Thin Copper on Flexible Materials”

Alex N. Beavers, Jr., Ph.D., SRI International
dinner Wednesday, January 12

*

“Impact of Packaging on Photovoltaic Panel Performance and Reliability”

Alelie Funcell, Renewable Energy Test Center
dinner Wednesday, February 9

*

“An Evolutionary Leadless Package”

Kelly R. McKendrick Sr., UTAC UGS America Sales Inc.
lunch Thursday, February 24

*

“Low Cost, Small Footprint Die Stacking and Interconnect for 3D Package Integration”

Marc Robinson, Vice President & CTO, Vertical Circuits Inc.
dinner Wednesday, March 9

*

“Developments in MEMS Packaging”

Alissa M Fitzgerald, Founder, AMFitzgerald and Associates
dinner Wednesday, April 13

*

“3D IC Development and Supply Chain Collaboration”

Suresh Ramalingam, Ph.D., Senior Director Advanced Package Design & Development, Xilinx Inc.
lunch Thursday, April 28

*

“Friday Afternoons at an Electronic Manufacturing Services (EMS) Provider”

John Burke, Engineering Director, AsteelFlash USA
dinner Wednesday, May 11

*

“Silicon Interposers for 2.5D and 3D Packaging”

Phil Marcoux
lunch Thursday, May 26

*

“Design and Fabrication of MEMS for Applications in Adaptive Optics”

Prof. Joel Kubby, University of California at Santa Cruz
dinner Wednesday, June 8

*

“Tour: HALT-HASS Testing and Chamber Demonstration”

Ops A La Carte staff
lunch and tour Thursday, June 16

*

“Tour: SMT (Surface Mount Technology) Manufacturing and Engineering”

Affif Siddique, Whizz Systems
dinner Tuesday, July 26


2010/11 Conferences/Symposia:

*

IEEE Nanotechnology Materials and Devices Conference (NMDC)

at the Clement Hotel, Monterey — October 12-15, 2010

*

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2011)

at the DoubleTree Hotel, San Jose — March 20-24, 2011



2010/11 Classes:

*
Preparing Presentations to Decision Makers
– September 16 at TIBCO Software, Palo Alto

*
Precision Questioning and Answering
– September 21 at Synopsys, Mountain View

*
Two-Hour SEMINAR:
“Moore’s Law for System Integration”

Prof. Rao Tummala, Founding Director, NSF Packaging Research Center, Georgia Tech
— at the Biltmore Hotel, Tuesday, October 12.

*

“Computational Electronics: From Semi-Classical to Quantum Transport Modeling”

Prof. Dragica Vasileska, Arizona State University — at Clement Hotel (Monterey),
Tuesday, October 12.

*

Second Annual IEEE-SCV “Soft Error Rate (SER) Workshop”

seven talks (avail via WebEx) — at Cisco,
Thursday, October 28.

*

Management Essentials
– October 7-8 at TIBCO Software, Palo Alto

*
Virtual Teams: Working Together Apart
– October 12 at Trimble Navigation, Palo Alto

*
5 Habits of Intentional Leadership
– October 14-15 at TIBCO Software, Palo Alto

*
5 Habits of Intentional Leadership
– October 14-15 at TIBCO Software, Palo Alto

*
Managing Managers
– October 26-27 at Brocade Communications, San Jose

*
Collaborative Negotiating
– October 27 at TIBCO Software, Palo Alto

*
Managing Time & Multiple Priorities
– November 10 at Brocade Communications, San Jose

*
Presentation Skills for Engineers
– November 17 at Brocade Communications, San Jose

*
Team Building Using MBTI
– April 12 at Synopsys, Mountain View

*
Managing Time and Multiple Priorities
– April 19 at TIBCO Software, Palo Alto

Monthly Technical Meetings:
(2009-2010)
Technical, Professional Skills Development,
and Management Classes (2009-2010):

2009/10 Meetings:

*

“Molecular Modification of PCB Substrates for Fine Line Patterning”

Werner Kuhr, Ph.D., ZettaCore, Inc.
dinner Wednesday, September 9

*

“Embedded Passives: Methodologies and Opportunities for Implementation”

John Savic, Cisco Systems
lunch Thursday, September 24

*

“Wider Applications for 3D Accelerometer MEMS: Sensing, Gaming, Therapy”

Ed Brachocki, Kionix; Richard Smith and Susan Feighery, Palo Alto Veterans Administration Health Care
dinner Wednesday, October 14

*

“Nanopackaging: Nanotechnologies in Microelectronics Packaging”

James E. Morris, Department of Electrical & Computer Engineering, Portland State University
dinner Wednesday, November 11

*

“Embedded Molecular Nano-Capacitor”

Dr. Ritu Shrivastava, VP Manufacturing Technology, ZettaCore Inc.
lunch Tuesday, December 15

*

“High-Reliability Through-Silicon Via (TSV) Solutions for Image Sensor Packaging”

Belgacem Haba, Fellow and Chief Technology Officer, Interconnect, Components & Materials (ICM), Tessera
dinner Wednesday, January 13

*

“Thin is In: Thinning of IC Chips”

Annette Teng, Ph.D., CORWIL Technology Corp.
lunch Thursday, January 28

*

“Large-Scale Print Manufacturing of Complex, Miniature 3D Structures”

Arthur Chait, President and CEO, EoPlex Technologies, Inc.
dinner Wednesday, February 10

*

“3D IC Integration: The Next Generation of Electronics”

Dr. W. R. “Bill” Bottoms, Chairman, Third Millennium Test Solutions
dinner Wednesday, March 10

*

“Integrated RF-CMOS MEMS Solutions for Mobile Terminals”

Jeffrey L. Hilbert, President, WiSpry, Inc. (Irvine, CA)
lunch Thursday, March 25

*

“Applications and Self-Packaging of Microscopically Small Electronic Components”

Babak A. Parviz, Micro-Scale Life Sciences Center, University of Washington
dinner Wednesday, April 14

*

“Winner Take All: How Competitiveness Shapes the Fate of Nations”

Richard J. Elkus, Jr., Vice Chairman of the Board, Tencor Instruments
dinner Wednesday, May 12

*

Nanotechnology Symposium: State of the Art & Applications

Co-sponsored by the CPMT Chapter
— at National Semiconductor, Santa Clara, Tuesday & Wednesday, May 18-19

*

Two talks: “Thermal Management for the Design of Telecom and Server Systems”

Marlin Vogel, Electronic Cooling Solutions; and
“Standard Semiconductor Thermal Measurements – Implementation & Practical Aspects”
Bernie Siegal, President, Thermal Engineering Associates
lunch and tour Thursday, May 27

*

“Novel Fine Pitch, Low Profile, Low Cost Connector Technology”

David Light, VP Technology, Neoconix, Inc.
dinner Wednesday, June 9

*

“Impact of Packaging on Photovoltaic Panel Performance and Reliability”

Alelie Funcell, President, Renewable Energy Test Center
dinner Wednesday, February 9


2009/10 Conferences/Symposia:

*

IEEE Int’l 3D System Integration Conference (3DIC)

at the Hyatt Regency Hotel, San Francisco — Sept. 27-30, 2009

*

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2010)

at the Hyatt Hotel, Santa Clara — Feb. 21-25, 2010



2009/10 Classes:

*
Management Essentials
– August 25-26 at Trimble Navigation, Sunnyvale

*
Managing Time and Multiple Priorities

– September 9 at TIBCO Software, Palo Alto

*

SEMINAR: “Impact of Packaging Materials and Processes on Device Soft Error Rates”

Six speakers, in a half-day Forum
— Friday, October 30, 8:30 – Noon

*
Managing Time & Multiple Priorities
– January 13 at Synopsys, Mountain View

*
Virtual Teams: Working Together Apart
– January 14 at Synopsys, Mountain View

*
Project Management: Team-Based Accountability
– February 16-17 at TIBCO Software, Palo Alto

*

“Design of Air and Water Cooled Heat Exchangers for Electronics Cooling: A Critical
Review of Data and Analysis Methods for Heat Sinks and Cold Plates”

Alfonso (Al) Ortega, Ph.D., Villanova
University — Hyatt Regency Santa Clara Convention Center,
February 21.

*

“Cooling Challenges in 3D Packaging”

Dereje Agonafer, Ph.D.,
University of Texas at Arlington — Hyatt Regency Santa Clara Convention Center,
February 21.

*

“Estimating Experimental Uncertainty”

Robert J. Moffat, Ph.D.,
Stanford University (Emeritus) — Hyatt Regency Santa Clara Convention Center,
February 22.

*

“Energy Efficient Thermal Management
of Data Centers”

Yogendra Joshi, Ph.D.,
Georgia Institute of Technology — Hyatt Regency Santa Clara Convention Center,
February 22.

