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Dan Donahoe, Ph.D., P.E., is a Managing Engineer in Exponent's
Mechanical Engineering and Materials/Metallurgy practice. Dan has over two
decades of industrial experience working with defense electronics and
commercial electronics. Prior to joining Exponent, he has been employed at
Lockheed, Motorola, Ford Aerospace, Teledyne, Compaq Computer and Iomega,
and the University of Maryland's industry and government sponsored CALCE,
Electronic Products, and Systems Center. His functional assignments include
work as a design engineer, reliability engineer, thermal engineer, manager,
technologist, and scientist. His electronic packaging analysis skills
include thermal analysis, stress and dynamics analysis and failure analysis.
His Ph.D. dissertation on ceramic capacitors included failure analysis work
using the environmental scanning electron microscope (ESEMT), electron
backscatter diffraction (EBSD) and focused ion beam (FIB). He served as an
Associate Editor of the IEEE Transactions on Components and Packaging
Technologies for seven years. He holds a B.S. in General Engineering at
the University of Illinois at Urbana-Champaign, a M.S. in Mechanical
Engineering at the University of Illinois at Urbana-Champaign, an MBA a
Santa Clara University, and a Ph.D. in Mechanical Engineering at the
University of Maryland in College Park. He served for the past two years as
Secretary for the CPMT Santa Clara Valley Chapter.
He can be reached by email, at donahoe@ieee.org.
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