Title:
"Cooling High-Power Electronics"
with Dr. Avram Bar-Cohen, Univ. of Minnesota

INFORMATION:
Register using the form below. Contact Paul Wesling by email, or at (408) 285-9555.

OVERVIEW:
The IEEE’s nation-wide short course on thermal design is coming to the Bay Area in early January (2001). Entitled "Cooling High-Power Electronic Equipment", it is taught by Prof. Avram Bar-Cohen of the University of Minnesota. His name is quite familiar to package and system designers world-wide, and this is a chance to take a "short course" from him, followed by a far-ranging discussion and question-and-answer session. Don’t miss this opportunity!

This course will open with a brief review of heat transfer fundamentals and the range of thermal resistances associated with various conventional cooling approaches. Attention will then be turned to ways of achieving enhanced cooling capability using advanced heat sinks for natural and forced convection, air jet impingement, heat pipes, water-cooled cold plates, pool boiling and spray cooling with dielectric liquids, and vapor compression, as well as thermoelectric (solid-state) refrigeration.

The course is being taped for a later broadcast over the National Technological University (NTU) Network; Therefore, we won't be allowing questions/answers during the lecture portion of the class; however, you will have access to the presentor at lunchtime, and also for the planned Q&A session during the final hour. If you can’t make the "live" class on January 10, your company can sign up for the tape-delayed nationwide satellite broadcast on January 24th. VHS tape copies of the broadcast are also being made available. Contact Janet Morgan at (408) 996-8087 for information about the NTU broadcast or the tapes.

WHO SHOULD ATTEND:
Packaging engineers, system engineers, thermal and mechanical engineers, design, process, failure analysis, and reliability engineers.

OUTLINE:

Hour 1 Cooling Requirements for High-Power Electronic Equipment SIA/NEMI Roadmap Emerging Telecom Needs Review of Heat Transfer Fundamentals Modes of Heat Transfer (conduction, interfaces, convection, radiation, fins) Governing Equations Example 1: Convection-Cooled PCB Thermal Ohms Law Thermal Resistance Relations Typical Thermal Resistances Example 2: Cooling a Populated PCB Conventional Cooling Techniques Examples of Implementation Attributes and Limitations Hour 2 Parallel-Plate Heat Sink Design Modeling Performance of Fin Arrays Example 3: Natural Convection Heat Sink Optimum Thickness Plate Fins Optimum Fin Spacing Optimum Heat Sink Design Guidelines Example 4: Optimal Heat Sinks Air Jet Impingement Cooling Fundamental Heat Transfer Relations Parametric Sensitivities Design Guidelines

Hour 3 Example 5: Jet Impingement Cooling Water-Cooled Cold Plates Fundamental Heat Transfer Relations Design Guidelines Example 6: Cold Plate Heat-Pipe Heat Spreaders Fundamental Heat Transfer Relations Commercial Hardware Typical Performance Range Pool Boiling Heat Transfer Fundamental Heat Transfer Relations Boiling in Dielectric Liquids Example 7: Immersion Cooled Chip Hour 4 Spray Evaporative Cooling Fundamental Heat Transfer Relations Parametric Sensitivities Design Guidelines Vapor Compression and Thermoelectric Refrigeration Theoretical Cycles Commercial Hardware Typical Performance Ranges Example 8: Refrigeration Cooled Microprocessor

ABOUT THE INSTRUCTOR:
Dr. Avram Bar-Cohen is Professor of Mechanical Engineering and Director of the Laboratory for the Thermal Management of Electronics at the University of Minnesota. For more than 30 years he has been involved in the design, analysis, and optimization of electronic cooling systems for electronic and telecommunication equipment.

Avram Bar-Cohen is co-author of "Design and Analysis of Heat Sinks" (1995) and "Thermal Analysis and Control of Electronic Equipment" (1983) and has co-edited eight books in this field. He is also the editor of the IEEE TRANSACTIONS on COMPONENTS AND PACKAGING TECHNOLOGIES.