Monthly Technical Meetings:
(2008-2009)
Technical, Professional Skills Development,
and Management Classes (2008-2009):

2008/09 Meetings:

*

“Novel Approaches to Low-Cost Solar Cells: Science and Challenges”

Prof. Peter Peumans, Dept. of Electrical Engineering, Stanford Univ, and Deputy Director of the Center for Advanced Molecular Photovoltaics (CAMP)
Dinner Wednesday, September 10

*

“Multichip Module Packaging and its Impact on Server Architecture and Operating Systems”

Dr. Hubert Harrer, Senior Technical Staff Member, IBM Server and Technology Group (Boeblingen, Germany)
Dinner Monday, October 20 (note change from regular day)

*

“The Evolution of MEMS Packaging – Chicken or Egg”

Paul Eugene (Gene) Burk, Jr., consultant to MEMS companies
lunch Thursday, October 23

*

“Electro-Optical Microscopy: Evolution in Component and Package-Level Inspection”

Andrew Kominek, Keyence Corporation
Lunch Thursday, November 20

*

“Halogen Free Electronics”

Dr. Dan Donahoe, Exponent; and Dr. Michelle Poliskie
Dinner Wednesday, December 10

*

“Microscope on a Chip – A Highly Compact Lensless High-Resolution Optofluidic Microscope (OFM)”

Xiquan Cui, PhD candidate in Electrical Engineering, Caltech
dinner Wednesday, January 14

*

“Trends in IC Packaging and Multicomponent Packaging”

Sandra Winkler, Electronic Trend Publications
lunch Thursday, January 22

*

“The Basic Electronic Components: Finding the Missing Memristor”

Stanley Williams, HP Laboratories
dinner Wednesday, February 11

*

“Components and Packaging Implications for the Sustainable Information Technology Ecosystem”

Chandrakant D. Patel, HP Fellow and Director, Sustainable IT Ecosystem Laboratory, HP Laboratories
lunch Thursday, February 26

*

“Non-Contact Wafer Testing and High Performance, Low Power I/O for Chip-to-chip Communications”

Dr. Christopher Sellathamby, Scanimetrics
dinner Wednesday, March 11

*

“Flexible Displays: Manufacturing Issues and Solutions”

Dr. Paul S. Drzaic, Drzaic Consulting Services and President of SID
dinner Wednesday, April 8

*

“Hotspot Management and Micro-Refrigeration in Integrated Circuits”

Prof. Ali Shakouri, School of Engineering, UC-Santa Cruz
pizza/drinks Monday, April 20

*

“Is Cu Wirebonding for Real?”

Amy Low, Americas Sales Manager, Heraeus Inc.
lunch Thursday, April 23

*

“Through-Silicon Vias (TSVs): Design and Reliability”

Dr. Sergey Savastiouk, ALLVIA, Inc.
dinner Wednesday, May 13

*

“Nanotechnology: Enabling Energy-Efficient Electronics”

organized by the Nano Council with CPMT co-sponsorship
Full-day low-cost Symposium, Tuesday, May 19

*

“Wafer Level Packaging – Next Turn in the Road”

Dr. Thomas Di Stefano, Centipede Systems
dinner Wednesday, June 10

*

“License to Speed: Extreme Bandwidth Packaging”

Sean Cahill, VP-Technology, BridgeWave Communications
lunch/tour Thursday, June 25


2008/09 Conferences/Symposia:

*

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2009)

at the Fairmont Hotel, San Jose — March 15-19, 2009



2008/09 Classes:

*
Finance for Non-Finance Professionals
– Dec at Exar Corporation, Fremont

*
Managing Time & Multiple Priorities
– Dec at Synopsys, Mountain View

*
Communication and Conflict Management Using MBTI
– Dec at Interwoven, San Jose

*
Clear Business, Technical, and E-Mail Writing
– Dec at Exar, Fremont

*
Transitioning from Individual Contributor to Manager
– Dec at Cypress Semiconductor, San Jose

*
Breakthrough Project Management
– Dec at Cypress Semiconductor, San Jose

*
Management Essentials

– March 3-4 at TIBCO Software, Palo Alto

*
Transitioning from Individual Contributor to Manager
– March 12 at Informatica, Redwood City

*
Engineering Analysis Methods Using Spreadsheets – March 15, Ross Wilcoxon, Rockwell Collins

*
Thermal Management from an Industrial Point of View – March 15-16, Clemens Lasance,
Philips Research and Wendy Luiten, Philips Research

*
Compact Thermal Models for Microelectronics Cooling – March 15-16, M. Michael Yovanovich,
University of Waterloo, Waterloo, Ontario

*
Spreadsheet-Based Thermal Analysis – March 16, Ross Wilcoxon, Rockwell Collins

*
5 Habits of Intentional Leadership

– April 16-17 at TIBCO Software, Palo Alto

*
Breakthrough Project Management

– April 16-17 at Informatica, Redwood City

Monthly Technical Meetings:
(2007-2008)
Technical, Professional Skills Development,
and Management Classes (2007-2008):

2007/08 Meetings:

*

“Trends in State-of-the-Art Microscopy and Nanoscale Characterization”

Edward Principe, Carl Zeiss SMT, Inc.
Dinner Wednesday, September 12.

*

“High Complexity, Low Cost 3D Sub-Systems as a Large Scale BGA”

Shaun Arnold, ChipStack Inc.
Dinner Wednesday, October 10.

*

“Robust Electronic Assembly without Solder: Eliminating both Tin-lead and Lead-free”

Joseph (Joe) Fjelstad, President, Verdant Electronics
Dinner Wednesday, November 14.

*

“Flexible/Printable Electronics” and “Organic LED (OLED) Display Technology”

Dr. Chuck Bauer, TechLead Corporation; and Dr. Johann Trujillo, DuPont Displays (Co-sponsored by SCV LEOS Chapter)
Dinner Wednesday, January 16.

*

“High Volume Print Forming: Filling the Gap between Nano and ‘Just-Plain-Miniature’ Devices”

Arthur L. Chait, President, EoPlex Technologies
Dinner Wednesday, February 13.

*

“Flip Chip Substrates For Advanced Applications”

Bernd Appelt, ASE (U.S.) Inc.
Lunch Thursday, March 27.

*

“A New Perspective on Electronic Product Reliability: Prognostics and Health Management”

Prof. Michael Pecht, University of Maryland
Dinner Wednesday, April 9.

*

“Sustainable Information Technology Ecosystem: Optimizing Datacenter Power and Cooling”

Chandrakant D. Patel, HP Fellow and Director, Hewlett Packard Laboratories
Lunch Thursday, April 24.

*

“High Performance Modules on Copper Substrates: Next-Generation Packaging for Servers and Supercomputers”

Peter Salmon, VP, Salmon Technologies, LLC
Dinner Wednesday, May 14.

*

“Semiconductor Manufacturing and Test Trends”

Dr. Erik Volkerink, Verigy
Lunch Thursday, May 22.

*

“Thermal Stress Modeling in Electronic and Photonic Engineering: Is FEA the Only Tool?”

Dr. Ephraim Suhir, CPMT Society Distinguished Lecturer; Bell Laboratories (ret)
Dinner Wednesday, June 11.

*

“Nanopackaging at Singapore’s IME: TSVs, MEMS and Photonics”

Dr. John H. Lau, Institute of Microelectronics, Singapore
Lunch Thursday, July 17.


2007/08 Conferences/Symposia:

*

32nd International Electronics Manufacturing Technology Symposium (IEMT’07)

at the San Jose Holiday Inn — Oct. 3-5, 2007.

*

Advanced Packaging Materials Symposium (APM’07)

at the San Jose Holiday Inn — Oct. 3-5, 2007.

*

16th Annual International Symposium on Semiconductor Manufacturing (ISSM’07)

at the Marriott Hotel, Santa Clara — October 15-17.

*

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2008)

at the Fairmont Hotel, San Jose — March 16-20, 2008



2007/08 Classes:

*

“Managing Across Cultures”

with Michael Burns
— at Trimble Navigation (Sunnyvale), August.

*

“High-Impact Communication”

with Lori Rubin
— at TIBCO Software (Palo Alto), August.

*

“Clear Business, Technical, and E-mail Writing”

with Barry Mohn
— at Exar Communications (Fremont), September.

* “Nanotechnology Applications in Packaging”, Florin Ciontu, NanoSPRINT, — at Holiday Inn (San Jose), October.

* “Implementing Flip Chip and WLP Technology”, Peter Elenius, E&G Technology Partners, — at Holiday Inn (San Jose), October.

* “Advanced Packaging Technology Solutions for Today’s Leading Edge Microelectronics”,
Charles B. Woychik, GE Global Research, — at Holiday Inn (San Jose), October.

* “Achieving High Reliability for Lead-Free Solder Joints – Materials Considerations”, Dr. Ning-Cheng Lee, Indium Corp., — at Holiday Inn (San Jose), October.

* “Polymers & nano-Composites for Electronic and Photonic Packaging: Recent Advances in Materials and Processes”, Prof. C.P. Wong, Georgia Institute of Technology, — at Holiday Inn (San Jose), October.

* “3-Dimensional Semiconductor Packaging & Integration”, Charles E. Bauer, Ph.D., and Herbert J. Neuhaus, Ph.D., TechLead Corporation, — at Holiday Inn (San Jose), October.

* “Failure Modes & Analysis of Flip Chip Assemblies”, Prof. Daniel Baldwin, Georgia Institute of Technology, — at Holiday Inn (San Jose), October.

*

“Management Essentials”

with Andrew Oravets
— at Trimble Navigation (Sunnyvale), October.

