Dan Donahoe

2007 Chair, Santa Clara Valley Chapter, CPMT Society

Dan Donahoe, Ph.D., P.E., is a Managing Engineer in Exponent's Mechanical Engineering and Materials/Metallurgy practice. Dan has over two decades of industrial experience working with defense electronics and commercial electronics. Prior to joining Exponent, he has been employed at Lockheed, Motorola, Ford Aerospace, Teledyne, Compaq Computer and Iomega, and the University of Maryland's industry and government sponsored CALCE, Electronic Products, and Systems Center. His functional assignments include work as a design engineer, reliability engineer, thermal engineer, manager, technologist, and scientist. His electronic packaging analysis skills include thermal analysis, stress and dynamics analysis and failure analysis. His Ph.D. dissertation on ceramic capacitors included failure analysis work using the environmental scanning electron microscope (ESEMT), electron backscatter diffraction (EBSD) and focused ion beam (FIB). He served as an Associate Editor of the IEEE Transactions on Components and Packaging Technologies for seven years. He holds a B.S. in General Engineering at the University of Illinois at Urbana-Champaign, a M.S. in Mechanical Engineering at the University of Illinois at Urbana-Champaign, an MBA a Santa Clara University, and a Ph.D. in Mechanical Engineering at the University of Maryland in College Park. He served for the past two years as Secretary for the CPMT Santa Clara Valley Chapter.

He can be reached by email, at donahoe@ieee.org.