Package Requirements for High-Speed Systems πŸ—“ πŸ—Ί

β€” SiP solution, enabling technologies, applications, packaging, market segments …

β€” SiP solution, enabling technologies, applications, packaging, market segments …
Presentation Slides: “Package Requirements for High-Speed Systems” (3.7 MB PDF)
Speaker: Dr. Dongkai Shangguan, CMO, STATS ChipPAC
Meeting Date: Thursday, April 28, 2016
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members. students, unemployed, $10 non-members

Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Reservations: 1604l2.eventbrite.com
Summary: System-in-package (SiP) technology has been evolving through the utilization of various packaging technology building blocks to serve the market’s needs, with respect to miniaturization, heterogeneous integration, modularization, and smaller form factor, with the added benefits of lower cost and faster time to-market, as compared with SoC solutions. In this presentation, integration of advanced packaging technologies for the optimum SiP solution will be discussed, and enabling technologies for product solutions will be outlined for different applications and market segments.


Bio: Dr. Dongkai Shangguan is currently the Chief Marketing Officer of STATS ChipPAC, after having served as the Founding CEO of the National Center for Advanced Packaging Co., Ltd. (“NCAP China”). Previously, Dongkai worked for 10 years at the Electronics Operations with Ford Motor Co. in various technical and management functions, and for 11 years at Flextronics as Corporate Vice President of Global Advanced Technology and Engineering Leadership.
Dr. Shangguan, an IEEE Fellow, has served on the IEEE CPMT Society Board of Governors, the IPC Board of Directors, the Advisory Board of the Sustainable Electronics Manufacturing (SEM) Working Group, etc. Dongkai has received a number of recognitions for his contributions to the industry, including the “Outstanding Sustained Technical Contribution Award” from IEEE CPMT, “Leadership Award” from the Sustainable Electronics Manufacturing Working Group, “PresidentÒ€ℒs Award” from IPC, “Total Excellence in Electronics Manufacturing Award” from the Society of Manufacturing Engineers (SME), and the “Soldertec Lead-Free Soldering Award”.
Dongkai received his BS degree in Mechanical Engineering from Tsinghua University, China; Ph.D. degree in Materials from the University of Oxford, U.K.; and MBA degree from the San Jose State University. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama, and is currently a Guest Professor at several universities. Dr. Shangguan has published two books and authored/co-authored 250 technical papers and articles, and has over 20 patents issued.

Package Requirements for High-Speed Systems πŸ—“ πŸ—Ί

β€” SiP solution, enabling technologies, applications, packaging, market segments …

β€” SiP solution, enabling technologies, applications, packaging, market segments …
Speaker: Dr. Wendem T. Beyene, Rambus Inc.
Meeting Date: Tuesday, May 10, 2016
Presentation Slides: “Package Requirements for High-Speed Systems” (3 MB PDF) after meeting
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members. students, unemployed, $10 non-members

Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Reservations: (URL)
Summary: As data rates increase rapidly in high speed systems — such as in SerDes and memory systems — to meet the bandwidth growth required by various applications, the electrical performance of packages has become critical. In addition, the role of new emerging 2.5D and 3D IC packaging platforms with ever-increasing system integration requirements have made the role of packaging even more important. The sources of signal loss, noise coupling and discontinuities in packages must be fully understood and minimized when designing packages. At the same time, the design and development of packages have to meet cost, performance, form factor and reliability goals. In this talk we will examine the key electrical characteristics: signal loss, signal crosstalk, return loss, mode conversion, power integrity and other important factors affecting the bandwidth of high-speed systems. These key performance metrics are discussed using measurement results from various package designs.


Bio: Wendem T. Beyene received his B.S. and M.S. degrees in Electrical Engineering from Columbia University, in 1988 and 1991 respectively, and his Ph.D. degree in Electrical and Computer Engineering from University of Illinois at Urbana-Champaign, in 1997. In the past, he was employed by IBM, Hewlett-Packard, and Agilent Technologies. He is currently a technical director at Rambus Inc. where he is responsible for signal and power integrity of multi-gigabit serial and parallel interfaces.