Please Post and Circulate, through May 21.
About This Short Course series
Course Overview
About the Instructor
How to Register
LOCATION:
UC Extension, 1180 Bordeaux Drive, Sunnyvale,
near Highway 237 & Mathilda
Print out
the map to the UCSC site.
SPONSOR:
The Institute of Electrical and Electronics Engineers:
the
Components, Packaging, and Manufacturing Technology
Society Chapter.
COST:
IEEE Members: $225; Non-Members: $249
includes class handbook, lunch and refreshments.
INFORMATION:
Contact
Dr. Bob Dubin (650) 592-0315.
OVERVIEW:
Microprocessors have been described as the brains of electronics. If so, then the electronic interconnections that serve them must by analogy represent the nervous and circulatory systems that are required to keep it fueled. In truth, electronic interconnections technologies are a vital part of every electronic system playing key roles at every level of the interconnection hierarchy. How those interconnections are made at each different level will significantly impact the cost and performance of an electronic product. This short course will examine the world of electronic interconnections from the chip to the power line, stopping at each level of the electronics pyramid and exploring the interconnection options available at each level. The class lecture will touch on a great many of the various permanent (e.g. wire bonding and soldering) and separable (e.g. socket and connectors) interconnection technologies available and in use today including: IC packages, printed circuits (rigid, flexible and high density/microvia), integrated/embedded passives, sockets (test and production), backplanes, cables and connectors. Included is a brief review of the most recent members of the electronic interconnection family, wireless interconnections.
WHO SHOULD ATTEND:
This short but comprehensive overview of electronic interconnections is both general and specific enough to meet the needs of both the industry newcomer who needs to "get the lay of the land" and the seasoned veteran or specialist who simply wants to "take another look" at the emerging options in search of synergistic opportunities. Others who will benefit include product and project managers, electronic packaging engineers, and those involved in electronic system design.
TOPICS:
ABOUT THE INSTRUCTOR:
Joseph Fjelstad, a co-founder of Silicon Pipe, has been involved in the electronics interconnection industry for over 30 years in the development of manufacturing technologies for rigid and flexible PCBs and IC packaging, holding more than 70 US patents in the field. He has published numerous technical articles, several books on electronics manufacturing and interconnection technologies, and is a regular columnist for Circuitree and Global SMT and Packaging magazines.
Follow this link for information on the instructor's latest book on CSP.
FEES: IEEE Members: $225
other attendees: $249
(includes class handbook, lunch, and refreshments)
Checks or P.O.s should be made payable to "IEEE/CPMT"
and sent with the completed registration form below to:
J. R. Technical Assoc.
PO Box 5183
Belmont, CA 94002
For credit card payment, please use our secure PayPal account:
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REGISTRATION FORM
OVERVIEW OF ELECTRONIC INTERCONNECTIONS
Wednesday, May 21, 2003, Noon - 5 PM
EMAIL your Registration Form to: myregistration@pacbell.net
---Copy to: jrtech@pacbell.net
---Include "C-5-21-03 REGISTRATION" in the Subject
---Send payment later
Or: Call Dr. Bob Dubin for more Information: (650) 592-0315
Mail Payment With A Copy Of Your Registration Form To:
J.R. Technical Associates, Attention: Short Course Registrations
PO Box 5183, Belmont, CA 94002
Make Checks and Purchase Orders payable to "IEEE-CPMT".
Credit Card Payments Accepted Only Through our Online PayPal Account (above)
--Email your Registration Form to: myregistration@pacbell.net
--Forward a copy of your PayPal receipt to: myregistration@pacbell.net
Payment due by 5PM Friday before class. CHECKS PREFERRED.
NAME________________________ COMPANY________________________
ADDRESS__________________________ JOB TITLE___________________
CITY_____________________STATE__________ZIP____________________
Phone______________ Include FAX# for Confirmation______________
Email_______________________________________________
Manager's Name ___________________ Manager's Email: ___________
Payment by:
Check #_____________ PayPal____________________ P.O._________
Amount $________ IEEE# ________________ (Required For Discount)
If you can't attend, what about a Team Member?
C-5-21-03
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