*

“Interviewing and Hiring the Best Talent”

with Jim Kennedy
— at Tibco (Palo Alto), October.

*

“Getting Things Done Across Organizational Borders”

with Linda Price
— at Synopsys (Sunnyvale), October.

*

“Conquering Overwhelm – Managing Life in the Fast Lane”

with Phil Hallstein
— at Exar Corporation (Fremont), November.

*

“Mastering Your Presentation Skills”

with Peter Rosselli
— at Trimble Navigation (Sunnyvale), November.

*

“Breakthrough Project Management”

with Barry Flicker
— at Tibco Software (Palo Alto), November.

*
“Transitioning from Individual Contributor to Manager”
– May at TIBCO Software, Palo Alto

*
“Mastering Your Presentation Skills”
– May at TIBCO Software, Palo Alto

*
“Influential Communication”
– June at TIBCO Software, Palo Alto

*
“Agile Project Management”
– June at TIBCO Software, Palo Alto

*
“Management Essentials”
– July at TIBCO Software, Palo Alto

*
“Budgeting Essentials”
– July at Synopsys, Mountain View

*
“Preparing Technical Content for Presentations”
– July at Synopsys, Mountain View

*
Finance for Non-Finance Professionals
– Dec at Exar Corporation, Fremont

*
Managing Time & Multiple Priorities
– Dec at Synopsys, Mountain View

*
Communication and Conflict Management Using MBTI
– Dec at Interwoven, San Jose

*
Clear Business, Technical, and E-Mail Writing
– Dec at Exar, Fremont

*
Transitioning from Individual Contributor to Manager
– Dec at Cypress Semiconductor, San Jose

*
Breakthrough Project Management
– Dec at Cypress Semiconductor, San Jose

Monthly Technical Meetings:
(2006-2007)
Technical, Professional Skills Development,
and Management Classes (2006-2007):

2006/07 Meetings:

*

“25 Micron Flip Chip Bumping Technology: Processes and Applications”

Alan Huffman, Research Engineer, Center for Material and Electronic Technologies, RTI International
Dinner September.

*

“3-D and Multi-Technology Packaging: Current Capabilities”

Phil Marcoux, CORWIL Technology
Lunch September.

*

“Convergence Challenges of Photonics with Electronics”

Dr. Edward Palen, PalenSolutions Optoelectronic Packaging Consulting
Dinner October.

*

“Copper Die Bumps (First Level Interconnect) and Low-K Dielectrics in 65nm High Volume Manufacturing”

Dr. Andrew Yeoh, Logic Technology Development, Intel Corp
Lunch Thursday, October 26.

*

“Future IC Packaging Trends — Finer-Pitch Connection and Heat Extraction”

John Burke, Senior Manager-Operations, Optichron
Dinner Wednesday, November 8.

*

“Board Level Reliability of Wafer Level Chip Scale Packages with Copper Post Technology”

John Jackson, Analog Devices
Dinner Wednesday, December 13.

*

“Optoelectronics Technology: New and Exciting Markets in Consumer and Entertainment”

Michael Lebby, President and CEO, Optoelectronics Industry Development Association (OIDA)
Dinner January.

*

“The iNEMI Roadmap: Overview and Board Assembly Directions”

Dr. Dongkai Shangguan, Flextronics, and Jim McElroy, CEO, iNEMI
Lunch January.

*

“Package, Assembly and Thermal Challenges of Microprocessor Packaging”

Raj Masters, Corporate Fellow and Chief Technologist, Advanced Micro Devices
Lunch February.

*

“Recipe for a New Embedded Component: Connectors”

Dirk Brown and John Williams, Neoconix
Dinner March.

*

“The Development of 100+ GHz High-frequency MicroCoax Interconnects”

Sean Cahill, VP-Technology, BridgeWave Communications
Lunch March.

*

“Factors Influencing IC Design Starts and Future Revenues”

Bryan Lewis and John Barber, Gartner Dataquest
Dinner April.

*

“65nm FCBGA Reliability for Next Generation Gaming Device”

Dr. Paul P.E. Wang, Microsoft Corp.
lunch April.

*

“The Packaging Challenges and Solutions for Solfocus Concentrated Photovoltaic (CPV) Modules”

Wayne Miller, Solfocus, Inc.
Dinner May.

*

“Volume Production of Ultra-Thin Chips”

Werner Kröninger, Infineon Technologies (Regensburg, Germany)
lunch May.

*

“uPILR MicroContacts: A Next-Generation Chip-Scale Packaging Solution”

Phil Damberg, Tessera, Inc.
Dinner June.


2006/07 Conferences/Symposia:

*

Workshop on Accelerated Stress Testing & Reliability (ASTR)

at Fisherman’s Wharf, San Francisco —
October 4-6, 2006

*

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2007)

at the Fairmont Hotel, San Jose — March 19-22

*

57th Electronic Components and Technology Conference (ECTC 2007)

at John Ascuaga’s Nugget Casino Resort — May 29 – June 1.



2006/07Classes:

*

“Clear Business, Technical, and E-mail Writing”

with Kathleen Mohn
— at Exar Corporation (Fremont), October.

*

“Collaborative Negotiating”

with Barry Flicker
— at Carl Zeiss Meditec (Dublin), October.

*

“Breakthrough Project Management”

with Barry Flicker
— at TIBCO Software (Palo Alto), October.

*

“Speed Reading for Engineers”

with Kathleen Hawkins
— at Exar Corporation (Fremont), October.

*

“Collaborative Negotiating”

with Barry Flicker
— at TIBCO Software (Palo Alto), November.

*

“High-Impact Communication”

with Susan Peterson
— at VeriSign (Mountain View), November.

*

“Clear Business, Technical, and E-mail Writing”

with Kathleen Mohn
— at TIBCO Software (Palo Alto), November.

*

“Managing Time and Multiple Priorities”

with Peter Turla
— at Exar Corporation (Fremont), December.

*

“Breakthrough Project Management”

with Kathleen Mohn
— at TIBCO Software (Palo Alto), January.

*

“Budgeting Essentials for Engineers”

with Roxanna Dunn
— at Exar Corporation (Fremont), half-day February.

*

“Presentation Skills for Engineers”

with Peter Rosselli
— at VeriSign (Mountain View), February.

*

“Transitioning from Individual Contributor to Manager”
with Roxanna Dunn
— at TIBCO Software (Palo Alto), March.

*

“Speed Reading”

with Kathleen Hawkins
— at Exar (Fremont), March.

*

“Managing Time and Multiple Priorities”

with Peter Turla
— at Synopsys (Sunnyvale), March.

*
Half-day Class:
“Challenges in Preassembly: Thin Silicon Dice and Developments in Chip Separation”

Werner Kröninger, Infineon Technologies AG, Germany — at the Ramada Inn, Sunnyvale,
May.

*

“Managing Time and Multiple Priorities”

with Peter Turla
— at Synopsys (Sunnyvale), June.

*

“Management Essentials”

with Andrew Oravets
— at Trimble Navigation (Sunnyvale), June.

*

“Clear Business, Technical, and E-mail Writing”

with Janet Bailey
— at TIBCO Software (Palo Alto), June.

*

“Getting Things Done Across Organizational Borders”

with Andrew Oravets
— at Tibco (Palo Alto), July.

*

“Managing Time and Multiple Priorities”

with Peter Turla
— at Synopsys (Sunnyvale), July.

*

“Managing Across Cultures”

with Michael Burns
— at Trimble Navigation (Sunnyvale), August.

Monthly Technical Meetings:
(2005-2006)
Technical, Professional Skills Development,
and Management Classes (2005-2006):

2005/06 Meetings:

*

“Kirkendall Voids in Lead-Free Solder Joints: A Reliability Issue”

Zequn Mei, Cisco — Dinner September.

*

“Robert Noyce: The Man Behind the Microchip”

Dr. Leslie Berlin, Stanford Univ — Lunch September.

*

“Imprint Patterning: An Alternative Circuit Fabrication Process”

Craig Davidson, Dimensional Imprint Technology, Inc. — Dinner October.

*

“Drop Testing of Components in Portable Applications”

Dr. Luu Nguyen, National Semiconductor — Lunch October.

*

“Carbon Nanotubes: Enhancing Conductivity of Conductive Plastics”

Dana Hammer-Fritzinger, NanoDynamics — Dinner November.

*

“The Future of Printed Circuit Boards”

Robert Tarzwell, Director of Technology, Sierra Proto Express

Dinner December.

*

“Enabling Technologies for Board-Level Optical Interconnects”

Dr. Alexei Glebov, Fujitsu Laboratories of America
Dinner January.

*

“Semiconductor Equipment and Materials Outlook”

Dr. Dan P. Tracy, SEMI
Lunch January.

*

“MultiLayer Ceramic Capacitor (MLCC) Value Drift”

Dr. Daniel N. Donahoe, Exponent Inc, and

“Embedded Passives”

Dr. Nicholas Biunno, Sanmina-SCI
Dinner February.

*

“Restriction of Hazardous Substances Directive (RoHS) Implementation Challenges”

Thomas Ellison, Finisar and

“RoHS: Long-Term Perspective and Legal and Trade Challenges”

John Burke, Optichron
Dinner March.

