Mudasir Ahmad is currently a Staff Engineer at Cisco Systems, Inc. He is in the Component Quality and Technology Team, where he has been involved with microelectronics packaging design and reliability analysis for 10 years. He received his B.S. degree (magna cum laude) in Mechanical Engineering from Ohio University in 1999 and his M.S. degree in Mechanical Engineering from Georgia Institute of Technology, Atlanta, GA in 2001. He is currently pursuing his Masters in Management Science & Engineering at Stanford.
His research interests include thermomechanical stress modeling, interfacial delamination, fracture mechanics and thermal design of electronic systems.
At Cisco, Mudasir is leading the Center of Excellence for Numerical Analysis, focused on developing new analytical solutions, experimental design and reliability characterization of strategic next generation BGA and System-in-Package Modules, Pb free conversion, design for reliability and mechanical testing of Printed Circuit Board Assemblies. Mudasir actively participates in various industry technical consortia: iNEMI, JEDEC, IPC, HDPUG and IMAPS. He has over 20 publications on microelectronic packaging, two book chapters, and 6 US Patents. More details can be found here.
Mudasir can be reached by email, at email@example.com.
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