An IEEE Short Course in the S. F. Bay Area

Title:
"MATERIALS ISSUES IN SEMICONDUCTOR PACKAGING"
with Dr. Guna Selvaduray, Professor, Materials Engineering Department, San Jose State University

Please Post and Circulate, through June 30, 2004

About This Short Course series
Course Overview
About the Instructor
How to Register

LOCATION:
UCSC Extension, 1180 Bordeaux Drive, Sunnyvale, near Highway 237 & Mathilda
Print out the map to the UCSC site.

SPONSOR:
The Institute of Electrical and Electronics Engineers: the Components, Packaging, and Manufacturing Technology Society Chapter.

COST:
IEEE Members: $225; Non-Members: $249
includes class handbook, lunch and refreshments.

INFORMATION:
Contact Dr. Bob Dubin (650) 592-0315.

OVERVIEW:
The long-term reliability of semiconductors is affected by the properties of materials used in the packaging design. This short course covers the basic materials science issues related to semiconductor packaging, including the following: metals, polymers, ceramics, types of substrates and their characteristics, moisture absorption and moisture intrusion in polymer packages, popcorning, wetting and solderability, die attach materials, adhesion and bonding, intermetallic compound formation, and corrosion in microelectronics. Participants are encouraged to bring along their technical questions for discussion.

WHO SHOULD ATTEND:
Design and electronic packaging engineers, design, process, failure analysis, and reliability engineers, field support personnel, marketing personnel, and others who evaluate present packages and influence future electronic packaging decisions in their companies.

TOPICS:

• Substrate Materials, Encapsulants, and Thermal Properties
  • Ceramics, Laminates, Advanced Materials, and Polymers
• Intermetallic Compound Formation and Corrosion Problems
  • Where, How, and Why They Form
• Solder Balls and Lead-Free Solders
  • New alloys and Capabilities, Solder Ball Technology
• Materials Testing Methods
  • Mechanical, Electrical, Chemical

ABOUT THE INSTRUCTOR:
Dr. Guna Selvaduray, Professor, Materials Engineering Department, San Jose State University, has been an active researcher in semiconductor packaging issues and has published research papers on these topics. He initiated a graduate program in Microelectronic Packaging at SJSU and has received industry and government research grants to support his work.

HOW TO REGISTER:

         FEES:      IEEE Members:         $225  
                    other attendees:      $249
     (includes class handbook, lunch, and refreshments)
  Checks or P.O.s should be made payable to "IEEE/CPMT"
  and sent with the completed registration form below to:
                      Attention: Short Course Registrations
                    J. R. Technical Assoc. 
                    PO Box 5183
                    Belmont, CA 94002

Limited Seating.  Register by EMAIL NOW to reserve your seat!
Your registration will be CONFIRMED when payment is received.
Checks and Purchase Orders should be made out payable to "IEEE-CPMT".
Credit Card Payments Through PayPal Only -- see below.

Registration for IEEE Members ($225):
Registration for Non-Members ($249):

--------------------------------------------------------------------------
                         REGISTRATION FORM
            MATERIALS ISSUES IN SEMICONDUCTOR PACKAGING
              Wednesday, June 30, 2004   Noon - 5 PM

  EMAIL your Registration Form to: myregistration@pacbell.net
    ---Copy to: bobdubin@pacbell.net
    ---Include "C-06-30-04 REGISTRATION" in the Subject line
    ---Send payment later
  Or: Call Dr. Bob Dubin for more Information: (650) 592-0315

  Mail Payment With A Copy Of Your Registration Form To:
  J.R. Technical Associates, Attention: Short Course Registrations 
       PO Box 5183, Belmont, CA 94002
  Make Checks and Purchase Orders payable to "IEEE-CPMT".

Credit Card Payments Accepted Only Through our Online PayPal Account (above)
  --Email your Registration Form to:  myregistration@pacbell.net 
  --Forward a copy of your PayPal receipt to:  myregistration@pacbell.net

  Payment and cancellation refund requests due by 5PM Friday before class.
  Substitute attendees accepted anytime.  

NAME________________________   COMPANY________________________

ADDRESS__________________________ JOB TITLE___________________

CITY_____________________STATE__________ZIP____________________

Phone______________ Include FAX# for Confirmation______________

Email_______________________________________________

Manager's Name ___________________ Manager's Email: ___________

Payment by:
Check #_____________  PayPal____________________  P.O._________

Amount $________ IEEE# ________________ (Required For Discount)

              If you can't attend, what about a Team Member?
                                                        C-063004