*

“2005 ITRS Roadmap: Assembly & Packaging”

Dr. Bill Bottoms, Third Millennium Test Solutions, Inc
Lunch March.

*

“Economics of Technology and the Engineering Career”

Dr. Dan Donahoe and Dr. Michelle Poliskie, Exponent (with GOLD group)
Dinner April.

*

“Economics of Technology and the Engineering Career”

Dr. Dan Donahoe, Exponent
Lunch at SJSU April.

*

“Jitter and Signal Integrity Testing at Multiple Gb/s or GHz”

Dr. Mike Li, CTO, Wavecrest
Dinner May.

*

“From Pong to Xbox: Packaging of Video Game Consoles”

Dean Takahashi, San Jose Mercury-News
Dinner May.

*

“Documentation and Instructions Made Easy!?”

Terry Chappell, Chappell Enterprises
Dinner June.


2005/06 Conferences/Symposia:

*

30th International Electronics Manufacturing Technology (IEMT) Symposium

at Moscone Convention Center, San Francisco —
July 11-12, 2005

*

International Symposium on Quality Electronic Design (ISQED)
at the DoubleTree Hotel, San Jose — March 21-23, 2006.



2005/06 Classes:

*

“Communication & Conflict Management Using MBTI”

with Linda Price
— at LSI Logic (Milpitas), August.

*

“Transitioning from Individual Contributor to Manager”

with Roxanna Dunn
— at Cypress Semiconductor (San Jose), August.

*

“Creative Problem Solving”

at LSI Logic, Milpitas, September.

*

“Managing Time & Multiple Priorities”

at Exar Corporation, Fremont, September.

*

“Clear Business, Technical, and E-mail Writing”

at Cypress Semiconductor, San Jose, October.

*

“Memory Power”

at Exar Corporation, Fremont, October.

*

“Clear Business, Technical, and E-mail Writing”

with Kathleen Mohn
— at National Semiconductor (Santa Clara), November.

*

“Transitioning from Individual Contributor to Manager”

with Roxanna Dunn
— at Carl Zeiss Meditec (Dublin), November.

*

“Leadership Skills for Engineers”

with Dr. Andrew Oravets
— at LSI Logic (Milpitas), January.

*

“Clear Business, Technical & E-mail Writing”

with Kathleen Mohn
— at National Semiconductor (Santa Clara), February.

*

“High-Impact Communication”

with Susan Peterson
— at LSI Logic (Milpitas), February.

*

“Memory Power”

with Peter Turla
— at Exar (Fremont), February.

*

“Speed Reading”

with Kathleen Hawkins
— at Carl Zeiss Meditec (Dublin), February.

*

“Working Across Cultures”

with Michael Burns
— at LSI Logic (Milpitas), March.

*

“Advanced IC Packaging Technologies”

  — at Crowne Plaza Hotel,
April.

*

“Creative Problem Solving”

with Michael Burns
— at LSI Logic (Milpitas), April.

*

“Leadership Skills”

with Dr. Andrew Oravets
— at Exar (Fremont), April.

*

Clear Business, Technical and E-Mail Writing”

with Kathleen Mohn
— at Flextronics (San Jose), half-day, May.

*

“Getting Things Done Across Organizational Borders”

with Linda Price
— at Exar Corporation (Fremont), May.

*

“High-Impact Communication”

with Susan Peterson
— at Carl Zeiss Meditec (Dublin), May.

*

“Communication & Conflict Management Using MBTI”

with Linda Price
— at LSI Logic (Milpitas), May.

*

“Managing Time and Multiple Priorities”

with Peter Turla
— at Flextronics (San Jose), half-day June.

*

“Breakthrough Project Management”

with Barry Flicker
— at Flextronics (San Jose), June.

*
Advanced Packaging Technology Solutions for Today’s Leading Edge Microelectronics
   
– Ray Fillion, manager of Advanced Packaging Programs, GE Global Research
— at SF Marriott, July.

*
Design, Materials, Process, and Reliability of Lead-Free Packaging and Assembly
   
– John Lau, Lead-Free Technical Program manager, Agilent Technologies
— at SF Marriott, July.

*
Flip Chip & Wafer Level Packaging — A User’s Guide
   
– Dr. Dev Gupta, CTO, APSTL
— at SF Marriott, July.

*
Carbon Nanotubes Impact the Semiconductors Industry: Properties, Tools, Processes & Applications
   
– Florin Ciontu and Bernard Courtois, TIMA Laboratories
— at SF Marriott, July.

*
Flip Chip & Wafer Level Packaging — A User’s Guide
   
– Dr. Dev Gupta, CTO, APSTL
— at SF Marriott, July.

*
3D Packaging — Developments and Trends
   
– Jan Vardaman and Phil Garrou, TechSearch International
— at SF Marriott, July.

Monthly Technical Meetings:
(2004-2005)
Technical, Professional Skills Development,
and Management Classes (2004-2005):

2004/05 Meetings:

*

“Alternative Packaging Technologies for 3-D Packaging”

Joe Fjelsted, SiliconPipe
September.

*

“3-D Xray Imaging for Advanced Package Failure Analysis”

David Scott, Xradia; and
“µCT Techniques In Combined 2D/3D High Resolution X-ray Systems” Dr. Udo Frank, Feinfocus
October.

*

“The Nanotechnology Frontier: Applications of Nano to Materials and Packaging”
Dr. Anthony Laviano, Managing Director, NANOWorld
Lunch October.

*

“Packaging Challenges in Micro-Optical Electromechanical Systems Components: the DMD as a Case Study”

Dr. Richard Gale, Texas Tech
Dinner November.

*

“Replacing Heat Sinks with Thermally Conductive Substrates — Technology and Tradeoffs”

Three Industry Speakers on StablCor, Thermal Clad and Thermagon
Dinner December.

*

“Optical Fiber Coatings: The State-of-the-Art and the Application of a New Nano-material”

Dr. Ephraim Suhir
Dinner January.

*

“Long Term Trends in Packaging Technology – The International Packaging Roadmap Update”

Joe Adam, Skyworks Inc.
Lunch January.

*

“From Printed Circuit Boards to Substrates: Reflecting on the History of these Technologies”

Bernd Appelt, ASE Europe
Dinner February.

*

“Hi Frequency Fullwave Simulation of Packages”

Dr. An-Yu Kuo, Optimal Corp.
Lunch February.

*

“New, Ultrahigh-Thermal-Conductivity Materials”

Dr. Carl Zweben
Dinner March.

*

“Thinning and Dicing Ultra-thin Wafers”

Mark Brown, Disco Hi-Tec America
lunch March.

*

“RF/Microwave Packaging Technology at Freescale Semiconductor”

Norm Owens – Freescale Semiconductor
changed from a April Dinner meeting April to part of our afternoon RFID seminar that same day.

*

“US Electronics Industry Competitiveness in View of Globalization and Changing Technologies”

Prof. Rao Tummala, Packaging Research Center, Georgia Tech
lunch May.

*

“Shielding Packaging for High Cost Electronics”

Dr. Fabrizio Montauti, Vice President of Engineering, WaveZero
Dinner May.

*

“Reliability Issues in Lead-Free Soldering”

Dr. Dongkai Shangguan, Director – Advanced Process Technology, Flextronics — Dinner June.

*

“Reliability of Lead-free Solder Joints: Intermetallic Reactions”

Prof. King-Ning Tu, Materials Science and Engineering Department, UCLA — Lunch Thursday, July.


2004/05 Conferences/Symposia:

*

Semiconductor Thermal Measurement and Management (SEMI-THERM) Symposium

at the Fairmont Hotel, San Jose —
March 15-17, 2005.

*

International Symposium on Quality Electronic Design (ISQED)

at the Double Tree Hotel, San Jose —
March 21-23, 2005.

*

WESCON

at the Santa Clara Convention Center, Santa Clara —
April 12-14, 2005.



2004/05 Classes:

*

“Mandated Pb-Free Solder Assemblies: Exploring the Transition’s Impact on Product Reliability”

Craig Hillman (U of Maryland),
Jean Paul Clech (EPSI), Dongkai Shangguan (Flextronics)
— at Hewlett Packard (Cupertino),
October.

*

“Transitioning From Individual Contributor to Manager”

with Roxanna Dunn
— at HP (Cupertino), October.

*

“Getting Things Done Across Organizational Borders”

with Dr. Andrew Oravets
— at HP (Cupertino), October.

*

“Breakthrough Project Management”

with Richard Simonds
— at HP (Cupertino), October.

*

“Presentation Skills for Engineers”

with Peter Rosselli
— at VeriSign (Mountain View), November.

*

“Breakthrough Project Management”

with Richard Simonds
— at VeriSign (Mountain View), November.

*

“Presentation Skills for Engineers”

with Peter Rosselli
— at VeriSign (Mountain View), November.

*

“Transitioning From Individual Contributor to Manager”

with Dr. Andrew Oravets
— at Exar (Fremont), December.

*

“Thermal Design and Modeling of IC Packages”

  — at UCSC Extension,
December (half-day), Sunnyvale.

*

“Breakthrough Project Management”

with Richard Simonds
— at VeriSign (Mountain View), January.

*

“Clear Business & Technical Writing”

with Kathleen Mohn
— at Carl Zeiss Meditec (Dublin), February.

