Title:   "Nanotechnology Applications in Packaging"
with Florin Ciontu (France), NanoSPRINT

Please Post and Circulate, through Oct. 1, 2007

LOCATION:
Holiday Inn San Jose
1740 North First Street, San Jose

SPONSOR:
The Institute of Electrical and Electronics Engineers: the Components, Packaging, and Manufacturing Technology Society Chapter.

COST:
IEEE Members: $300 for half-day Course; $450 for full day (2 Courses)
Non-Members: $350 for half-day Course, $500 for full day (2 Courses)
See descriptions of all 7 Courses in the Advance Program.
REGISTER at our on-line registration site, or use the printed Symposium Advance Program form.

OVERVIEW:
This course provides a strategic-level update on areas of nanotechnology research likely to impact semiconductor packaging. The course first introduces fundamental nanotechnology concepts such as carbon nanotubes and nanoparticles and then focuses on potential solutions to three industry issues facing advanced semiconductor packaging: heat-dissipation, low-temperature assembly and IC/package stress.

For each solution, the instructor reviews emerging technology options in terms of performance, relevant physical mechanisms, advantages, and the activities of the leading research groups. Where appropriate, the discussion includes profiles of existing nanotechnology start-ups and their approaches.

The tutorial ends with a comparative discussion of technology readiness levels and patenting activity for the solutions previously presented. A detailed analysis of the most active players and a discussion of the most appropriate strategies for getting involved in this area completes the tutorial.

Course Outline:

Introduction
• Opportunities in nanotechnology
      Review of critical scales and associated phenomena
      Paradigm shifts introduced by nanotechnology
• Fundamental concepts: carbon nanotubes, nanoparticles, nanowires, etc.
  Heat-Dissipation solutions
• Thermal Interface Materials
      Vertically-grown carbon nanotubes
      Nanotube and nanoparticle composites
• Microchannel coolers
      Integrated carbon nanotubes
  Low-temperature assembly
• Low-reflow-point solders
      Nanoparticle-based solders
• Conductive Adhesives
      Wet-adhesives using metal nanopowders
      Wet-adhesives reinforced by carbon nanotubes
      Dry-adhesives using carbon nanotubes
  Thermo-mechanical fatigue and IC/package stress
• Reinforced Solders
• Nanotube-reinforced joints
• Nanoparticle reinforced solders
  Conclusion
• Comparative analysis of the technology readiness levels of different solutions
• Analysis of the most active players
• Discussion of partnerships, strategies and technology transfer opportunities

ABOUT THE INSTRUCTOR:
Florin Ciontu, President of NanoSPRINT (a leading provider of technology intelligence for nanotechnology professionals), pursued research at TIMA Labs in Grenoble, France where he initiated and coordinated a program focusing on nanotechnology. Prior to TIMA, Florin developed algorithms for implementing on-chip fault tolerance to radiation effects at iRoC Technologies. Florin holds a CS Engineer Diploma from "Polytechnica" University of Bucharest and participates in a variety of programs focusing on contributions of technology to sustainable socio-economic development.

NanoSPRINT spun out of TIMA Labs, with Florin as one of the founders, to develop proprietary tools facilitating extensive analysis of specific areas in terms of technological developments, players involved in the field and funding sources. For the past three years, NanoSPRINT has organized NanoTRANSFER – the Nanotechnology Transfer Executive Summit in Europe.