Upcoming Meetings and Webinars:

Advanced Packaging Trends & Electronic Materials in Era of Digital Transformation -- integration technologies, new applications, trends in 5G, Artificial Intelligence, IoT, autonomous driving ...
ical Google outlook
SEMI World Hdqtrs, Milpitas

Instructions for Speakers

Explore our Past Meeting Topics

Educational Grant Program: Read about winners from SJSU, SF State and UC-Berkeley, and our funding at Ohlone Collge; download our Grant Application Form

Micromouse Packaging Award: prepare for this year’s MicroMouse contest!

Engineering for Female and Underrepresented Students (EFUS) Project: Chapter funding provided to Ohlone College

Support for STEM internships for high school tech students: in cooperation with local Rotary Clubs

Upcoming Conferences and Workshops:

Slides from Recent Talks:

Visualizing the Packaging Roadmap -- ITRS, Moore's Law, innovation, roadmaps, packaging issues, hi-performance computing, solutions ...
SEMI World Hdqtrs, Milpitas
FPGA Heterogeneous Packaging Applications: Trends and Challenges -- HPC, networking, cloud services, automotive, logic/memory integration, thermal, evolution ...
TI Conference Center, Santa Clara
The Road Ahead: Outlook for the Electronics Packaging Industry -- projections for AI, autonomous vehicles, crypto, OSATs, foundries, outlook ...
TI Conference Center, Santa Clara
2D to 3D Package Architectures: Back to the Future -- scaling, heterogeneous integration, impact on power, performance, latency, nomenclature for package architectures, current metrics, projections ...
TI Conference Center, Santa Clara
Trends and Transitions in Semiconductor Packaging -- business models, supply chain, technology requirements, forecast for 2018 and 2019 ...
TI Conference Center, Santa Clara

Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.

About our Chapter:

Officers and Volunteers
Join our ListServ Distribution List to hear about upcoming meetings.