*

“Presentation Skills For Engineers”

with Peter Rosselli
— at VeriSign (Mountain View), February.

*

“Communication & Conflict Management using Myers-Briggs (MBTI)”

with Linda Price
— at Carl Zeiss Meditec (Dublin), March.

*
new!

“Writing Effective E-mail Messages”

with Kathleen Mohn
— at Synopsys (Sunnyvale), March.

*

“Getting Things Done Across Organizational Borders”

with Dr. Andrew Oravets
— at Synopsys (Sunnyvale), March.

*

“Packaging Technology for RF and RFID”

  — at Santa Clara Conv’n Center,
April (half-day).

*

“SOP vs SiP, vs SOC: Technology Directions for Systems Implementation”

(Emerging and Disruptive Packaging Technologies for the Next Decade),
Georgia Tech staff — at Ramada Inn, Sunnyvale,
May.

*

“Breakthrough Project Management”

with Barry Flicker
— at LSI Logic (Milpitas), May.

*
new!

“Influential Communication”

with Barry Flicker
— at KLA-Tencor (San Jose), May.

*

“Clear Business, Technical, and E-mail Writing”

with Kathleen Mohn
— at Cypress Semiconductor (San Jose), May.

*

“Breakthrough Project Management”

with Barry Flicker
— at Hewlett-Packard (Cupertino), June.

*

“Introduction to Nanotechnology: Tools, Processes and Applications”

Florin Ciontu and Bernard Courtois, TIMA Laboratories, Grenoble, France
July (half-day).

*

“Introduction to Flip Chip Technology: A User’s Guide”

Dr. Dev Gupta, Chief Technical Officer, APSTL, Scottsdale, AZ
July (half-day).

*

“Design, Materials, Processes, and Reliability of Lead-Free Packaging and Assembly”

Dr. John Lau, Lead-Free Technical Program Manager, Agilent Technologies, Santa Clara
July (half-day).

*

“Advanced Packaging Technology Solutions for Today’s Leading-Edge Microelectronics”

Ray Fillion, manager of Advanced Pkgng Programs, GE Global Research, New York
July (half-day).

*

“Reliability of Lead-free Solder Joints: Intermetallic Reactions, Electromigration, Tin Whiskers”

Prof. King-Ning Tu, Materials Science and Engineering Department, UCLA — Ramada Inn, Sunnyvale,
July (half-day).

Monthly Technical Meetings:
(2003-2004)
Technical, Professional Skills Development,
and Management Classes (2003-2004):

2003/04 Meetings:

*

“Wire Bonding to Advanced Copper, Low-k Integrated Circuits: the
Metal/Dielectric Stacks, and Materials Considerations”

George Harman, NIST
September.

*

“Flexible Automation – Going Where Human Eyes and Fingers Cannot Go”

Charlie Duncheon, Adept Technology
October.

*
Integrated Passives (two talks):
“PARC’s On-Chip Microcoil Inductor,” Dr. Koenraad Van Schuylenbergh, Palo Alto Research Center; and
“3M’s Embedded Capacitor Material for Decoupling,”
Bill Balliette, 3M
November.

*

“Outlook for the Semiconductor Packaging Market for 2004: IC Packaging, SoP, and Testing Directions”

Jim Walker, Dataquest/Gartner Group
December.

*

“OLED Display Technology and Applications”

Homer Antoniadis, OSRAM Opto Semiconductors
January.

*

“Itanium 2 Package Development Tradeoffs”

Kevin Haley, Intel
February.

*

“Semiconductor Packaging: Substrate and Interposer Issues”

Ron Huemoeller, Vice President for Substrate Technology, AMKOR
March.

*

“Packaging & Board Assembly Technology Trends and Their Impact on the Supply Chain”

Donkai Shangguan, Flextronics
April.

*

“Ultra-Small Miniaturization Technology”

Bel Haba, Tessera
May.

*

“High Density Interconnect on Flexible Substrates”

C. Q. Cui, Compass Technology (Hong Kong)
June.


2003/04 Conferences/Symposia:

*

12th Int’l Symposium on Semiconductor Manufacturing (ISSM)

at the Fairmont Hotel, San Jose —
September 30 – October 2, 2003. .

*

Semiconductor Thermal Measurement and Management (SEMI-THERM) Symposium

at the Fairmont Hotel, San Jose —
March 9-11, 2004. .

*

IEEE Int’l Symposium on Quality Electronic Design (ISQED)

at the DoubleTree Hotel, San Jose —
March 23-24, 2004. .

*

Electronic Components and Technology Conference (ECTC)

at Caesar’s Palace Hotel, Las Vegas —
June 1-4, 2004. .

*

International Electronics Manufacturing Technology (IEMT) Symposium

at the Marriott Hotel, San Jose —
July 14-16, 2004. .



2003/04 Classes:

*

“Principles in Wirebonding for Microelectronics”

George Harman — NIST,
September.

*

“Breakthrough Project Management”

with Barry Flicker
— at TIBCO Software (Palo Alto), September.

*

“Collaborative Negotiating”

with Dr. Barry Flicker
— at Philips Semiconductor (San Jose), October.

*

“Presentation Skills for Engineers”

with Peter Roselli
— at Hewlett Packard (Cupertino), October.

*

“Time Management Made Easy”
(half-day)
with Peter Turla
— at Hewlett Packard (Cupertino), October.

*

“Transitioning From Individual Contributor to Manager”

with Dr. Andrew Oravets
— at TIBCO Software (Palo Alto), November.

*

“Breakthrough Project Management”

with Barry Flicker
— at Hewlett Packard (Cupertino), November.

*

“Process Metrics to Improve Results”

with Roxanna Dunn
— at Hewlett Packard (Cupertino), November.

*

“PRINTED CIRCUIT TECHNOLOGY – Materials and Processes”

Joseph Fjelstad — at UCSC Extension (Sunnyvale),
December.

*

“THERMAL TEST METHODS FOR INTEGRATED CIRCUITS”

Bernie Siegal, Thermal Engineering Associates, Inc. — at UCSC Extension (Sunnyvale),
December.

*

“Breakthrough Project Management”

with Barry Flicker
— at Hewlett Packard (Cupertino), February.

*

“Collaborative Negotiating”

with Ed Levine
— at Hewlett Packard (Cupertino), February.

*

“Presentation Skills for Engineers”

with Peter Roselli
— at TIBCO Software (Palo Alto), February.

*

“Clear Business & Technical Writing”

with Kathleen Mohn
— at Sony (San Jose), February.

*

“Experimental Measurements in Thermal Management of Electronic Systems”

Profs. Ortega (UA), Moffat (Stanford), Westphal (WSU), Rhee (SJSU) –
March.

*

“How to Achieve Electromagnetic Compatibility While Solving Thermal Problems”

Dr. Tom Van Doren — March.

*

“Compact Thermal Modeling, Theory and Practice”

Clemens Lasance (Netherlands) and Heinz Pape (Germany) —
March.

*

“Thermomechanical Reliability of Microsystem Packaging”

Prof. Jianmin Qu — March.

*

“Compact Modeling and Analysis for Nanometer-scale CMOS Design”

Speakers from IBM, Georgia Tech, U-Michigan, UC-SD, Purdue, Intel —
March.

*

“Preparing Technical Presentations to Management”

with Roxanna Dunn
— at Sony (San Jose), March.

*

“Boss Talk: Mastering Conversations”

with Dr. Robert Lauridsen
— at Hewlett Packard (Cupertino), April.

*

“Process Metrics to Improve Results”

with Roxanna Dunn
— at Hewlett Packard (Cupertino), April.

*

“Breakthrough Project Management”

with Barry Flicker
— at Hewlett Packard (Cupertino), April.

*

“Virtual Teams: Working Together Apart”

with Barry Flicker
— at WebEx (San Jose), April.

*

“Finance for Engineers”

with Roxanna Dunn
— at Hewlett Packard (Cupertino), May.

*

“MATERIALS ISSUES IN SEMICONDUCTOR PACKAGING”

Dr. Guna Selvaduray, Materials Engineering Department, San Jose State
University,
— at UCSC Extension (Sunnyvale),
June.

*

“Speed Reading”

with Kathleen Hawkins
— at Exar (Fremont), June.

*

“Introduction to Flip Chip Technology — A User’s Guide”

Dev Gupta, APSTL, — at IEMT Symposium,
July (half-day).

*

“Materials, Processes and Defect Recognition for Hybrids, Microcircuits and RF/MMIC Modules”

Tom Green, National Training Center for Microelectronics, — at IEMT Symposium,
July (half-day).

*

“Advanced Packaging Technology Solutions for Today’s Leading Edge Microelectronics”

Ray Fillion, GE Global Research, — at IEMT Symposium,
July 13 (half-day).

*

“Lead-Free Soldering—Metallurgical Fundamentals, Reflow Applications, and Challenges”

Cheng Lee, — at IEMT Symposium,
July (half-day).

*

“Failure Mode Analysis of Flip Chip in Package and Board Assemblies”

Daniel Baldwin, Georgia Tech, — at IEMT Symposium,
July (half-day).

*

“Nano – The Next Technology”

Deb Newberry and Walt Trybula, SEMATECH, — at IEMT Symposium,
July (half-day).

Monthly Technical Meetings:
(2002-2003)
Technical, Professional Skills Development,
and Management Classes (2002-2003):

2002/03 Meetings:

*

“Bow-Free Assemblies for Micro- and Opto-Electronics Applications”

Ephraim Suhir Ph.D

September.

*

“New IC Die-Stacking Developments”
,
Glenn Narvaez, ChipPAC; Dave Tovar, OSE-USA

October.

*

“Testing Mixed-Signal IC’s”

Ed Paulson, LTX; and Guillermo Perez-Vargas, Applied Test Resources

November.

*

“Pushing Out the Limits of Copper”

Joe Fjelstad, SiliconPipe

December.

*

“WLAN Markets and Companies: Upcoming Opportunities”

Satya Chillara, Semiconductor Sector, W. R. Hambrecht

January.

*

“Illumination with LEDs”

Paul Martin, Lumileds

February.

*

“Hey Buddy, Can you Spare a Paradigm?”

(Update on efforts by the JEDEC JC15.1 Thermal Characterization Subcommittee to develop standards for
simulation and test) —
Dr. Bruce Guenin, Sun Microsystems

March.

*

“Mfg.InfoWeb – Information Web Service for Global Manufacturing”

Dr. Ken Ouchi, President, Avidtecs

April.

*

“Modeling and Characterization of Electronic Packaging Materials and Reliability of Products”

Sung Yi, Portland State University
May.

*

“Electronic Manufacturing Service Companies — Still a Growth Segment”

Keith Dunne, RBC Capital,
and Michael Morris, Smith Barney Equity Research —
June.


2002/03 Conferences/Symposia:

*

Electrical Performance of Electronic Packaging (EPEP)

in Monterey, CA —
October 2002. .

*

Semiconductor Thermal Measurement & Management (SEMI-THERM) Symposium

in San Jose, CA —
March 2003.

*

International Electronics Manufacturing Technology (IEMT) Symposium

in San Jose, CA —
July 16-18, 2003.

*

Photonic Devices and Systems Packaging (PhoPack) Symposium

at San Francisco Moscone Center —
August 10-12, 2003. .

*

Photonic Materials Reliability (PhoMat) Symposium

at San Francisco Moscone Center —
August 13-14, 2003. .

*

WESCON 2003

at San Francisco Moscone Center —
August 12-14, 2003. .



2002/03 Classes:

*

“Breakthrough Project Management”

with Barry Flicker
— at TIBCO Software (Palo Alto), October.

*

“Getting Things Done Across Organizational Borders”

with Andrew Oravets
— at Network Appliance (Sunnyvale), October.

*

“Clear Business & Technical Writing”

with Kathleen Mohn
— at TIBCO Software (Palo Alto), October.

*

“Presentation Skills”

with Pater Roselli
— at TIBCO Software (Palo Alto), October.

*

“Reliability Concepts and Practices”

Mike Silverman, Ops A La Carte — at Agilent Technologies (Santa Clara),
October.

*

“Clear Business & Technical Writing”

with Kathleen Mohn
— at TIBCO Software (Palo Alto), November.

*

“Presentation Skills”

with Pater Roselli
— at TIBCO Software (Palo Alto), November.

*

“Process Metrics to Improve Results”

with Roxanna Dunn
— at Hewlett Packard (Cupertino), November.

*

“Challenges in Testing SoC Designs”

Dr. Jacob El-Ziq — at Agilent Technologies (Santa Clara),
November.

*

“Chip Scale Packaging Technology for Modern Electronics”

Joseph Fjelstad — at UCSC Extension (Sunnyvale),
February.

*

“Presentation Skills”

with Peter Roselli
— at Hewlett Packard (Cupertino), February.

*

“Leadership Skills”

with Dr. Andrew Oravets
— at Hewlett Packard (Cupertino), February.

*

“Collaborative Negotiating”

with Dr. Andrew Oravets
— at TIBCO Software (Palo Alto), February.

*

“Clear Business & Technical Writing”

with Kathleen Mohn
— at Hewlett Packard (Cupertino), March.

*

“Getting Things Done Across Organizational Borders”

with Andrew Oravets
— at Philips Semiconductor (San Jose), March.

*

“Process Metrics to Improve Results”

with Roxanna Dunn
— at Hewlett Packard (Cupertino), March.

*

“Transitioning From Individual Contributor to Manager”

with Dr. Andrew Oravets
— at Hewlett Packard (Cupertino), March.

*

“Thermal Design and Modeling of IC Packages”

Dr. Sam Zhao — at UCSC Extension (Sunnyvale),
March.

*

“Transitioning From Individual Contributor to Manager”

with Dr. Andrew Oravets
— at TIBCO Software (Palo Alto), April.

*

“Presentation Skills”

with Peter Roselli
— at Philips Semiconductor (San Jose), May.

*

“Collaborative Negotiating”

with Dr. Barry Flicker
— at Hewlett Packard (Cupertino), May.

*

“Overview of Electronic Interconnects”

Joe Fjelstad — at UCSC Extension (Sunnyvale),
May.

*

“RF Package Test — Measurement and Characterization”

Dr. Scott Wartenberg — at UCSC Extension (Sunnyvale),
June.

*

“Getting Things Done Across Organizational Borders”

with Dr. Andrew Oravets
— at Hewlett Packard (Cupertino), June.

*

“Problem Solving Using Non-Linear Systems Thinking”

with Barry Flicker
— at Philips Semiconductor (San Jose), June.

*

“Flip Chip for Optoelectronics and MEMS”

Dr. Elke Zakel, Germany — at San Jose State University,
July.

*

“Integrated Passives: Technology and Commercialization”

Dr. Richard Ulrich — University of Arkansas, at Moscone
Center, SF
August.

*

“Free Panel: Trends and Opportunities for Integrated Passives”

part of WESCON program — Moscone Center, SF
August.

*

“Photonics Packaging: Critical Component Assembly
and Test Processes”
(full day),
Randy Heyler, Newport Corp, and Stefan Loeffler, Agilent — Moscone Convention Center,
August.

*

“How to Make a Photonic Device Into a Product: Role of Accelerated Life Testing”
(half day),
Dr. Ephriam Suhir, University of Illinois at Chicago and ERS Co. — Moscone Convention Center,
August.

*

“Modeling and Simulations for Photonics Packaging”
(half day),
Dr. E.S. Alber, Tyco/Healthcare, and Dr. Metin Ozen, CFD Research Corp,
— Moscone Convention Center,
August.

*

“Adhesively Bonded Joints in Micro- and Opto-Electronics”
(half day),
Dr. Ephraim Suhir, University of Illinois and ERS Co.
— Moscone Convention Center,
August.

*

“Interfacial and Fracture Issues in Electronics Packaging”
(half day),
Dr. Jianmin Qu, Georgia Tech
— Moscone Convention Center,
August.

*

“Fiber-Optics Structures: Design for Reliability”
(half day),
Dr. Ephriam Suhir, University of Illinois at Chicago and ERS Co.
— Moscone Convention Center,
August.

Monthly Technical Meetings:
(2001-2002)
Technical, Professional Skills Development,
and Management Classes (2001-2002):

2001/02 Meetings:

*

“Plating Processes for IC and Microelectronic Interconnect Applications”

William Sepp,
Technic Inc. —
September (cancelled – see Nov.) .

*

“Innovative Connectors and Sockets”

John Novitsky, FormFactor, and Gabe Cherian, Cherian Enterprises
October, held
this month at WESCON at the San Jose Convention Center!

*

“Plating Processes for IC and Microelectronic Interconnect Applications”

William Sepp,
Technic Inc. —
November.

*

“Preventing Thermal Stress Failures in Microelectronics Packaging”

Dr. Ephraim Suhir,
Iolon, Inc, and IEEE/CPMT Distinguished Lecturer —
December.

*

“Temperature Measurements”
(two talks):
“Liquid Crystal Thermography: An Effective Method for
Die, Package and PCB Temperature Measurement”, and
“Micro-Bolometer Sensor and Infrared Camera Design” —
Kaveh Azar, ATS; Jim Hungerford and Brad Risser, Flir Systems —
January.

*

“Wafer Level Packaging”

Dr. Luu Nguyen,
National Semiconductor —
February.

*

“The JEDEC JC15.1 Thermal Standards
Subcommittee – An Agent for Promoting a Paradigm Shift in Thermal Simulation”

Bruce Guenin, Sun Microsystems —
March.

*

“Emerging Packaging Challenges: The 2002 Semiconductor Packaging Roadmap”

Joseph Adam, Conexant —
April.

*

“System-on-a-Chip: Testing Issues and Approaches”

Dr. Jacob El-Ziq —
May.

*

“An Overview of Microsystems (MEMS) Packaging”

Dr. Tai-Ran Hsu —
June.

2001/02 Conferences/Symposia:

*

Semiconductor Thermal Measurement & Management (SEMI-THERM) Symposium

in San Jose, CA —
March 2002. .

*

Photonic Devices and Systems Packaging (PhoPack) Symposium

at Stanford University, CA —
July 2002. .

*

International Electronics Manufacturing Technology (IEMT) Symposium

in San Jose, CA —
July 2002. .



2001/02 Classes:

*

“System-Level Thermal Design for Electronics Cooling”

Prof. Suhas Patankar, Univ of Minn & Innovative Research, Inc.
September, hands-on thermal modeling class.

*

“Understanding Imaging and Analysis of Thin Film Contamination”

Rob Piercy, Foothills Analytical Laboratory
September.

*

“Breakthrough Project Management”

with Barry Flicker
— at Compaq Computer (Cupertino), October

*

“Presentation Skills for Engineers”

with Peter Rosselli
— at Compaq Computer (Cupertino), October

*

“Manager As Coach”

with Carole Rehbock
— at Compaq Computer (Cupertino), October

*

“Collaborative Negotiating”

with Barry Flicker
— at Space Systems/Loral (Palo Alto), October.

*

“Time Management Made Easy”

with Peter Turla (half-day)
— at Compaq Computer (Cupertino), October.

*

“Breakthrough Project Management”

with Barry Flicker
— at Space Systems/Loral (Palo Alto), November.

*

“Thermal Design and Modeling of IC Packages”

Dr. Sam Z. Zhao, Broadcom Corporation —
November (half-day).

*

“Leadership Skills for Engineers”

with Ed Levine
— at Compaq Computer (Cupertino), November.

*

“Getting Things Done Across Organizational Borders”

with Andrew Oravets
— at Compaq Computer (Cupertino), November.

*

“Getting Things Done Across Organizational Borders”

with Andrew Oravets
— at Brocade Communications (San Jose), December.

*

“Principles of Semiconductor Manufacturing”

Jerry Secrest, Secrest Research —
December (half-day).

*

“Collaborative Negotiating Skills for Engineers”

with Barry Flicker
— at Network Appliance (Sunnyvale), February.

*

“Clear Business & Technical Report Writing for Engineers”

with Kathleen Mohn
— at Tibco Software (Palo Alto), February.

*

“Presentation Skills for Engineers”

with Peter Rosselli
— at Compaq Computer (Cupertino), March, first session.

*
“Materials Issues in Semiconductor Packaging,”
Dr. Guna Selvaduray, Materials Science Dept, SJSU
February (half-day), Sunnyvale.

*

“Breakthrough Project Management”

with Barry Flicker
— at Compaq Computer (Cupertino), March.

*

“Presentation Skills for Engineers”

with Peter Rosselli
— at Compaq Computer (Cupertino), March.

*

“Process Metrics to Improve Results”

with Roxanna Dunn
— at Compaq Computer (Cupertino), May.

*

“Presentation Skills for Engineers”

with Peter Rosselli
— at Compaq Computer (Cupertino), May.

*

“Reliability Concepts and Practices”

Mike Silverman, Ops A La Carte — at Compaq Computer (Cupertino),
May.

*

“BGA Technologies and Design Tradeoffs”

with Dr. Marcos Karnezos, ChipPAC —
June.

*

“Time Management Made Easy”

with Peter Turla (half-day)
— at Network Appliance (Sunnyvale), June.

*

“Flip Chip for Optoelectronics and MEMS”

Dr. Elke Zakel, PacTech, Germany
at Compaq Computer (Cupertino), July.

Monthly Technical Meetings:
(2000-2001)
Technical, Professional Skills Development,
and Management Classes (2000-2001):

2000/01 Meetings:

*

“Packaging Trends in Lightwave Electronics”

with Jeff Montgomery, ElectroniCast,
September

*

“Packaging of Rambus RDRAMs”

with Dr. Bel Haba, Rambus
October

*

“Multimedia Educational Modules in Electronics Packaging”

with Paul Wesling, Compaq/Tandem Div. —
November.

*

“IC Packaging Roadmaps”

with Dave Tovar, IPAC —
December.

*

“Substrate Technology Brings Chip-Like Geometries To Board-Level Dimensions”

with Jack Belani, K&S —
January.

*

SYSTEMS-IN-PACKAGE (SiP) — A New Dimension in Wafer Level Packaging

(one-day symposium, 9AM-5PM) —
February.

*

“No-Lead Solder — Two Somewhat Different Views”

Vern Soberg and Joe Fjelstad —
March.

*

“Flip Chip Package Development at LSI Logic”

Ed Fulcher — LSI Logic
April.

*

“Temperature as a Design Parameter — Taken at the Extremes, LOW and HIGH”

Randall Kirschman Ph.D. — Consulting Physicist
May.

*

“Optical Packaging: Opportunities for the Future”

Thomas S. Tarter,
Senior Thermal Engineer,
Lightwave Microsystems Corporation —
June.



2000/01 Classes:

*

“Understanding Imaging and Analysis of Thin Films and Contamination”

 
September (half-day).

*

“Thermal Design and Modeling of IC Packages”

 
October (half-day).

*

“Breakthrough Project Management”

with Barry Flicker
October.

*

“Leadership Skills for Engineers”

with Andrew Oravets
October.

*

“Clear Business & Report Writing”

with Kathleen Mohn
November.

*

“Concepts In Magnetic Recording”

 
November (half-day), Sunnyvale.

*

“Time Management Made Easy”

with Peter Turla
— at Space Systems/Loral (Palo Alto), November.

*

“Speed Reading”

with Kathleen Hawkins
— at Compaq Computer/Tandem (Cupertino), November.

*

“Collaborative Negotiating”

with Barry Flicker
— at Space Systems/Loral (Palo Alto), November.

*

“Manager As Coach”

with Carole Rehbock
— at Compaq Computer/Tandem (Cupertino), November.

*

“Presentation Skills”

with Pater Roselli
— at Compaq Computer/Tandem (Cupertino), November.

*

“Materials Issues in Semiconductor Packaging”

 
December (half-day), Sunnyvale.

*

“Cooling High-Power Electronics”

 
January (half-day), San Mateo.

*

“Basic ESD Prevention and Control”

 
January (half-day), Sunnyvale.

*

“Chip-Scale Packaging Technology for Modern Electronics”

 
February (half-day), Sunnyvale.

*

“Modern Heat Pipe Technology and Design”

Donald Ernst, Thermacore
March (half-day), Sunnyvale.

*

“Challenges for HDI-MicroVias —
Engineering, Design, Fabrication, and Assembly”

JR Technical Associates

April (half-day), Sunnyvale.

*

“Getting Things Done Across Organizational Borders”

with Andrew Oravets
— at Space Systems/Loral (Palo Alto), February.

*

“Clear Business & Technical Writing”

with Kathleen Mohn
— at Space Systems/Loral (Palo Alto), February.

*

“Leading Effective Meetings”

with Barry Flicker
— at Space Systems/Loral (Palo Alto), March.

*

“Time Management Made Easy”

with Peter Turla
— at Space Systems/Loral (Palo Alto), March.

*

“Speed Reading”

with Kathleen Hawkins
— at Compaq Computer/Tandem (Cupertino), March.

*

“Transition from Individual Contributor to Manager”

with Andrew Oravets
— at Space Systems/Loral (Palo Alto), March.

*

“Leadership Skills for Engineers and Managers”

with Ed Levine
— at Compaq Computer/Tandem (Cupertino), April.

*

“Presentation Skills”

with Pater Roselli
— at Compaq Computer/Tandem (Cupertino), April.

*

“Collaborative Negotiating”

with Barry Flicker
— at Space Systems/Loral (Palo Alto), April.

*

“BGA Technologies Design and Tradeoffs”

 
May (half-day).

*

“Materials Issues in Semiconductor Packaging”

 
June (half-day).

*

“Photonic Communications Device Packaging”

(full day) — in conjunction with SEMICON/West
July 17.

*

“Understanding Flip Chip Technology”

Dr. Elke Zakel, PacTech, Germany
(half day) July.

*

“Cooling High-Power Electronics”

Dr. Avram Bar-Cohen, Univ. of Minnesota
July 18 (half-day), nationwide NTU broadcast.

*

“Presentation Skills for Engineers”

with Peter Rosselli
— at Compaq Computer/Tandem (Cupertino), July.

*

“Leadership Skills for Engineers”

with Ed Levine
— at Compaq Computer/Tandem (Cupertino), July.

Monthly Technical Meetings:
(1999-2000)
Technical, Professional Skills Development,
and Management Classes (1999-2000):

1999/00 Meetings:

*
August:

“Integrated Passives”

Intarsia and CMD

*
September:

“Flip-Chip on Board and MicroBGA — No Way!”

Roger Malmrose, AVEX Electronics

*
October:

“Heat Pipes for Electronics Cooling”

Dr. Boris Yendler, Lockheed Martin; James Lindemuth,
Thermacore International; Dr. Vivek Mansingh, Applied Thermal Technologies

*
November:

“Die Traceability and Defect Analysis”

Jerry Secrest,Secrest Research; Ori Sarfaty, Sagitta; Brad Kinslow, Neocera

*
December:

“Wafer Bumping: Interconnect, Chip-Bonding”

Dr. Scott Graham, Focus Interconnect; Dave Tovar, PacTech

*
January:

“Bio-med MEMS Packaging, plus MEMS Fab Basics”

Moderated by Tink Dempsey Young, VP-Marketing, MEMS Inc.

*
February:

plant tour at CIREXX
for laser drilling

“Laser Microvias” talk
— Dr. Michael Kauf, Excellon Automation

*
March:

“Why Outsourcing IC Assembly is a High-Growth Industry”

Tom Tarter, Director of Packaging Technology, AIT Inc.

*
April:

“Issues in Electronics Cooling”
Moderated by Bernie Siegal, Thermal Engineering Associates, with
Roger Emigh, Advanced Thermal Solutions; William Maltz, Electronic Cooling Solutions;
Sarang Shidore, Flomerics

*
May:

“Wafer Thinning & Die Stacking for Vertical Packaging”

John Reche, Tru-Si; Marc Robinson, Vertical Circuits

*
June:

“Lead-Free – Fantasy or Fact?”

full-day seminar moderated by Dr. Guna Selvaduray, SJSU Materials Science
Department, with a panel of distinguished engineers.


*

“Presentation Skills for Engineers and Managers”

with Peter Rosselli
— at Loral (Palo Alto), January and
at Compaq Computer/Tandem (Cupertino), March.

*

“Breakthrough Project Management”

with Barry Flicker

at Loral (Palo Alto), February.

*

“Time Management Made Easy”

with Peter Turla

at Loral (Palo Alto), February.

*

“Getting Things Done Across Organizational Borders”

with Dr. Andrew Oravets
— at National Univ (Sunnyvale), March.

*

“Managing Change”

with Dr. Andrew Oravets
— at National Univ (Sunnyvale), March.

*

“Leadership Skills for Engineers and Managers”

with Dr. Andrew Oravets
— at Compaq Computer/Tandem (Cupertino), March.

*

“Transitioning from Contributor to Manager”

with Dr. Andrew Oravets
— at Compaq Computer/Tandem (Cupertino), March.

*

“Clear Technical Writing”

with Kathleen Mohn
— at Compaq Computer/Tandem (Cupertino), March.

*

“Collaborative Negotiating”

with Barry Flicker
— at Space Systems/Loral (Palo Alto), March.

*

“Basic ESD Prevention and Control”

with Fred Lack, Interconsal Associates,
half-day class in March.


*

“Understanding Imaging and Analysis of Thin Films and Contamination”
,
half day class in November.

*

“Collaborative Negotiating”
, a 1-day class in
November.

*

“Presentation Skills for Engineers and Managers”
, a 1-day class in
November.

*

“Transitioning from Engineer to Manager”
, a 1-day class in
November.

*

“Leadership Skills for Engineers and Managers”
, a 1-day class in November.

*

“Breakthrough Project Management”
, a 2-day class in November.

*

“Introduction to Modern Semiconductor Packaging”
half-day class in
February.

*

“Leading Effective Meetings”

with Barry Flicker
— at Compaq Computer/Tandem (Cupertino), April.

*

“Manager As Coach”

with Carole Rehbock
— at Compaq Computer/Tandem (Cupertino), April.

*

“Speed Reading”

with Kathleen Hawkins
— at Compaq Computer/Tandem (Cupertino), April.

*

“BGA Technologies and Design Tradeoffs”

with Dr. Marcos Karnezos, ChipPAC —
April.

*

“Chip Scale Packaging Technology for Modern Electronics”

with Joseph Fjelstad, Tessera —
May.

*

“Materials Issues in Semiconductor Packaging”

with Prof. Guna Selvaduray, San Jose State University —
June (half-day), Sunnyvale.

*

“Challenges for HDI Microvias — Engineering, Design, Fabrication, and Assembly”

with Happy Holden, Westwood Associates —
July (half-day), Sunnyvale.

Monthly Technical Meetings:
(1998-99)
Technical, Professional Skills Development,
and Management Classes (1998-99):

1998/99 Meetings:

*
September:

“The Current and Future Role of Failure Analysis”
,
Eugene Hnatek, Tandem Product Evaluation Center, Compaq Computer Corp.

*
October:

“Flip Chip Developments in CSP and BGA Packages”

Pat O’Brien, Director of Flip Chip Programs,
and Peter Elenius, VP of Technology & CTO for Flip Chip Technologies;
PDF version of Slides.

*
November:

“Solutions in Test for CSP”
— Adi Merschon, ISE Labs. Inc

*
December:

“Flip Chip Packaging Assembly Operations at Kyocera America Inc.”

Robert Lanzone, Kyocera America

*
January:

“Flux-Free Process for Placement and Attach of Solder Balls to Wafers,
Flip Chips, and All BGA Packages”


Richard Ramos, Executive Vice President,
Scientific Sealing Technology (Downey, CA)

*
February:

“Alpha Particles, Solder Balls, and Moore’s Law”

Dave Angst, TCAD, Inc.

*
March:

“A Thermal Threesome:
How to Increase Thermal Conductivity and Measure the Results”
— Nancy Mathis, Mathis Instruments; Dan White, Lanxide; and Roger Emigh, Johnson Matthey Electronic Materials.

*
April:

“Packaging MEMS with ICs”

Moderated by Tink Dempsey Young, MEMS Inc.

*
May:

“Wafer-On-Wafer Packaging”

Dave Pederson, FormFactor

*
June:

“A New Compliant Wafer-Level CSP from Tessera”

Bel Haba, Tessera

*
July:

“Bio-med MEMS Packaging, plus MEMS Fab Basics”

Moderated by Tink Dempsey Young, MEMS Inc.

*

“Presentation Skills for Engineers and Managers”
,
a 1-day class in November.

*

“Leadership Skills for Engineers and Managers”
,
a 1-day class in November.

*

“Presentation Skills for Engineers and Managers”
,
a 1-day class in December.

*

“Materials Issues in Semiconductor Packaging”
,
a half-day class in December.

*

“Ball Grid Array Technologies and Design Tradeoffs”
,
a half-day class January.

*

“Concepts in Magnetic Recording”
,
a half-day class, February.

*

“Understanding Imaging and Analysis of Thin Films
and Contamination”
,
a half-day class in March.

*

“Presentation Skills for Engineers and Managers”
,
a one-day class,
3 dates, March-April 1999

*

“Leadership Skills for Engineers and Managers”
,
a one-day class,
two dates, March 1999

*

“Leadership Skills for Engineers and Managers”
,
a one-day class,
March, 1999

*

“Time Management Made Easy”
,
a one-day class,
March, 1999

*

“Breakthrough Project Management”
,
a two-day class,
April, 1999

*

“Presentation Skills for Engineers and Managers”
,
a one-day class,
April, 1999

*

“Negotiating Skills for Engineers and Managers”
,
a one-day class,
April, 1999

*

“Chip-Scale Packaging Technology for Modern Electronics”
,
a half-day class April.

*

“VIRTUAL TEAMS: Getting Things Done Across Organizational Borders”
,
a one-day class,
April, 1999

*

“Introduction to Magnetoresistive Heads”
,
a half-day class May.

Monthly Technical Meetings:
(1997-98)
Technical, Professional Skills Development,
and Management Classes (1997-98):

Past Meetings and Courses last year (1997-98):
1997-98 Meetings:
*
September:

“Designing With Chip Scale Packages”
,
Steve Bird, Owner, PCA Design

*
October:
Tour of 3COM plant; limited attendance,
for 3 afternoon tours.

*
November:

“Packaging for High Speed: the what, how, who and why”
,
Dr. Eric Bogatin, Ansoft Corp.

*
February:

“Roadway to Low Cost Flip Chip Technology”

Dr. Elke Zakel, General Manager. Pac Tech

*
March:

“Two Unique, Space-Saving Packages — Panda Project and
Shellcase”

Phil Rogren, Shellcase, and William Ahearn, Panda Project

*
April:

“Comparing Switching Noise in VSLI Packages”

Dr. Richard Wheeler

*
May:

“Reports of Arrhenius’ Death are Greatly Exaggerated”

Dr. Richard Blish, Advanced Micro Devices

*
June:

“Automated Test Equipment: Thermal Management of High
Speed Systems”

Dr. Sen Hu, LTX Corp.

*

“Negotiating Skills for Engineers”
,
a 1-day class in February.

*

“SMT Solder Joint Reliability: Design,
Manufacture, and Prediction”
,
a half-day class in February.

*

“Basic ESD Prevention and Control”
,
a half-day class in February.

*

“Time Management Made Easy”
,
a 1-day class in February.

*

“Thermal Management and Cooling of Electronic Devices”
,
a half-day class in March.

*

“CMOS Analog Integrated Circuits”
,
a 5-day Georgia Tech class in March.

*

“Project Management”
,
a 2-day class in March.

*

“Running Effective Meetings”
,
a 1-day class in March.

*

“Hands-On Video Streaming”
,
a 1-day class in April.

*

“Web-Based Training: Hands-On”
,
a 1-day class in April.

*

“Management Leadership for Engineers”
,
a 1-day class in April.

*

“Frame Breaking: Outside the Box”
,
a 1-day class in May.

*

“Beating the Competition with Competitive Engineering”
,
a 1-day EMS seminar in May.

*

“Presentation Skills”
,
a 1-day class in May.

*

“Speed Reading for Engineers”
,
a 1-day class in May.

*

“Chip Scale Packaging Technology for Modern Electronics”
,
a half-day class in May.